Thermal management system controlling dynamic and steady state thermal loads
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
F25B-001/00
F25B-009/00
F25B-001/10
F25B-011/02
F25B-025/00
F25B-041/00
F25B-049/02
F25B-005/02
F25B-040/00
F25B-041/04
출원번호
US-0010296
(2016-01-29)
등록번호
US-10132529
(2018-11-20)
발명자
/ 주소
Vaisman, Igor
Gagne, Steve T.
Burkholder, Kyle
출원인 / 주소
Rolls-Royce Corporation
대리인 / 주소
Fishman Stewart PLLC
인용정보
피인용 횟수 :
0인용 특허 :
26
초록▼
A thermal management system includes a closed dynamic cooling circuit, and a closed first steady-state cooling circuit. Each circuit has its own compressor, heat rejection exchanger, and expansion device. A thermal energy storage (TES) system is configured to receive a dynamic load and thermally cou
A thermal management system includes a closed dynamic cooling circuit, and a closed first steady-state cooling circuit. Each circuit has its own compressor, heat rejection exchanger, and expansion device. A thermal energy storage (TES) system is configured to receive a dynamic load and thermally couple the dynamic cooling circuit and the first steady-state cooling circuit. The dynamic cooling circuit is configured to cool the TES to fully absorb thermal energy received by the TES when a dynamic thermal load is ON, and the steady-state cooling circuit is configured to cool the TES when the dynamic thermal load is OFF.
대표청구항▼
1. A thermal management system, comprising: a closed dynamic trans-critical cooling circuit having a respective compressor, heat rejection heat exchanger, and expansion device; anda closed first steady-state trans-critical cooling circuit having a respective compressor, heat rejection heat exchanger
1. A thermal management system, comprising: a closed dynamic trans-critical cooling circuit having a respective compressor, heat rejection heat exchanger, and expansion device; anda closed first steady-state trans-critical cooling circuit having a respective compressor, heat rejection heat exchanger, and expansion device;a thermal energy storage (TES) system configured to receive a dynamic load and thermally couple the dynamic trans-critical cooling circuit and the first steady-state trans-critical cooling circuit;wherein: the dynamic trans-critical cooling circuit is configured to cool the TES to absorb thermal energy received by the TES when a dynamic thermal load is ON;the first steady-state trans-critical cooling circuit is configured to cool the TES when the dynamic thermal load is OFF; andthe trans-critical cooling circuits include CO2 as a refrigerant. 2. The system as claimed in claim 1, further comprising: a closed second steady-state trans-critical cooling circuit having a respective compressor, expansion device, and evaporator;wherein the evaporator for the second steady-state trans-critical cooling circuit is configured to receive a steady-state thermal load. 3. The system as claimed in claim 2, wherein the first and second trans-critical steady-state cooling circuits are combined and operate with a common heat rejection heat exchanger. 4. The system as claimed in claim 2, further comprising a controller configured to operate the dynamic trans-critical cooling circuit based on the dynamic thermal load and to operate the first and second steady-state circuits based on steady-state thermal loads. 5. The system as claimed in claim 2, wherein each expansion device expands the refrigerant at a constant enthalpy. 6. The system as claimed in claim 5, wherein at least one expansion device is an expander mechanically coupled with a respective compressor. 7. The system as claimed in claim 2, wherein at least one of the first and second steady-state trans-critical cooling circuits includes a hot gas bypass valve (HGBV) at an outlet to a respective compressor, and the HGBV is positioned to divert hot gas from the respective compressor to a respective low pressure side. 8. The system as claimed in claim, 2, wherein at least one of the trans-critical cooling circuits includes a receiver that operates as storage for a redundant refrigerant charge. 9. The system as claimed in claim 2, wherein the evaporator for the second steady-state trans-critical cooling circuit is configured to receive the steady-state thermal load via a fluid circulating between its evaporator and at least one object generating a steady-state thermal load. 10. The system as claimed in claim 1, wherein the TES includes a phase change material. 11. The system as claimed in claim 1, wherein the TES is configured to receive the dynamic thermal load via a fluid circulating between the TES and at least one object generating the dynamic load. 12. The system as claimed in claim 11, wherein the fluid is condensed contacting the TES and at least portion of the fluid evaporates contacting the thermal load. 13. The system as claimed in claim 1, wherein a low pressure sensor at the low pressure side of the dynamic vapor cycle system shuts down the dynamic trans-critical cooling circuit when the TES material solidifies. 14. The system as claimed in claim 1, wherein a solenoid valve upstream to the evaporator and a check valve at the compressor discharge side prevents fluid interaction between the evaporator and the rest of the system when the dynamic trans-critical cooling system is OFF. 15. The system as claimed in claim 1, wherein at least one trans-critical cooling circuit is a multi-evaporator system. 16. The system as claimed in claim 1, wherein at a least one component of the cooling system is integrated with a turbine engine. 17. The system as claimed in claim 1, wherein at a least one component of the cooling system is integrated with an aircraft. 18. A method of operating a thermal management system, comprising: thermally coupling a dynamic trans-critical cooling circuit with a steady-state trans-critical cooling circuit via a thermal energy storage (TES) system, wherein each of the cooling circuits has a respective compressor, heat rejection exchanger, and expansion device;receiving a dynamic load in the TES;cooling the TES to absorb thermal energy by the TES when the dynamic thermal load is ON; andcooling the TES with the steady-state cooling circuit when the dynamic thermal load is OFF. 19. The method of claim 18, further comprising receiving a steady-state thermal load in an evaporator, wherein the evaporator is in a second steady-state trans-critical cooling circuit having a respective compressor, heat rejection exchanger, expansion device, and the evaporator.
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이 특허에 인용된 특허 (26)
Brenan Anthony M. (Salisbury GB2), Apparatus for and method of transferring heat.
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Eisenhower, Bryan; Park, Christopher G.; Kang, Pengju; Finn, Alan; Sienel, Tobias, Supercritical pressure regulation of vapor compression system by regulation of adaptive control.
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