Tamper-respondent assemblies and methods of fabrication are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes, for instance, a tamper-respondent sensor having at least one flexible layer and paired conductive lines di
Tamper-respondent assemblies and methods of fabrication are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes, for instance, a tamper-respondent sensor having at least one flexible layer and paired conductive lines disposed on the at least one flexible layer. The paired conductive lines form, at least in part, at least one tamper-detect network of the tamper-respondent sensor. The tamper-respondent electronic circuit structure further includes monitor circuitry electrically connected to the paired conductive lines to differentially monitor the paired conductive lines for a tamper event. In enhanced embodiments, multiple interconnect vias electrically connect to two or more layers of paired conductive lines and are disposed in an unfolded interconnect area of the tamper-respondent sensor when the sensor is operatively positioned about an electronic component or assembly to be protected.
대표청구항▼
1. A tamper-respondent assembly comprising: a tamper-respondent electronic circuit structure, the tamper-respondent electronic circuit structure comprising: a tamper-respondent sensor comprising: at least one flexible layer; andpaired conductive lines disposed on the at least one flexible layer and
1. A tamper-respondent assembly comprising: a tamper-respondent electronic circuit structure, the tamper-respondent electronic circuit structure comprising: a tamper-respondent sensor comprising: at least one flexible layer; andpaired conductive lines disposed on the at least one flexible layer and forming, at least in part, at least one tamper-detect network of the tamper-respondent sensor, the paired conductive lines comprising matching conductive lines, the matching conductive lines comprising a first conductive line and a second conductive line, the first conductive line and the second conductive line being, at least in part, parallel conductive lines with one or more electrical characteristics that are identical; andmonitor circuitry electrically connected to the matching conductive lines to differentially monitor over time the matching conductive lines for a tamper event, the monitor circuitry being configured to differentially compare the one or more electrical characteristics of the first conductive line and the second conductive line to monitor for occurrence of a difference in the one or more electrical characteristics between the first and second conductive lines, the difference being representative of the tamper event. 2. The tamper-respondent assembly of claim 1, wherein the paired conductive lines are disposed on the at least one flexible layer in a serpentine pattern, and the first and second conductive lines being are adjacent, matching conductive lines disposed on the at least one flexible layer in the serpentine pattern. 3. The tamper-respondent assembly of claim 2, wherein the first and second conductive lines each have a line width W1≤200 μm, and a line-to-line spacing width Ws≤200 μm. 4. The tamper-respondent assembly of claim 1, wherein the paired conductive lines comprise multiple sets of paired conductive lines disposed on the at least one flexible layer. 5. The tamper-respondent assembly of claim 4, wherein the paired conductive lines comprise at least two layers of paired conductive lines disposed on the at least one flexible layer of the tamper-respondent sensor. 6. The tamper-respondent assembly of claim 5, wherein a first set of paired conductive lines forms at least part of a first layer of paired conductive lines of the at least two layers of paired conductive lines, and a second set of paired conductive lines forms at least part of a second layer of paired conductive lines of the at last two layers of paired conductive lines, the first and second sets of paired conductive lines each comprising matching conductive lines. 7. The tamper-respondent assembly of claim 6, wherein the first set of paired conductive lines and the second set of paired conductive lines are each disposed in respective serpentine patterns on the least one flexible layer, the respective serpentine patterns of the first and second layers of paired conductive lines being oriented in different directions. 8. The tamper-respondent assembly of claim 1, wherein the paired conductive lines comprise at least two layers of paired conductive lines disposed on the at least one flexible layer of the tamper-respondent sensor, and the tamper-respondent sensor further comprises multiple interconnect vias electrically connected to the at least two layers of paired conductive lines, the multiple interconnect vias being disposed in an unfolded interconnect area of the tamper-respondent sensor when the tamper-respondent sensor is operatively positioned about at least one electronic component to be protected. 9. The tamper-respondent assembly of claim 8, wherein the unfolded interconnect area of the tamper-respondent sensor comprises a fan-out region of the paired conductive lines between an interconnect flex cable of the tamper-respondent sensor and a tamper-detect area of the tamper-respondent sensor. 10. The tamper-respondent assembly of claim 8, further comprising an electronic enclosure, the electronic enclosure enclosing, at least in part, the at least one electronic component to be protected, and the tamper-respondent sensor being coupled to the electronic enclosure to facilitate defining a secure volume about the at least one electronic component to be protected. 11. The tamper-respondent assembly of claim 10, wherein the tamper-respondent sensor wraps around the electronic enclosure, and the unfolded interconnect area of the tamper-respondent sensor is an overlapped area of the tamper-respondent sensor when the tamper-respondent sensor is, in operative position, wrapped over the electronic enclosure. 12. The tamper-respondent assembly of claim 10, wherein the tamper-respondent sensor is a first tamper-respondent sensor, and the tamper-respondent electronic circuit structure further comprises a second tamper-respondent sensor, the first tamper-respondent sensor and the second tamper-respondent sensor being coupled to and covering, at least in part, an inner surface of the electronic enclosure to facilitate defining the secure volume about the at least one electronic component to be protected, the unfolded interconnect area of the tamper-respondent sensor being an overlapped area of the first tamper-respondent sensor when the first and second tamper-respondent sensors are coupled to the inner surface of the electronic enclosure. 13. A tamper-respondent assembly comprising: an electronic enclosure surrounding, at least in part, at least one electronic component to be protected; anda tamper-respondent electronic circuit structure associated with the electronic enclosure, the tamper-respondent electronic circuit structure comprising: a tamper-respondent sensor comprising: at least one flexible layer; andpaired conductive lines disposed on the at least one flexible layer and forming, at least in part, at least one tamper-detect network of the tamper-respondent sensor, the paired conductive lines comprising matching conductive lines, the matching conductive lines comprising a first conductive line and a second conductive line, the first conductive line and the second conductive line being, at least in part, parallel conductive lines with one or more electrical characteristics that are identical; andmonitor circuitry electrically connected to the matching conductive lines to differentially monitor over time the matching conductive lines for a tamper event, the monitor circuitry being configured to differentially compare the one or more electrical characteristics of the first conductive line and the second conductive line to monitor for occurrence of a difference in the one or more electrical characteristics between the first and second conductive lines, the difference being representative of the tamper event. 14. The tamper-respondent assembly of claim 13, wherein the paired conductive lines comprise at least two layers of paired conductive lines disposed on the at least one flexible layer of the tamper-respondent sensor, and wherein a first set of paired conductive lines forms at least part of a first layer of paired conductive lines of the at least two layers of paired conductive lines, and a second set of paired conductive lines forms at least part of a second layer of paired conductive lines of the at last two layers of paired conductive lines, the first and second sets of paired conductive lines each comprising matching conductive lines. 15. The tamper-respondent assembly of claim 13, wherein the paired conductive lines are disposed on the at least one flexible layer in a serpentine pattern, and the first and second conductive lines are adjacent, matching conductive lines disposed on the at least one flexible layer in the serpentine pattern. 16. The tamper-respondent assembly of claim 15, wherein the first and second conductive lines each have a line width W1≤200 μm, and a line-to-line spacing width Ws≤200 μm. 17. The tamper-respondent assembly of claim 13, wherein the paired conductive lines comprise at least two layers of paired conductive lines disposed on the at least one flexible layer of the tamper-respondent sensor, and the tamper-respondent sensor further comprises multiple interconnect vias electrically connected to the at least two layers of paired conductive lines, the multiple interconnect vias being disposed in an unfolded interconnect area of the tamper-respondent sensor when the tamper-respondent sensor is operatively positioned about at least one electronic component to be protected. 18. The tamper-respondent assembly of claim 17, wherein the tamper-respondent sensor wraps around the electronic enclosure, and the unfolded interconnect area of the tamper-respondent sensor is an overlapped area of the tamper-respondent sensor when the tamper-respondent sensor is, in operative position, wrapped over the electronic enclosure. 19. The tamper-respondent assembly of claim 17, wherein the tamper-respondent sensor is a first tamper-respondent sensor, and the tamper-respondent electronic circuit structure further comprises a second tamper-respondent sensor, the first tamper-respondent sensor and the second tamper-respondent sensor being coupled to and covering, at least in part, an inner surface of the electronic enclosure to facilitate defining the secure volume about the at least one electronic component to be protected, the unfolded interconnect area of the tamper-respondent sensor being an overlapped area of the first tamper-respondent sensor when the first and second tamper-respondent sensors are coupled to the inner surface of the electronic enclosure.
Verrier Philippe (Le Port Marly FRX) Poulenard Roger (Le Peco FRX), Arrangement for protecting an electronic card and its use for protecting a terminal for reading magnetic and/or micropro.
Angelopoulos, Marie; Graham, Teresita O.; Purushothaman, Sampath; Weingart, Steve H., Data protection by detection of intrusion into electronic assemblies.
Kleijne Theodoor A. (Dreumel NLX) de Bruin Johannes A. J. (Montfoort NLX) Goossens Jan B. (De Bilt NLX), Data security device for protecting stored data.
Shirakami, Takashi; Yamazaki, Naoya; Iino, Kazuhiro; Tada, Yoshiaki; Ueda, Satoshi, Heat transfer mechanism, heat dissipation system, and communication apparatus.
Bumler Heinz (Mnchen DEX) Hoffmann Richard (Gaimersheim DEX) Schirmer Klaus (Ingolstadt DEX) Zeides Otto (Ingolstadt DEX), Housing for installation in motor vehicles.
Dellmo, Russell Wayne; Petkus, Eric Edmond; Yancy, Bruce Wayne, Modular cryptographic device providing multi-mode wireless LAN operation features and related methods.
Perreault,Paul G; Clark,Douglas A; Heitmann,Kjell A, System and method for installing a tamper barrier wrap in a PCB assembly, including a PCB assembly having improved heat sinking.
Mori Ryoichi (24-12 ; Hakusan 1-chome Bunkyo-ku ; Tokyo JPX), Tamper resistant module having logical elements arranged in multiple layers on the outer surface of a substrate to prote.
Comerford Liam D. (Carmel NY) Ledermann Peter G. (Pleasantville NY) Levy Lawrence I. (Yorktown Heights NY) White Steve R. (New York NY), Tamper resistant packaging for information protection in electronic circuitry.
Farquhar, Donald S.; Feger, Claudius; Markovich, Voya; Papathomas, Konstantinos I.; Poliks, Mark D.; Shaw, Jane M.; Szeparowycz, George; Weingart, Steve H., Tamper-responding encapsulated enclosure having flexible protective mesh structure.
Farquhar, Donald S.; Feger, Claudius; Markovich, Voya; Papathomas, Konstantinos I.; Poliks, Mark D.; Shaw, Jane M.; Szeparowycz, George; Weingart, Steve H., Tamper-responding encapsulated enclosure having flexible protective mesh structure.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.