[특허]Coupling structures for electronic device housings

Coupling structures for electronic device housings 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	G06F-001/16 H01Q-001/24 H04M-001/02 B29C-045/14 B29L-031/34 B29C-037/00
출원번호	US-0233891 (2016-08-10)
등록번호	US-10148000 (2018-12-04)
발명자 / 주소	Hill, Matthew D. Wittenberg, Michael B. Bustle, Shane Le, Duy P.
출원인 / 주소	APPLE INC.
대리인 / 주소	Brownstein Hyatt Farber Schreck, LLP
인용정보	피인용 횟수 : 0 인용 특허 : 34

초록 ▼

A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.

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1. A housing for an electronic device, comprising: a first component;a second component separated from the first component by a gap;a first molded element disposed at least partially within the gap and defining: at least a portion of an interlock feature; anda textured surface; anda second molded element disposed at least partially within the gap and mechanically engaging the interlock feature and the textured surface, thereby retaining the second molded element to the first molded element; whereinthe first component, the second component, and the second molded element form a portion of an exterior surface of the housing. 2. The housing of claim 1, wherein the interlock feature mechanically couples the first component to the second component. 3. The housing of claim 2, wherein: the interlock feature is a first interlock feature;the first component defines a second interlock feature; andthe first molded element mechanically engages the second interlock feature to mechanically couple the first molded element to the first component. 4. The housing of claim 1, wherein the interlock feature is a protrusion formed in the first molded element. 5. The housing of claim 1, wherein the interlock feature is a recess formed in the first molded element. 6. The housing of claim 5, wherein: the first molded element defines a first portion of the interlock feature; andthe first component defines a second portion of the interlock feature. 7. The housing of claim 1, wherein: the interlock feature is a through-hole extending from a first surface of the first molded element to a second surface of the first molded element; andthe first surface of the first molded element is adjacent the second molded element. 8. The housing of claim 1, wherein: the first component defines a first exterior surface of the housing;the second component defines a second exterior surface of the housing;the second molded element defines a third exterior surface of the housing; andat least portions of the first, second, and third exterior surfaces of the housing form a substantially coplanar surface. 9. The housing of claim 1, wherein the first molded element has a higher strength than the second molded element. 10. The housing of claim 1, wherein the first component is an antenna. 11. A housing for an electronic device, comprising: a first component;a second component separated from the first component by a gap; anda joint structure disposed at least partially within the gap; wherein: the first component and the second component comprise flanges defining first and second portions, respectively, of a frame adapted to receive a transparent cover;a tooth of the joint structure extends past a ledge of the joint structure and forms a third portion of the frame; andthe joint structure includes a support structure that supports the tooth. 12. The housing of claim 11, wherein the support structure protrudes from a side of the joint structure. 13. The housing of claim 12, wherein the support structure extends from a side of the tooth to a side of the ledge. 14. The housing of claim 12, wherein the support structure is disposed in a pocket formed in one of the first or second components. 15. The housing of claim 12, wherein: the joint structure is a first molded element;the housing further comprises a second molded element disposed at least partially within the gap and comprising a pocket formed therein; andthe support structure is disposed in the pocket formed in the second molded element. 16. The housing of claim 15, wherein the support structure and the pocket are shaped such that a narrowing of the gap causes the tooth to be drawn toward the transparent cover. 17. The housing of claim 11, wherein the support structure comprises a chamfer extending from the tooth to the ledge. 18. The housing of claim 11, wherein the joint structure comprises: a curved member; anda gusset on an interior radius of the curved member. 19. A housing for an electronic device, comprising: a first housing portion forming a first portion of an exterior surface of the housing;a second housing portion separated from the first housing portion by a gap and forming a second portion of the exterior surface of the housing; anda joint structure disposed in the gap and comprising: a protrusion that defines a portion of a frame configured to receive a transparent cover; anda guide structure extending from a side of the protrusion to a lower portion of the protrusion and configured to bias at least a portion of the joint structure toward an interior of the housing in response to a narrowing of the gap. 20. The housing of claim 19, wherein the guide structure engages a complementary recess in one of the first or the second housing portions to bias the portion of the joint structure toward the interior of the housing in response to the narrowing of the gap. 21. The housing of claim 19, wherein an outer edge of the guide structure is rounded. 22. The housing of claim 19, wherein the narrowing of the gap is caused by the housing impacting a surface.

이 특허에 인용된 특허 (34)

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