Various examples are directed to a multistage refrigeration system comprising a vapor compression cycle (VCC) stage, a thermosiphon stage, and an interface device. The VCC stage may circulate a VCC refrigerant, for example, to work a vapor compression cycle on the VCC refrigerant. The thermosiphon s
Various examples are directed to a multistage refrigeration system comprising a vapor compression cycle (VCC) stage, a thermosiphon stage, and an interface device. The VCC stage may circulate a VCC refrigerant, for example, to work a vapor compression cycle on the VCC refrigerant. The thermosiphon stage may circulate a thermosiphon refrigerant between the interface device and an evaporator. The interface device may comprise an interface flow path in fluid communication with the VCC stage to receive the VCC refrigerant and a first vessel that at least partially encloses the first interface flow path. The vessel may receive the first thermosiphon refrigerant at least partially in a vapor phase and may provide the first thermosiphon refrigerant to the evaporator at least partially in a liquid phase. The vessel may be at a second elevation, higher than the first elevation, to generate a thermosiphon force to circulate the thermosiphon refrigerant between the vessel and the evaporator.
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1. A multistage refrigeration system comprising: a vapor compression cycle (VCC) stage to circulate a VCC refrigerant, the VCC stage comprising: a compressor;a condenser; andan expansion device;a first thermosiphon stage to circulate a first thermosiphon refrigerant, the first thermosiphon stage com
1. A multistage refrigeration system comprising: a vapor compression cycle (VCC) stage to circulate a VCC refrigerant, the VCC stage comprising: a compressor;a condenser; andan expansion device;a first thermosiphon stage to circulate a first thermosiphon refrigerant, the first thermosiphon stage comprising a first evaporator at a first elevation; anda first interface device comprising: a first interface flow path in fluid communication with the compressor, the condenser, and the expansion device to receive the VCC refrigerant; anda first vessel comprising: a first vessel input to receive the first thermosiphon refrigerant at least partially in a vapor phase; anda first vessel output to output the first thermosiphon refrigerant towards the first evaporator at least partially in a liquid phase, wherein first vessel at least partially encloses the first interface flow path to put the VCC refrigerant in thermal communication with the first thermosiphon refrigerant, and wherein the first vessel is at a second elevation higher than the first elevation to generate a first thermosiphon force to circulate the first thermosiphon refrigerant between the first vessel and the first evaporator. 2. The multistage refrigeration system of claim 1, wherein the first vessel input is to receive the first thermosiphon refrigerant at a first temperature, and wherein the first vessel output is to provide the first thermosiphon refrigerant to the first evaporator at a second temperature lower than the first temperature. 3. The multistage refrigeration system of claim 1, wherein more than half of the first thermosiphon refrigerant received at the first vessel input is in the vapor phase, and wherein more than half of the first thermosiphon refrigerant output at the first vessel output is in the liquid phase. 4. The multistage refrigeration system of claim 1, wherein the VCC stage further comprises a second evaporator in fluid communication with at least the compressor, the condenser, the expansion device, and the first interface flow path. 5. The multistage refrigeration system of claim 4, wherein the first evaporator is positioned in a first room of a building and the second evaporator is positioned at a second room of the building. 6. The multistage refrigeration system of claim 1, wherein the first vessel is positioned above a roof of a building and the first evaporator is positioned below the roof of the building. 7. The multistage refrigeration system of claim 1, further comprising: a second thermosiphon stage to circulate a second thermosiphon refrigerant, the second thermosiphon stage comprising a second evaporator at a third elevation; anda second interface device comprising: a second interface flow path in fluid communication the compressor, the condenser, and the expansion device to receive the VCC refrigerant; anda second vessel comprising: a second vessel input to receive a second thermosiphon refrigerant at least partially in the vapor phase; anda second vessel output to output the second thermosiphon refrigerant towards the second evaporator at least partially in a liquid phase, wherein the second vessel at least partially encloses the second interface flow path to put the VCC refrigerant in thermal communication with the second thermosiphon refrigerant, and wherein the second vessel is at a fourth elevation higher than the third elevation to generate a second thermosiphon force to circulate the second thermosiphon refrigerant between the second vessel and the second evaporator. 8. The multistage refrigeration system of claim 1, wherein the first interface device comprises a shell-and-tube heat exchanger, wherein the first interface flow path comprises a tube portion of the shell-and-tube heat exchanger, and wherein the first vessel comprises a shell portion of the shell-and-tube heat exchanger. 9. The multistage refrigeration system of claim 1, wherein the first interface device comprises a plate-and-shell heat exchanger, wherein the first interface flow path comprises a first plate flow path of the plate-and-shell heat exchanger. 10. The multistage refrigeration system of claim 1, wherein a mass of the VCC refrigerant in the VCC stage is greater than a mass of the first thermosiphon refrigerant in the first thermosiphon stage. 11. A method of operating a multistage refrigeration system comprising a vapor compression cycle (VCC) stage, a first thermosiphon stage, and a first interface device comprising a first interface flow path and a first vessel that at least partially encloses the first interface flow path, the method comprising: providing a VCC refrigerant from the VCC stage to the first interface flow path positioned at least partially within the first vessel, wherein the first vessel comprises a first thermosiphon refrigerant, and wherein the VCC refrigerant absorbs heat from the first thermosiphon refrigerant at the first interface device to generate a first thermosiphon force to circulate the first thermosiphon refrigerant between the first vessel and a first evaporator that is at least partially below the first interface device. 12. The method of claim 11, further comprising: receiving the first thermosiphon refrigerant at an input of the first vessel at a first temperature; andproviding the first thermosiphon refrigerant at an output of the first vessel at a second temperature lower than the first temperature. 13. The method of claim 12, further comprising providing the first thermosiphon refrigerant from the first vessel to the first evaporator through a roof of a building, wherein the first evaporator is below the roof. 14. The method of claim 11, wherein more than half of the first thermosiphon refrigerant received at a first vessel input is in a vapor phase, and wherein more than half of the first thermosiphon refrigerant that is output at a first vessel output is in a liquid phase. 15. The method of claim 11, further comprising providing the VCC refrigerant from the VCC stage to a second evaporator that receives the VCC refrigerant in parallel with the first interface flow path. 16. The method of claim 15, wherein the first evaporator is positioned in a first room of a building and the second evaporator is positioned at a second room of the building. 17. The method of claim 11, further comprising providing the VCC refrigerant from the VCC stage to a second interface flow path positioned at least partially within a second vessel of a second interface device, wherein the second vessel comprises a second thermosiphon refrigerant, and wherein the VCC refrigerant absorbs heat from the first thermosiphon refrigerant at the second interface device to generate a second thermosiphon force to circulate the second thermosiphon refrigerant between the second vessel and a second evaporator that is at least partially below the second interface device. 18. The method of claim 11, wherein a mass of the VCC refrigerant is greater than a mass of the first thermosiphon refrigerant. 19. A system comprising: a vapor compression cycle (VCC) stage to circulate a VCC refrigerant;a first thermosiphon stage to circulate a first thermosiphon refrigerant; anda first interface device comprising: a first interface flow path in fluid communication with the VCC stage; anda first vessel that at least partially encloses the first interface flow path, wherein the first vessel is to receive a first thermosiphon refrigerant, wherein the VCC refrigerant at the first interface flow path is in thermal communication with the first thermosiphon refrigerant at the first vessel, wherein more than half of the first thermosiphon refrigerant received at the first vessel is in a vapor phase, wherein the first vessel is to output the first thermosiphon refrigerant to a first evaporator positioned below the first interface device to generate a first thermosiphon force to circulate the first thermosiphon refrigerant between the first vessel and the first evaporator, and wherein more than half of the first thermosiphon refrigerant that is output to the first evaporator is in a liquid phase. 20. The system of claim 19, wherein a mass of the VCC refrigerant in the VCC stage is greater than a mass of the first thermosiphon refrigerant in the first thermosiphon stage.
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