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Packaged chip-on-board (COB) LED arrays are provided where a color conversion medium is distributed within a glass containment plate, rather than silicone, to reduce the operating temperature of the color conversion medium and avoid damage while increasing light output. A lighting device is provided

Packaged chip-on-board (COB) LED arrays are provided where a color conversion medium is distributed within a glass containment plate, rather than silicone, to reduce the operating temperature of the color conversion medium and avoid damage while increasing light output. A lighting device is provided comprising a chip-on-board (COB) light emitting diode (LED) light source, a light source encapsulant, a distributed color conversion medium, and a glass containment plate. The COB LED light source comprises a thermal heat sink framework and at least one LED and defines a light source encapsulant cavity in which the light source encapsulant is distributed over the LED. The glass containment plate is positioned over the light source encapsulant cavity and contains the distributed color conversion medium. The light source encapsulant is distributed over the LED at a thickness that is sufficient to encapsulate the LED and define encapsulant thermal conduction paths.

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1. A lighting device comprising a chip-on-board (COB) light emitting diode (LED) light source, a light source encapsulant, a distributed color conversion medium, and a planar glass plate, wherein: the COB LED light source comprises a thermal heat sink framework and at least one LED and defines a lig

1. A lighting device comprising a chip-on-board (COB) light emitting diode (LED) light source, a light source encapsulant, a distributed color conversion medium, and a planar glass plate, wherein: the COB LED light source comprises a thermal heat sink framework and at least one LED and defines a light source encapsulant cavity in which the light source encapsulant is distributed over the LED;the planar glass plate comprises a first planar glass surface and an opposing second planar glass surface, the first planar glass surface contacting the light source encapsulant cavity;the light source encapsulant is distributed over the LED at a thickness that is sufficient to encapsulate the LED and define encapsulant thermal conduction paths TPE and TPG extending through the light source encapsulant to the thermal heat sink framework from the planar glass plate;the thermal conduction paths TPE extend less than approximately 100 μm through the light source encapsulant and encounter a thermal resistance of less than approximately 15° C./W through the light source encapsulant; andthe color conversion medium is distributed within the planar glass plate in two dimensions over an emission field of the lighting device. 2. The lighting device as claimed in claim 1 wherein the thickness of the light source encapsulant is such that the thermal conduction paths TPE extend less than approximately 50 μm through the light source encapsulant. 3. The lighting device as claimed in claim 1 wherein the distributed color conversion medium comprises a color converting phosphor. 4. The lighting device as claimed in claim 1 wherein the distributed color conversion medium comprises a quantum dot structure. 5. The lighting device as claimed in claim 1 wherein: the planar glass plate comprises a glass matrix; andthe distributed color conversion medium comprises a phosphor distributed in the glass matrix. 6. The lighting device as claimed in claim 1 wherein the planar glass plate comprises a variety of quantum dot sizes that are blended to obtain a particular color. 7. The lighting device as claimed in claim 1 wherein: the planar glass plate comprises a glass frame; andthe distributed color conversion medium comprises a quantum dot structure contained within an interior volume of the glass frame. 8. The lighting device as claimed in claim 1 wherein: the distributed color conversion medium comprises a quantum dot structure;the planar glass plate comprises opposing glass panels that are sealed at complementary edges to define an interior volume; andthe quantum dot structure is contained within the interior volume of the planar glass plate. 9. The lighting device as claimed in claim 1 wherein: the planar glass plate comprises a glass matrix;the distributed color conversion medium comprises a phosphor distributed in the glass matrix;the lighting device further comprises a quantum dot plate disposed over the planar glass plate to define a supplemental emission field of the lighting device; andthe emission field defined by the distributed phosphor color conversion medium is spatially congruent with, but spectrally distinct from, the supplemental emission field defined by the quantum dot plate. 10. The lighting device as claimed in claim 9 wherein an intervening glass plate is disposed between the glass matrix of the planar glass plate and the quantum dot plate. 11. The lighting device as claimed in claim 9 wherein: the quantum dot plate that is disposed over the planar glass plate comprises a quantum dot structure and opposing glass panels that are sealed at complementary edges to define an interior volume; andthe quantum dot structure is contained within the interior volume of the quantum dot plate. 12. The lighting device as claimed in claim 9 wherein an emission spectrum of the emission field defined by the quantum dot plate adds optical warmth to an emission spectrum of the emission field defined by the distributed phosphor color conversion medium. 13. The lighting device as claimed in claim 1 wherein: the COB LED light source comprises an LED array; andthe light source encapsulant is distributed over the LED array. 14. The lighting device as claimed in claim 1 wherein the color conversion medium is substantially free of organic components. 15. The lighting device as claimed in claim 1 wherein the planar glass plate is substantially free of organic components. 16. The lighting device as claimed in claim 1 wherein the light source encapsulant is substantially free of color conversion medium. 17. The lighting device as claimed in claim 1 wherein the light source encapsulant cavity is substantially free of color conversion medium. 18. A lighting device comprising a chip-on-board (COB) light emitting diode (LED) light source, a light source encapsulant, a distributed color conversion medium, and a planar glass plate, wherein: the COB LED light source comprises a thermal heat sink framework and at least one LED and defines a light source encapsulant cavity in which the light source encapsulant is distributed over the LED;the planar glass plate comprises a first planar glass surface and an opposing second planar glass surface, the first planar glass surface facing an upper light-emitting surface of the at least one LED;the light source encapsulant is distributed over the LED at a thickness that is sufficient to encapsulate the LED and define encapsulant thermal conduction paths TPE and TPG extending through the light source encapsulant to the thermal heat sink framework from the planar glass plate;the thermal conduction paths TPE extend less than approximately 100 μm through the light source encapsulant and encounter a thermal resistance of less than approximately 15° C./W through the light source encapsulant; and the color conversion medium is distributed within the planar glass plate in two dimensions over an emission field of the lighting device.