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Adaptive processes for improving integrity of surfaces 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G06F-019/00
  • G05B-019/418
  • H05K-013/00
  • G06F-001/16
출원번호 US-0339125 (2014-07-23)
등록번호 US-10162343 (2018-12-25)
발명자 / 주소
  • Leggett, William F.
  • Lancaster-Larocque, Simon Regis Louis
출원인 / 주소
  • Apple Inc.
대리인 / 주소
    Dickinson Wright RLLP
인용정보 피인용 횟수 : 0  인용 특허 : 73

초록

A process for performing localized corrective actions to structure of an electronic device is described. The structure may include a mating surface configured to receive another structure such that the two structures may be, for example, adhesively bonded together. The localized corrective actions a

대표청구항

1. A method for assembling a housing of an electronic device, the electronic device having a first component that includes a mating surface having a first surface portion and a second surface portion separated by a recess having a dimension within an acceptable tolerance range, the method comprising

이 특허에 인용된 특허 (73)

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