|국가/구분||United States(US) Patent 등록|
|국제특허분류(IPC7판)||H05K-013/00 G06F-001/18 H01R-004/72 G06F-001/16|
|발명자 / 주소|
|출원인 / 주소|
|대리인 / 주소||
|인용정보||피인용 횟수 : 0 인용 특허 : 20|
An electronic device has structures that are assembled using attachment structures. The attachment structures change shape to help join the electronic device structures together. Structures that may be joined together can include electronic device housing structures, display structures, internal device components, electrical components, and other portions of an electronic device. The attachment structures can include heat-activated attachment structures, structures that are activated using other types of applied energy, and structures that change shape d...
1. A method of assembling an electronic device having a first electronic device structure with a first surface and a second electronic device structure with a second surface, comprising: placing an expandable attachment structure between the first and second electronic device structures;applying heat to the expandable attachment structure to expand the expandable attachment structure and move the first electronic device structure relative to the second electronic device structure; andceasing the applying the heat when the first surface is aligned with th...