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The description relates to devices, such as computing devices. One example can include a sandwich structured composite housing. The example can also include a set of electronic components positioned over the sandwich structured composite housing. The set of electronic components can have a profile a

The description relates to devices, such as computing devices. One example can include a sandwich structured composite housing. The example can also include a set of electronic components positioned over the sandwich structured composite housing. The set of electronic components can have a profile against the sandwich structured composite housing. The sandwich structured composite housing can have a corresponding negative profile.

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1. A device, comprising: a sandwich structured composite housing;a touch display; and,a set of electronic components positioned between the sandwich structured composite housing and the touch display, the set of electronic components having a profile against the sandwich structured composite housing

1. A device, comprising: a sandwich structured composite housing;a touch display; and,a set of electronic components positioned between the sandwich structured composite housing and the touch display, the set of electronic components having a profile against the sandwich structured composite housing, and the sandwich structured composite housing having a negative profile that corresponds to the profile of the set of electronic components. 2. The device of claim 1, wherein the sandwich structured composite housing comprises a metal composite material. 3. The device of claim 1, further comprising another housing that houses the touch display. 4. A device comprising: a sandwich structured composite housing comprising an outer layer, a thermal insulative layer, a thermal conductive layer, and an inner structural layer; and,a set of electronic components positioned over the sandwich structured composite housing, the set of electronic components having a profile against the sandwich structured composite housing, and the sandwich structured composite housing having a negative profile that corresponds to the profile of the set of electronic components. 5. The device of claim 4, wherein the thermal conductive layer comprises a continuous sheet. 6. The device of claim 5, wherein a majority of an area of the continuous sheet is positioned between the inner structural layer and the outer structural layer, and wherein a minority of the area of the continuous sheet is not positioned between the inner structural layer and the outer structural layer. 7. The device of claim 4, wherein the negative profile is defined by the thermal conductive layer. 8. The device of claim 4, wherein the inner structural layer defines a window, an individual one of the electronic components being positioned over the window, and the thermal conductive layer extends from a lower side of the inner structural layer through the window toward the individual one of the electronic components. 9. A device, comprising: a composite material housing comprising inner and outer structural layers and a thermal conductive layer, the thermal conductive layer being at least partly interposed in an area between the inner and outer structural layers, the inner structural layer defining a window; and,an electronic component positioned over the window in the inner structural layer, the thermal conductive layer extending from a lower side of the inner structural layer through the window toward the electronic component, the electronic component having a profile over the window, and wherein the thermal conductive layer has a negative profile that corresponds to the profile of the electronic component. 10. The device of claim 9, further comprising a thermal insulative layer being partly interposed in the area between the inner and outer structural layers. 11. The device of claim 9, wherein the inner structural layer further defines an additional window, and the device further comprises additional electronic component positioned over the additional window. 12. The device of claim 9, wherein the profile of the electronic component over the window is curved. 13. The device of claim 9, wherein the profile of the electronic component over the window is convex and the negative profile of the thermal conductive layer is concave. 14. The device of claim 9, wherein the profile of the electronic component over the window is non-planar. 15. The device of claim 9, wherein the profile of the electronic component and the negative profile of the thermal conductive layer allow a gap between the electronic component and the thermal conductive layer. 16. The device of claim 9, wherein an upper surface of the inner structural layer is shaped to accommodate an additional electronic component positioned over the inner structural layer. 17. The device of claim 16, wherein the upper surface of the inner structural layer includes an indentation to accommodate the additional electronic component. 18. A device, comprising: a sandwich structured composite housing including a thermal conductive layer and an insulative layer; and,a set of electronic components positioned over the sandwich structured composite housing, the set of electronic components having a profile against a first side of the thermal conductive layer, the first side of the thermal conductive layer having a corresponding negative profile against the profile of the set of the electronic components, and the insulative layer positioned against an opposing second side of the thermal conductive layer. 19. The device of claim 18, wherein the thermal conductive layer comprises an anisotropic material. 20. The device of claim 18, wherein the thermal conductive layer is configured to transfer heat energy away from the electronic components. 21. The device of claim 18, wherein the opposing second side of the thermal conductive layer has a nonlinear profile that fits a corresponding nonlinear profile of the insulative layer.