초록 ▼

An electrical feed-through assembly includes electrically conductive pins having a top apex and a bottom apex, where the pins extend through at least a majority of an electrically non-conductive material. The top apexes, the bottom apexes, or both the top and bottom apexes of the pins have an electr

An electrical feed-through assembly includes electrically conductive pins having a top apex and a bottom apex, where the pins extend through at least a majority of an electrically non-conductive material. The top apexes, the bottom apexes, or both the top and bottom apexes of the pins have an electrically conductive connection pad material, such as a solder pad, coupled thereto. In variations, the top and/or bottom apexes may be slightly recessed from a corresponding surface of the non-conductive material, such that the connection pads fill the respective recesses; and/or the top and/or bottom apexes barely extend from a corresponding surface, such that the connection pads bulge out from the corresponding surface. Such a feed-through configuration may inhibit pin bending, in addition to enabling use of more types of connectors beyond pin-and-socket type connectors.

대표청구항 ▼

1. An electrical feed-through assembly component comprising: an electrically non-conductive material having a top surface and a bottom surface of a main body;a plurality of electrically conductive pins having a top apex and a bottom apex and extending through at least a majority of said main body; a

1. An electrical feed-through assembly component comprising: an electrically non-conductive material having a top surface and a bottom surface of a main body;a plurality of electrically conductive pins having a top apex and a bottom apex and extending through at least a majority of said main body; andsolder pads coupled to said top and said bottom apexes of said pins;wherein one of said top and bottom apexes of said pins are recessed from a corresponding said top or bottom surface of said main body of said non-conductive material, such that said solder pads coupled to said apexes that are recessed fill a respective recess created by recession of said pins from said corresponding surface;wherein the other of said top and bottom apexes of said pins marginally extend from a corresponding said top or bottom surface of said main body of said non-conductive material, such that said solder pads coupled to said apexes that extend bulge out from said corresponding surface. 2. The electrical feed-through assembly of claim 1, wherein said pins comprise gold plating or palladium plating. 3. The electrical feed-through assembly of claim 1, wherein said non-conductive material comprises a ceramic or a resin. 4. A data storage device comprising: a disk medium rotatably mounted on a spindle;a read-write head slider comprising a read-write transducer configured to read from and to write to said disk medium;a voice coil actuator configured to move said head slider to access portions of said disk medium;an electrical feed-through assembly component comprising: an electrically non-conductive material having a top surface and a bottom surface of a main body,a plurality of electrically conductive pins having a top apex and a bottom apex and extending through at least a majority of said main body, andsolder pads coupled to at least one of said top and said bottom apexes of said pins; andan enclosure comprising a base with which said electrical feed-through is coupled, wherein said base includes an aperture encompassed by said electrical feed-through;wherein:at least one of said top and bottom apexes of said pins are recessed from respective said top and bottom surfaces of said main body of said non-conductive material of said feed-through assembly, such that any said solder pads coupled to said apexes that are recessed fills a respective recess created by recession of said pins from said top and/or bottom surfaces; orat least one of said top and bottom apexes of said pins marginally extend from respective said top and bottom surfaces of said main body of said non-conductive material of said feed-through assembly, such that any said solder pads coupled to said apexes that extend bulges out from said top and/or bottom surfaces. 5. The data storage device of claim 4, further comprising: an electrical connector part electrically connected to said pins through said solder pads. 6. The data storage device of claim 5, further comprising: a printed circuit board coupled with said base;wherein said connector part is electrically connected on one side to said pins via compression-type terminals and electrically connected on another side to said printed circuit board. 7. The data storage device of claim 4, wherein said solder pads are coupled to both of said top and said bottom apexes of said pins. 8. The data storage device of claim 7, further comprising: a first electrical connector part electrically connected to said bottom apexes of said pins through said corresponding solder pads;a second electrical connector part electrically connected to said top apexes of said pins through said corresponding solder pads;a printed circuit board coupled with said base; anda flexible electrical cable assembly within said enclosure;wherein said first connector part is electrically connected to said bottom apexes of said pins via compression-type terminals and electrically connected to said printed circuit board;wherein said second connector part is electrically connected to said top apexes of said pins via compression-type terminals and electrically connected to said flexible cable assembly. 9. The data storage device of claim 4, wherein at least one of said top and bottom apexes of said pins are recessed from respective said top and bottom surfaces of said main body of said non-conductive material of said feed-through assembly, such that each said solder pad fills a respective recess created by recession of said pins from said top and/or bottom surfaces. 10. The data storage device of claim 4, wherein at least one of said top and bottom apexes of said pins marginally extend from respective said top and bottom surfaces of said main body of said non-conductive material of said feed-through assembly, such that each said solder pad bulges out from said top and/or bottom surfaces. 11. The data storage device of claim 4, wherein one of said top and bottom apexes of said pins are recessed from a corresponding said top or bottom surface of said main body of said non-conductive material of said feed-through assembly, such that each said solder pad coupled to said one of said top and bottom apexes fills a respective recess created by recession of said pins from said corresponding surface;wherein the other of said top and bottom apexes of said pins marginally extend from a corresponding said top or bottom surface of said main body of said non-conductive material of said feed-through assembly, such that each said solder pad coupled to said other of said top and bottom apexes bulges out from said corresponding surface. 12. A method of assembling a data storage device, the method comprising: affixing a pre-assembled electrical feed-through assembly component to a data storage device enclosure comprising a base comprising an aperture encompassed by said electrical feed-through assembly, wherein said feed-through assembly comprises: an electrically non-conductive material having a top surface and a bottom surface of a main body,a plurality of electrically conductive pins having a top apex and a bottom apex and extending through at least a majority of said main body,wherein: at least one of said top and bottom apexes of said pins are recessed from respective said top and bottom surfaces of said main body of said non-conductive material of said feed-through assembly, such that each said solder pad fills a respective recess created by recession of said pins from said top and/or bottom surfaces; orat least one of said top and bottom apexes of said pins marginally extend from respective said top and bottom surfaces of said main body of said non-conductive material of said feed-through assembly, such that each said solder pad bulges out from said top and/or bottom surfaces, andsolder pads coupled to at least one of said top and said bottom apexes of said pins;electrically connecting an electrical connector part to said electrical feed-through assembly, wherein compression-type terminals of said connector part are electrically connected to said pins of said feed-through through said solder pads. 13. The method of claim 12, wherein said electrical connector part is electrically connected to a printed circuit board, and wherein said feed-through assembly further comprises solder pads coupled to said top apexes of said pins, the method further comprising: electrically connecting a flexible electrical cable assembly, which is within said enclosure, to said electrical feed-through assembly through said solder pads coupled to said top apexes of said pins. 14. A method of manufacturing an electrical feed-through assembly, the method comprising: applying solder pads to at least one of a top apex and a bottom apex of a plurality of electrically conductive pins extending through at least a majority of a main body of an electrically non-conductive material having a top surface and a bottom surface;wherein: at least one of said top and bottom apexes of said pins are recessed from respective said top and bottom surfaces of said main body of said non-conductive material, such that each said solder pad fills a respective recess created by recession of said pins from said top and/or bottom surfaces; orat least one of said top and bottom apexes of said pins marginally extend from respective said top and bottom surfaces of said main body of said non-conductive material, such that each said solder pad bulges out from said top and/or bottom surfaces;wherein said applying includes:a screen-printing process, ora dispenser process. 15. The method of claim 14, wherein said applying includes said screen-printing process, in which a solder paste is squeegeed onto said at least one of said top apex and said bottom apex of said electrically conductive pins through a solder mask, the method further comprising: electrically connecting a connector part to said electrically conductive pins, wherein said electrically connecting comprises:mounting a connector part to said electrically conductive pins, andreflowing said solder paste. 16. The method of claim 14, wherein said applying includes said dispenser process, in which a solder paste is directly dispensed onto said at least one of said top apex and said bottom apex of said electrically conductive pins, the method further comprising: electrically connecting a connector part to said electrically conductive pins, wherein said electrically connecting comprises:mounting a connector part to said electrically conductive pins, andreflowing said solder paste.