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특허 상세정보

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내보내기 페이스북 공유 카카오톡 공유

Insulated packaging and method of making same

특허상세정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) B31B-050/00    B31B-070/62    B65D-081/38    B29C-044/12    B29C-044/44    B29C-035/08    B31B-050/04    B31B-050/28    B31B-050/88    B31B-050/81    B31B-070/64    B31B-070/74    B29K-105/16    B05B-013/02    B31B-105/00    B31B-050/74   
출원번호 US-0662990 (2017-07-28)
등록번호 US-10183458 (2019-01-22)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Fitch, Even, Tabin & Flannery LLP
인용정보 피인용 횟수 : 0  인용 특허 : 62
초록

Insulated packaging is provided including an inner substrate and an outer substrate attached to the inner substrate to form an air gap therebetween. An expandable material including expandable microspheres is provided with the expandable material disposed between the inner substrate and the outer substrate. An adhesive material different than the expandable material is disposed between the inner substrate and the outer substrate to attach the inner substrate to the outer substrate. A method for forming the insulated packaging is also provided.

대표
청구항
▼

1. A method of making insulated packaging, the method comprising: applying a thermally expandable material to at least one of a first substrate and a second substrate for being disposed therebetween, the expandable material comprising microspheres;applying an adhesive material different than the expandable material to at least one of the first substrate and the second substrate for being disposed therebetween at locations where the adhesive material does not overlap the thermally expandable material;attaching the first substrate to the second substrate w...

이 특허에 인용된 특허 (62)

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