초록 ▼

Compositions and methods for making a novel liquid gel mixture comprising at least one flexible polymer carrier, parachlorobenzotrifluoride, optional thermally-conductive materials, and optional performance-enhancing additives; using the liquid gel mixture for making surface-infused layers on layeri

Compositions and methods for making a novel liquid gel mixture comprising at least one flexible polymer carrier, parachlorobenzotrifluoride, optional thermally-conductive materials, and optional performance-enhancing additives; using the liquid gel mixture for making surface-infused layers on layering substrates; and using combinations of surface-infused gel layer and layering substrate in cushioning foams and mattresses. Layering substrates are surface-infused with a liquid gel mixture and may be compressed to increase the penetration depth of liquid gel mixture into the substrate layer surface. This compositions may be used in mattresses, mattress topper pads, pillows, bedding products, furniture upholstery, pet beds, medical cushioning foams, seat cushions and backs, automotive foam, sports cushioning, transportation cushioning, headrests, arm rests, personal protective equipment, toys, and the like.

대표청구항 ▼

1. A method of forming a surface-infused gel layer comprising the following steps, not necessarily in this order: making a liquid gel mixture by solvating at least one flexible polymeric carrier in parachlorobenzotrifluoride (PCBTF) solvent;introducing at least one microencapsulated phase change mat

1. A method of forming a surface-infused gel layer comprising the following steps, not necessarily in this order: making a liquid gel mixture by solvating at least one flexible polymeric carrier in parachlorobenzotrifluoride (PCBTF) solvent;introducing at least one microencapsulated phase change material (MPCM) in the flexible polymeric carrier;infusing at least a portion of the liquid gel mixture into at least one layering substrate to give a product having a surface-infused gel layer on the layering substrate; andat least partially removing the PCBTF solvent from the product. 2. The method of claim 1 further comprising compressing the product of at least one layering substrate and liquid gel mixture to produce the at least one cured flexible gel polymeric carrier layer on the layering substrate. 3. The method of claim 1 where the liquid gel mixture of claim 1 has an absence of toluene. 4. The method of claim 1 where the PCBTF is present in the range of about 0.1% to about 99% by weight of the liquid gel mixture. 5. The method of claim 1 where the at least one flexible polymeric carrier is selected from a group consisting of gelatinous A-B-A tri-block copolymer elastomers, thermoplastic polyurethane elastomers, thermoplastic polyester elastomers, latex elastomers, neoprene elastomers, and combinations thereof. 6. The method of claim 5 further comprising wherein at least one flexible polymeric carrier is a gelatinous A-B-A tri-block copolymer elastomer that comprises an A-B-A tri-block copolymer resin selected from the group consisting of styrene-ethylene-butylene-styrene (SEBS), styrene-ethylene-propylene-styrene (SEPS), styrene-ethylene-ethylene-propylene-styrene (SEEPS), styrene-butadiene-styrene (SBS), styrene-isoprene-styrene (SIS) and combinations thereof. 7. The method of claim 1 where the liquid gel mixture further comprises: a highly thermally-conductive material in the range of about 0.1% to about 95% by weight of the at least one cured flexible gel polymeric carrier layer after solvent loss; andthe highly thermally-conductive material is in solid form and has a thermal conductivity from about 100 W/(m-° K) to about 3500 W/(m-° K). 8. The method of claim 1 where the MPCM has a solid/liquid phase transition temperature from about 20° C. to about 35° C. and where the MPCM is present in the liquid gel mixture in the range of about 5% to about 80% by weight of the liquid gel mixture after solvent loss. 9. The method of claim 1 where the layering substrate is selected from the group consisting of open-celled polyether polyurethane foam, partially open-celled polyether polyurethane foam, reticulated polyurethane foam, high-resiliency polyether polyurethane foam, open-celled viscoelastic polyether polyurethane foam, partially open-celled viscoelastic polyether polyurethane foam, open-celled polyester polyurethane foam, partially open-celled polyester polyurethane foam, open-celled polyester foam, partially open-celled polyester foam, latex foam, melamine foam, and combinations thereof. 10. A method of forming a surface-infused gel layer with a lamination system where the method comprises: forming a liquid gel mixture comprising at least one flexible polymeric carrier in parachlorobenzotrifluoride (PCBTF) and at least one microencapsulated phase change material (MPCM);driving a top roller and a bottom roller with an adjustable gap between them;coating the bottom roller with the liquid gel mixture;coating a layering substrate with the liquid gel material to give a surface-infused gel layer on the layering substrate;compressing the layering substrate an amount in the range of from about 0.1% to about 90%;removing the layering substrate from the bottom roller coated with the liquid gel mixture; andevaporating the PCBTF from the surface-infused gel layer to cure flexible polymeric carrier. 11. The method of claim 10 where the at least one flexible polymeric carrier is a gelatinous A-B-A tri-block copolymer elastomer that comprises an A-B-A tri-block copolymer resin selected from the group consisting of styrene-ethylene-butylene-styrene (SEBS), styrene-ethylene-propylene-styrene (SEPS), styrene-ethylene-ethylene-propylene-styrene (SEEPS), styrene-butadiene-styrene (SBS), styrene-isoprene-styrene (SIS) and combinations thereof. 12. The method of claim 10 where the liquid gel mixture further comprises: a highly thermally-conductive material in the range of about 0.1% to about 95% by weight of the at least one cured flexible gel polymeric carrier layer after solvent loss; andthe highly thermally-conductive material is in solid form and has a thermal conductivity from about 100 W/(m-° K) to about 3500 W/(m-° K). 13. The method of claim 10 where the MPCM has a solid/liquid phase transition temperature from about 20° C. to about 35° C. and where the MPCM is present in the liquid gel mixture in the range of about 5% to about 80% by weight of the liquid gel mixture after solvent loss. 14. The method of claim 10 where the layering substrate is selected from the group consisting of open-celled polyether polyurethane foam, partially open-celled polyether polyurethane foam, reticulated polyurethane foam, high-resiliency polyether polyurethane foam, open-celled viscoelastic polyether polyurethane foam, partially open-celled viscoelastic polyether polyurethane foam, open-celled polyester polyurethane foam, partially open-celled polyester polyurethane foam, open-celled polyester foam, partially open-celled polyester foam, latex foam, melamine foam, and combinations thereof. 15. A method of forming a surface-infused gel layer with a spraying system comprising: forming a liquid gel mixture comprising at least one flexible polymeric carrier in parachlorobenzotrifluoride (PCBTF) and comprising at least one microencapsulated phase change material (MPCM); andspray coating a layering substrate with the liquid gel material to give a surface-infused gel layer on the layering substrate; andevaporating the PCBTF from the surface-infused gel layer to cure flexible polymeric carrier. 16. The method of claim 15 further comprising compressing the layering substrate in the range of from about 0.1% to about 90%. 17. The method of claim 15 where the at least one flexible polymeric carrier is a gelatinous A-B-A tri-block copolymer elastomer that comprises an A-B-A tri-block copolymer resin selected from the group consisting of styrene-ethylene-butylene-styrene (SEBS), styrene-ethylene-propylene-styrene (SEPS), styrene-ethylene-ethylene-propylene-styrene (SEEPS), styrene-butadiene-styrene (SBS), styrene-isoprene-styrene (SIS) and combinations thereof. 18. The method of claim 15 where the liquid gel mixture further comprises: a highly thermally-conductive material in the range of about 0.1% to about 95% by weight of the at least one cured flexible gel polymeric carrier layer after solvent loss; andthe highly thermally-conductive material is in solid form and has a thermal conductivity from about 100 W/(m-° K) to about 3500 W/(m-° K). 19. The method of claim 15 where the MPCM has a solid/liquid phase transition temperature from about 20° C. to about 35° C. and where the MPCM is present in the liquid gel mixture in the range of about 5% to about 80% by weight of the liquid gel mixture after solvent loss. 20. The method of claim 15 where the layering substrate is selected from the group consisting of open-celled polyether polyurethane foam, partially open-celled polyether polyurethane foam, reticulated polyurethane foam, high-resiliency polyether polyurethane foam, open-celled viscoelastic polyether polyurethane foam, partially open-celled viscoelastic polyether polyurethane foam, open-celled polyester polyurethane foam, partially open-celled polyester polyurethane foam, open-celled polyester foam, partially open-celled polyester foam, latex foam, melamine foam, and combinations thereof.