Light source module and display apparatus having the same
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
G09F-009/33
H01L-027/15
F21V-009/14
F21V-008/00
H01L-033/50
H01L-033/62
H05B-033/08
G09F-013/00
H01L-025/075
출원번호
US-0218483
(2016-07-25)
등록번호
US-10204962
(2019-02-12)
우선권정보
KR-10-2015-0160588 (2015-11-16)
발명자
/ 주소
Cha, Nam Goo
Kim, Ki Seok
Lee, Yun Hee
출원인 / 주소
Samsung Electronics Co., Ltd.
대리인 / 주소
Harness, Dickey & Pierce, P.L.C.
인용정보
피인용 횟수 :
0인용 특허 :
58
초록▼
A display apparatus may include a light source module that may include a substrate having a plurality of chip mounting areas of which each has a connection pad disposed therein, and a plurality of semiconductor light emitting devices electrically coupled to separate connection pads. The display appa
A display apparatus may include a light source module that may include a substrate having a plurality of chip mounting areas of which each has a connection pad disposed therein, and a plurality of semiconductor light emitting devices electrically coupled to separate connection pads. The display apparatus may include a black matrix on the substrate and having a plurality of holes corresponding to the pattern of chip mounting areas. The semiconductor light emitting devices may be in separate, respective holes to be electrically coupled to separate connection pads. The display apparatus may include unit pixels, where each unit pixel includes multiple adjacent semiconductor light emitting devices. The semiconductor light emitting devices may be removably coupled to separate connection pads, and a semiconductor light emitting device may be interchangeably swapped from a connection pad.
대표청구항▼
1. A light source module, comprising: a substrate including a plurality of chip mounting areas, each chip mounting area including a connection pad;a black matrix on the substrate, the black matrix including a plurality of holes, the plurality of holes being in a pattern of holes, the pattern of hole
1. A light source module, comprising: a substrate including a plurality of chip mounting areas, each chip mounting area including a connection pad;a black matrix on the substrate, the black matrix including a plurality of holes, the plurality of holes being in a pattern of holes, the pattern of holes corresponding to a pattern of the chip mounting areas on the substrate; anda plurality of semiconductor light emitting devices in separate, respective holes of the plurality of holes, such that the semiconductor light emitting devices are electrically coupled to separate connection pads of separate, respective chip mounting areas corresponding to the separate, respective holes, wherein each of the plurality of semiconductor light emitting devices includes,a light emitting diode (LED) chip, the LED chip including an electrode pad on one side of the LED chip, anda light guide unit with a first surface in contact with an opposite side of the LED chip, the light guide unit being configured to emit light generated by the LED chip into an exterior environment,wherein the light guide unit includes a rod-shaped structure, and the rod-shaped structure is configured to extend in a longitudinal direction that is substantially perpendicular to the opposite side of the LED chip,wherein each of the light emitting devices are configured to be clamped to a vacuum chuck and inserted into one hole of the plurality of holes to be tested to determine if the each of the light emitting devices is defective, and wherein each of the light emitting devices are configured to be selectively removed in response to being determined to be defective. 2. The light source module of claim 1, wherein, a top surface of the black matrix is below a top surface of each of the semiconductor light emitting devices, such that the plurality of semiconductor light emitting devices protrude from the black matrix. 3. The light source module of claim 1, wherein the light guide unit includes, a second surface opposing the first surface, anda third surface between the first surface and the second surface, wherein the third surface couples the first surface and the second surface. 4. The light source module of claim 3, wherein, the first surface defines a light incident surface configured to receive light emitted by the LED chip into the light guide unit, andthe second surface and the third surface define a light emission surface configured to emit light inside the light guide unit to the exterior environment. 5. The light source module of claim 3, wherein the second surface includes one of, a planar structure,a structure recessed toward the first surface,a concave and convex structure, ora dome-shaped protruding structure. 6. The light source module of claim 1, wherein, the LED chip includes,a first conductivity type semiconductor layer,a second conductivity type semiconductor layer, andan active layer between the first and second conductivity type semiconductor layers, andthe electrode pad includes,a first pad connected to the first conductivity type semiconductor layer, anda second pad connected to the second conductivity type semiconductor layer. 7. The light source module of claim 1, further including, a wavelength conversion layer covering each of the plurality of semiconductor light emitting devices on the black matrix. 8. The light source module of claim 1, wherein, the pattern of holes extends in a transverse direction and the longitudinal direction. 9. The light source module of claim 1, wherein a lateral surface of the substrate is substantially coplanar with a lateral surface of the black matrix. 10. The light source module of claim 1, wherein a thickness of the black matrix is greater than a thickness of the LED chip, and the thickness of the black matrix is less than a sum of thicknesses of the LED chip and the light guide unit. 11. A display apparatus, comprising: a light source module, the light source module including,a substrate,a black matrix covering the substrate, the black matrix including a plurality of holes, anda plurality of semiconductor light emitting devices detachably located in separate, respective holes of the plurality of holes;a cover layer covering the black matrix and the plurality of semiconductor light emitting devices; anda housing at least partially enclosing the light source module wherein each of the plurality of semiconductor light emitting devices includes,a light emitting diode (LED) chip, the LED chip including an electrode pad on one side of the LED chip, anda light guide unit with a first surface in contact with an opposite side of the LED chip, the light guide unit being configured to emit light generated by the LED chip into an exterior environment,wherein the light guide unit includes a rod-shaped structure, and the rod-shaped structure is configured to extend in a longitudinal direction that is substantially perpendicular to the opposite side of the LED chip,wherein each of the light emitting devices are configured to be clamped to a vacuum chuck and inserted into one hole of the plurality of holes to be tested to determine if the each of the light emitting devices is defective, and wherein each of the light emitting devices are configured to be selectively removed in response to being determined to be defective. 12. The display apparatus of claim 11, wherein, the plurality of semiconductor light emitting devices include a set of adjacent semiconductor light emitting devices, the set of adjacent light emitting devices being a unit pixel. 13. The display apparatus of claim 11, wherein, one or more portions of the plurality of semiconductor light emitting devices in the plurality of holes protrude from the black matrix, andthe one or more portions of the plurality of semiconductor light emitting devices are embedded inside the cover layer. 14. The display apparatus of claim 11, wherein, one or more portions of the plurality of semiconductor light emitting devices protrude upwardly from the black matrix while being disposed in the plurality of holes, respectively, protrudes upwardly from the black matrix, andeach semiconductor light emitting device of the plurality of semiconductor light emitting devices includes a wavelength conversion layer, the wavelength conversion layer being configured to cover the one or more portions of each semiconductor light emitting device protruding from the black matrix. 15. The display apparatus of claim 11, further comprising: a polarizing filter layer configured to cover the cover layer. 16. The display apparatus of claim 11, further comprising: a driving unit configured to drive the plurality of semiconductor light emitting devices. 17. A controller device, comprising: a memory storing computer-readable instructions; anda processor configured to execute the computer-readable instructions to,form a black matrix on a substrate, the black matrix including a plurality of holes, the plurality of holes being in a pattern of holes, the pattern of holes corresponding to a pattern of connection pads on the substrate; andinsert a plurality of semiconductor light emitting devices in separate, respective holes of the plurality of holes, such that the semiconductor light emitting devices are electrically coupled to separate connection pads corresponding to the separate, respective holes,wherein each of the light emitting devices are configured to be clamped to a vacuum chuck and inserted into one of the plurality of holes to be tested to determine if the each of the light emitting devices is defective, and wherein each of the light emitting devices are configured to be selectively removed in response to being determined to be defective. 18. The controller device of claim 17, wherein the processor is further configured to execute computer-readable instructions to, remove a particular semiconductor light emitting device from a corresponding hole of the plurality of holes, based on a determination that the semiconductor light emitting device emits less than a threshold amount of light concurrently with at least a threshold amount of electrical power being supplied to the semiconductor light emitting device through a connection pad to which the semiconductor light emitting device is electrically coupled. 19. The controller device of claim 18, wherein the processor is further configured to execute computer-readable instructions to, control a supply of electrical power to the semiconductor light emitting device, such that at least the threshold amount of electrical power is supplied to the semiconductor light emitting device through the connection pad to which the semiconductor light emitting device is electrically coupled; andcontrol a sensor device to generate sensor data indicating an amount of light emitted by the semiconductor light emitting device, concurrently with the controlling the supply of electrical power; and processing the sensor data to determine whether the semiconductor light emitting device emits at least the threshold amount of light concurrently with being supplied at least the threshold amount of electrical power. 20. The controller device of claim 17, wherein the processor is further configured to execute computer-readable instructions to, insert the plurality of semiconductor light emitting devices in separate, respective holes of the plurality of holes according to a particular pattern of semiconductor light emitting devices.
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