Casing for reducing airflow resistance, cooling device, and server using the same
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H05K-007/20
H05K-007/14
G11B-033/14
출원번호
US-0963178
(2018-04-26)
등록번호
US-10225956
(2019-03-05)
우선권정보
CN-2018 1 0121758 (2018-02-07)
발명자
/ 주소
Lee, Chia-Chen
출원인 / 주소
HONGFUJIN PRECISION ELECTRONICS(TIANJIN)CO., LTD.
대리인 / 주소
ScienBiziP, P.C.
인용정보
피인용 횟수 :
0인용 특허 :
4
초록▼
A cooling device applied to a server or other casing reduces airflow resistance. A covered chassis defines a accommodating groove and includes two opposite ends, an air inlet located at one end and an air outlet located at the other end, the air outlet communicating with the air inlet. The cover of
A cooling device applied to a server or other casing reduces airflow resistance. A covered chassis defines a accommodating groove and includes two opposite ends, an air inlet located at one end and an air outlet located at the other end, the air outlet communicating with the air inlet. The cover of the chassis is mounted adjacent a side of the chassis and seals the accommodating groove. The cover defines first and second openings corresponding to the accommodating groove. Part of cooling air exits the casing through the accommodating groove and the air outlet, the rest of the cooling air exits the casing through the first opening, re-enters the casing through the second opening and exits the casing through the air outlet.
대표청구항▼
1. A casing for reducing airflow resistance, comprising: a chassis defining a accommodating groove configured to accommodate electronic components, the chassis comprising: two opposite ends;an air inlet defined adjacent one end of the chassis; andan air outlet defined adjacent the other end of the c
1. A casing for reducing airflow resistance, comprising: a chassis defining a accommodating groove configured to accommodate electronic components, the chassis comprising: two opposite ends;an air inlet defined adjacent one end of the chassis; andan air outlet defined adjacent the other end of the chassis and is in fluid communication with the air inlet; anda cover mounted adjacent a side of the chassis and configured to seal the accommodating groove, the cover defines a first opening and a second opening, the first opening and the second opening are corresponding to the accommodating groove and in fluid communication with the accommodating groove;wherein cooling air gets into the accommodating groove through the air inlet, and a part of the cooling air exits the casing through the accommodating groove and the air outlet; and the rest of the cooling air exits the casing through the first opening, and gets into the casing again through the second opening, and exits the casing through the air outlet. 2. The casing of claim 1, wherein the casing further comprises a solid block attached to an inner surface of the cover, and the solid block is corresponding to the accommodating groove. 3. The casing of claim 2, wherein the solid block is located between the first opening and the second opening. 4. The casing of claim 1, wherein the chassis further comprises a first mounting members configured to mount a hard disks, and the first mounting members are fixed in the accommodating groove. 5. The casing of claim 1, wherein the chassis further comprises a second mounting member configured to mount a cooling fan, and the second mounting member is fixed in the air outlet. 6. The casing of claim 1, wherein the chassis is a cuboid box with an open side, and the cover is mounted adjacent the open side of the chassis; and the air inlet and the air outlet are located at two opposite ends of the length direction of the cuboid box. 7. The casing of claim 1, wherein the first opening and the second opening are rectangular openings of same width, and the length of the first opening is larger than the length of the second opening. 8. A cooling device comprising: a casing for reducing airflow resistance, comprising: a chassis defining a accommodating groove configured to accommodate electronic components, the chassis comprises two opposite ends and:an air inlet located at one end of the chassis; andan air outlet located at the other end of the chassis and is in fluid communication with the air inlet; anda cover mounted adjacent a side of the chassis, the cover defines a first opening and a second opening, the first opening and the second opening are corresponding to the accommodating groove and in fluid communication with the accommodating groove; anda cooling fan mounted adjacent the air inlet or the air outlet;wherein cooling air gets into the accommodating groove through the air inlet, and a part of the cooling air exits the casing through the accommodating groove and the air outlet, the rest of the cooling air exits the casing through the first opening, and gets into the casing again through the second opening and exits the casing through the air outlet. 9. The cooling device of claim 8, wherein the casing further comprises a solid block attached to an inner surface of the cover, and the solid block is corresponding to the accommodating groove. 10. The cooling device of claim 9, wherein the solid block is located between the first opening and the second opening. 11. The cooling device of claim 8, wherein the chassis further comprises a first mounting members configured to mount a hard disks, and the first mounting members are fixed in the accommodating groove. 12. The cooling device of claim 8, wherein the chassis further comprises a second mounting member configured to mount a cooling fan, and the second mounting member is fixed in the air outlet. 13. The cooling device of claim 8, wherein the chassis is a cuboid box with an open side, and the cover is mounted adjacent the open side of the chassis; the air inlet and the air outlet are located at two opposite ends of the length direction of the cuboid box. 14. The cooling device of claim 8, wherein the first opening and the second opening are rectangular openings of same width, and the length of the first opening is larger than the length of the second opening. 15. A server comprising: a hard disks; anda cooling device for cooling the hard disks, comprising: a casing for reducing airflow resistance, comprising:a chassis defining a accommodating groove configured to accommodate electronic components, the chassis comprises two opposite ends and:an air inlet located at one end of the chassis; andan air outlet located at the other end of the chassis and is in fluid communication with the air inlet; anda cover mounted adjacent a side of the chassis and configured to seal the accommodating groove, the cover defines a first opening and a second opening, the first opening and the second opening are corresponding to the accommodating groove and in fluid communication with the accommodating groove; anda cooling fan mounted adjacent the air inlet or the air outlet;wherein cooling air gets into the accommodating groove through the air inlet, and a part of the cooling air exits the casing through the accommodating groove and the air outlet, the rest of the cooling air exits the casing through the first opening, and gets into the casing again through the second opening and exits the casing through the air outlet. 16. The server of claim 15, wherein the casing further comprises a solid block attached to an inner surface of the cover, and the solid block is corresponding to the accommodating groove. 17. The server of claim 16, wherein the solid block is located between the first opening and the second opening. 18. The server of claim 15, wherein the chassis further comprises: a first mounting members configured to mount a hard disks, and the first mounting members are fixed in the accommodating groove; anda second mounting member configured to mount a cooling fan, and the second mounting member is fixed in the air outlet;wherein the cooling fan is a suction fan. 19. The server of claim 15, wherein the chassis is a cuboid box with an open side, and the cover is mounted adjacent the open side of the chassis; the air inlet and the air outlet are located at two opposite ends of the length direction of the cuboid box. 20. The server of claim 15, wherein the first opening and the second opening are rectangular openings of same width, and the length of the first opening is larger than the length of the second opening.
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이 특허에 인용된 특허 (4)
Tang, Xian-Xiu, Heat dissipation apparatus and electronic device using the same.
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