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Kafe 바로가기국가/구분 | United States(US) Patent 등록 |
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국제특허분류(IPC7판) |
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출원번호 | US-0793978 (2015-07-08) |
등록번호 | US-10231777 (2019-03-19) |
발명자 / 주소 |
|
출원인 / 주소 |
|
인용정보 | 피인용 횟수 : 0 인용 특허 : 624 |
A method of manufacturing a jaw member of an end-effector assembly includes forming one or more stress-relief cavities within a sealing plate. Each one of the one or more stress-relief cavities defines a pad portion of an electrically-conductive surface of the sealing plate. The method also includes
A method of manufacturing a jaw member of an end-effector assembly includes forming one or more stress-relief cavities within a sealing plate. Each one of the one or more stress-relief cavities defines a pad portion of an electrically-conductive surface of the sealing plate. The method also includes forming a stop member on each pad portion of the electrically-conductive surface of the sealing plate, performing an overmolding operation wherein the one or more stress-relief cavities is configured to prevent force applied to a bottom surface of the sealing plate during the overmolding operation from stressing each pad portion to avoid compromising adhesion between the stop member and the electrically-conductive surface of the sealing plate.
1. A method of manufacturing a jaw member of an end-effector assembly, comprising: forming at least one stress-relief cavity in an electrically-conductive surface of a sealing plate, each one of the at least one stress-relief cavities defining a pad portion having a pad surface coincident with the r
1. A method of manufacturing a jaw member of an end-effector assembly, comprising: forming at least one stress-relief cavity in an electrically-conductive surface of a sealing plate, each one of the at least one stress-relief cavities defining a pad portion having a pad surface coincident with the remainder of the electrically-conductive surface of the sealing plate; anddepositing a material on the pad surface of each pad portion to form a stop member thereon, each pad portion surrounded by one of the at least one stress-relief cavities, each one of the at least one stress-relief cavities functioning as a wetting ring to limit the spread of the material, wherein each one of the at least one stress-relief cavities is configured to prevent force applied to a bottom surface of the sealing plate during an overmolding operation from stressing each pad portion to avoid compromising adhesion between the stop member and the pad surface of the electrically-conductive surface of the sealing plate. 2. The method of claim 1, wherein depositing a material on each pad portion includes depositing a heat-resistant ceramic on each pad portion. 3. The method of claim 1, wherein forming the at least one stress-relief cavity within the sealing plate includes forming at least one stress-relief cavity including a first portion configured to function as a wetting ring. 4. The method of claim 3, wherein forming the at least one stress-relief cavity within the sealing plate further includes forming at least one stress-relief cavity including a second portion configured to provide a stress-relief point that is offset from the pad portion. 5. The method of claim 1, wherein forming the at least one stress-relief cavity within the sealing plate includes forming at least one stress-relief cavity that is defined by a first wall, a second wall, and a third wall. 6. The method of claim 5, wherein forming the at least one stress-relief cavity that is defined by the first wall, the second wall, and the third wall includes the first wall defining the pad portion. 7. The method of claim 6, wherein forming the at least one stress-relief cavity that is defined by the first wall, the second wall, and the third wall includes providing a stress-relief point at a bottom of the second wall that is offset from the first wall by the third wall.
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