An electronic device housing includes a first housing, a second housing, and a foaming buffer unit. The first housing has a first inner surface, and the first inner surface has a first abutting area. The second housing has a second inner surface, where the second inner surface has a second abutting
An electronic device housing includes a first housing, a second housing, and a foaming buffer unit. The first housing has a first inner surface, and the first inner surface has a first abutting area. The second housing has a second inner surface, where the second inner surface has a second abutting area, the second housing is connected to the first housing, and the second inner surface is opposite to the first inner surface. The foaming buffer unit is disposed between the first inner surface and the second inner surface, and abuts against the first abutting area of the first inner surface and the second abutting area of the second inner surface.
대표청구항▼
1. An electronic device housing, comprising: a first housing having a first inner surface, wherein the first inner surface has a first abutting area, wherein an area of the first abutting area takes up 30-100% of an area of the first inner surface;a second housing having a second inner surface, wher
1. An electronic device housing, comprising: a first housing having a first inner surface, wherein the first inner surface has a first abutting area, wherein an area of the first abutting area takes up 30-100% of an area of the first inner surface;a second housing having a second inner surface, wherein the second inner surface has a second abutting area, wherein an area of the second abutting area takes up 30-100% of an area of the second inner surface, the second housing is connected to the first housing, and the second inner surface is opposite to the first inner surface; anda foaming buffer unit disposed between the first inner surface and the second inner surface, and abutting against the first abutting area of the first inner surface and the second abutting area of the second inner surface. 2. The electronic device housing according to claim 1, wherein a range of the first abutting area covers a portion of the first inner surface, a range of the second abutting area covers a portion of the second inner surface, the foaming buffer unit comprises a first foaming buffer member, the first foaming buffer member has a first outer surface, and the first outer surface of the first foaming buffer member abuts against the first abutting area and the second abutting area. 3. The electronic device housing according to claim 2, wherein the foaming buffer unit further comprises a second foaming buffer member and a third foaming buffer member, the second foaming buffer member has a second outer surface, the third foaming buffer member has a third outer surface, a portion of the second outer surface abuts against the first abutting area of the first inner surface and the third outer surface, and a portion of the third outer surface abuts against the second abutting area of the second inner surface and the second outer surface. 4. The electronic device housing according to claim 2, wherein the foaming buffer unit further comprises a fourth foaming buffer member, the fourth foaming buffer member has a fourth outer surface, a first electronic component is accommodated between the first housing and the second housing, the first electronic component is fixed at the second inner surface, and a portion of the fourth outer surface of the fourth foaming buffer member abuts against the first abutting area of the first inner surface and the first electronic component. 5. The electronic device housing according to claim 2, wherein the foaming buffer unit further comprises a fifth foaming buffer member, the fifth foaming buffer member has a fifth outer surface, a second electronic component is accommodated between the first housing and the second housing, and a portion of the fifth outer surface of the fifth foaming buffer member abuts against the second abutting area of the second inner surface and the second electronic component. 6. The electronic device housing according to claim 2, wherein the foaming buffer unit further comprises a seventh foaming buffer member, the seventh foaming buffer member has a seventh outer surface, a fourth electronic component and a fifth electronic component are accommodated between the first housing and the second housing, and a portion of the seventh outer surface of the seventh foaming buffer member abuts against the fourth electronic component and the fifth electronic component. 7. The electronic device housing according to claim 1, wherein the first abutting area and the second abutting area respectively comprise a plurality of abutting blocks. 8. An electronic device housing, comprising: a first housing having a first inner surface, wherein the first inner surface has a first abutting area;a second housing having a second inner surface, wherein the second inner surface has a second abutting area, the second housing is connected to the first housing, and the second inner surface is opposite to the first inner surface; anda foaming buffer unit disposed between the first inner surface and the second inner surface, and abutting against the first abutting area of the first inner surface and the second abutting area of the second inner surface, wherein a range of the first abutting area covers the entire first inner surface, a range of the second abutting area covers the entire second inner surface, the foaming buffer unit comprises a first foaming buffer member, the first foaming buffer member has a first outer surface, and the first outer surface of the first foaming buffer member abuts against the first abutting area and the second abutting area.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (5)
Jung, Dong Hoon; Shim, Kyu-Hun; Ye, Sang Heon; Yoo, Jae Suk; Lee, Hyun Woo, Display module of display device.
Peters, David E.; Thayer, Ross Kenneth; Chamberlain, Jason Conrad; Howard, John Avery, Electronic device housing having a low-density component and a high-stiffness component.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.