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A rivetable adhesive for use in a joint between dissimilar materials, comprising a liquid epoxy resin, an expoxidized polysulfide, a flexibilizer, a solid epoxy CTBN adduct based upon bisphenol A, a phenoxy resin, an impact modifier including methacrylate-butadiene-styrene, a curing agent; and a blo

A rivetable adhesive for use in a joint between dissimilar materials, comprising a liquid epoxy resin, an expoxidized polysulfide, a flexibilizer, a solid epoxy CTBN adduct based upon bisphenol A, a phenoxy resin, an impact modifier including methacrylate-butadiene-styrene, a curing agent; and a blowing agent. The adhesive finds particular suitability for use in riveting aluminum panels to steel structures, such as for forming automotive vehicle roof structures.

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1. A rivetable adhesive for use in a joint between dissimilar materials, comprising: a. a first liquid epoxy resin in an amount of about 15 to about 25 parts by weight per 100 parts by weight of the rivetable adhesive and a second liquid epoxy resin in amount of about 3 to about 20 parts by weight p

1. A rivetable adhesive for use in a joint between dissimilar materials, comprising: a. a first liquid epoxy resin in an amount of about 15 to about 25 parts by weight per 100 parts by weight of the rivetable adhesive and a second liquid epoxy resin in amount of about 3 to about 20 parts by weight per 100 parts by weight of the rivetable adhesive;b. an expoxidized polysulfide;c. a flexibilizer;d. a solid epoxy CTBN adduct based upon bisphenol A in an amount not greater than about 15 parts by weight per 100 parts by weight of the rivetable adhesive;e. a phenoxy resin;f. an impact modifier including methacrylate-butadiene-styrene;g. a curing agent; andh. a blowing agent having a decomposition temperature of about 190 to about 220° C.; andwherein the adhesive exhibits a capillary viscosity of below 800 PaS for a shear rate of 100 sec−1 or higher at a temperature of 70 or 90° C.;wherein a ratio of the amount by weight of the first liquid epoxy resin to the amount by weight of the second liquid epoxy resin is from about 1.6:1 to about 2.4:1; andwherein the decomposition temperature of the blowing agent facilitates robotic application such that the adhesive is heated to be applied above room temperature, but below a temperature at which it would be activated for curing, expanding or both curing and expanding. 2. The adhesive of claim 1, wherein the first liquid epoxy resin has an epoxide equivalent weight (g/eq) per ASTM D-1652-11e1 of about 182-192. 3. The adhesive of claim 1, wherein the impact modifier is a core shell impact modifier. 4. The adhesive of claim 1, further including an aromatic substituted urea curing accelerator. 5. The adhesive of claim 3, wherein the first liquid epoxy resin is a resin reaction product of epichlorohydrin and bisphenol A having an epoxide equivalent weight per ASTM D-1652-11e1 of about 182 to about 192. 6. The adhesive of claim 1, wherein the second liquid epoxy resin has an epoxide equivalent weight (g/eq) per ASTM D-1652-11e1 of about 320. 7. The adhesive of claim 6, wherein the second liquid epoxy resin is a reaction product of an epichlorohydrin and a polypropylene glycol. 8. The adhesive of claim 1, wherein the flexibilizer is present in an amount of about 1 to about 5 parts by weight of the adhesive. 9. The adhesive of claim 1, wherein the impact modifier is present in an amount of about 15 to about 25 parts by weight of the adhesive. 10. The adhesive of claim 9, wherein the solid epoxy CTBN adduct based upon bisphenol A is present in an amount of about 3 to about 15 parts by weight of the adhesive. 11. The adhesive of claim 1, wherein the phenoxy resin is present in an amount of about 15 to about 30 parts by weight of the adhesive. 12. A rivetable adhesive for use in a joint between dissimilar materials, comprising an admixture of: a. a first liquid epoxy resin including a liquid epoxy resin reaction product of epichlorohydrin and bisphenol A and having an epoxide equivalent weight per ASTM D-1652-11e1 of about 182 to about 192;b. about 10 to about 20 parts by weight of an epoxidized polysulfide;c. a second liquid epoxy resin including a liquid epoxy resin reaction product of an epichlorohydrin and a polypropylene glycol;d. about 1 to about 5 parts by weight of a flexibilizer;e. about 3 to about 15 parts by weight of a solid epoxy carboxyl terminated butadiene-acrylontirile (CTBN) adduct based upon bisphenol A;f. a blowing agent having a decomposition temperature of about 190 to about 220° C.; andwherein the ratio of the amount by weight of the first liquid epoxy resin to the amount by weight of the second liquid epoxy resin in the adhesive is from about 1.6:1 to about 2.4:1;wherein the adhesive exhibits a capillary viscosity of below 800 PaS for a shear rate of 100 sec−1 or higher at a temperature of 70 or 90° C.; andwherein the decomposition temperature of the blowing agent facilitates robotic application such that the adhesive is heated to be applied above room temperature, but below a temperature at which it would be activated for curing, expanding or both curing and expanding. 13. The adhesive of claim 1, wherein the adhesive further includes about 0.5 to about 3 parts by weight of calcined kaolin. 14. A rivetable adhesive according to claim 1, wherein the adhesive exhibits a capillary viscosity in the range of about 100 to about 700 PaS for a shear rate of about 100 to about 1000 sec−1 at a temperature of 70 or 90° C. 15. A rivetable adhesive according to claim 11, wherein the adhesive exhibits a capillary viscosity in the range of about 100 to about 400 PaS for a shear rate of about 400 to about 1000 sec−1 at a temperature of 70 or 90° C. 16. A rivetable adhesive according to claim 12, wherein the adhesive exhibits a capillary viscosity in the range of about 100 to about 700 PaS for a shear rate of about 100 to about 1000 sec−1 at a temperature of 70 or 90° C. 17. A rivetable adhesive according to claim 12, wherein the adhesive exhibits a capillary viscosity in the range of about 100 to about 400 PaS for a shear rate of about 400 to about 1000 sec−1 at a temperature of 70 or 90° C. 18. The adhesive of claim 1, wherein the viscosity of the adhesive is adapted to allow for robotic application of the adhesive via a robotic arm and applicator. 19. The adhesive of claim 1, wherein an amount of the solid epoxy CTBN adduct based upon bisphenol A relative to an amount of the impact modifier including methacrylate-butadiene-styrene is about 5 parts by weight of the solid epoxy CTBN adduct based upon bisphenol A to about 20 parts by weight of the impact modifier including methacrylate-butadiene-styrene.