A mold transfer assembly includes a transfer housing providing an interior defined by one or more sidewalls and a top. The transfer housing is sized to receive and encapsulate a mold as the mold is moved between a furnace and a thermal heat sink. An arm is coupled to the transfer housing to move the
A mold transfer assembly includes a transfer housing providing an interior defined by one or more sidewalls and a top. The transfer housing is sized to receive and encapsulate a mold as the mold is moved between a furnace and a thermal heat sink. An arm is coupled to the transfer housing to move the transfer housing and the mold encapsulated within the transfer housing between the furnace and a thermal heat sink. The transfer housing exhibits one or more thermal properties to control a thermal profile of the mold.
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1. A mold transfer assembly, comprising: a transfer housing including a first half-cylinder and a second half-cylinder, wherein the first half-cylinder and the second half-cylinder provide an interior defined by one or more sidewalls and a top, the transfer housing being sized to receive and encapsu
1. A mold transfer assembly, comprising: a transfer housing including a first half-cylinder and a second half-cylinder, wherein the first half-cylinder and the second half-cylinder provide an interior defined by one or more sidewalls and a top, the transfer housing being sized to receive and encapsulate a mold, for moving the mold between a furnace and a thermal heat sink; andan arm coupled to the transfer housing to move the transfer housing and the mold encapsulated within the transfer housing between the furnace and the thermal heat sink, wherein the transfer housing exhibits one or more thermal properties to control a thermal profile of the mold, and wherein the one or more thermal properties vary along a height of the transfer housing. 2. The mold transfer assembly of claim 1, further comprising an insulation enclosure sized to receive the mold. 3. The mold transfer assembly of claim 2, wherein the insulation enclosure is further sized to receive the mold while encapsulated by the transfer housing. 4. The mold transfer assembly of claim 1, wherein the transfer housing comprises a clam-shell design wherein the first half-cylinder and the second half-cylinder are actuatable between an open position to receive the mold and a closed position to encapsulate the mold. 5. The mold transfer assembly of claim 1, further comprising one or more internal features defined on one or more inner surfaces of the transfer housing to maintain the mold at least one of radially and axially offset from the transfer housing. 6. The mold transfer assembly of claim 1, wherein the one or more thermal properties vary about a circumference of the transfer housing. 7. The mold transfer assembly of claim 1, wherein the transfer housing comprises: a support structure that provides the one or more sidewalls and the top; anda thermal material coupled to or supported by the support structure, wherein the thermal material exhibits the one or more thermal properties that control the thermal profile of the mold. 8. The mold transfer assembly of claim 7, wherein the thermal material is an insulation material selected from the group consisting of a ceramic, ceramic fibers, a ceramic fabric, a ceramic wool, ceramic beads, ceramic blocks, a moldable ceramic, a woven ceramic, a cast ceramic, fire bricks, carbon fibers, graphite, graphite blocks, a shaped graphite block, a nanocomposite, a fluid in a jacket, a metal, a metal fabric, a metal foam, a metal wool, a metal casting, any composite thereof, and any combination thereof. 9. The mold transfer assembly of claim 7, wherein the support structure comprises an outer frame, an inner frame, and a cavity defined between the outer and inner frames, and wherein the thermal material comprises a fluid or vacuum sealed within the cavity. 10. The mold transfer assembly of claim 7, wherein the thermal material operates as a thermal reservoir or thermal mass and comprises a material selected from the group consisting of a metal, a salt, a ceramic, fireclay, fire brick, stone, graphite, a phase-changing material, a fluid sealed within a vessel, and any combination thereof. 11. The mold transfer assembly of claim 7, wherein the support structure comprises at least one of an outer frame and an inner frame, and wherein a reflective coating is applied to a surface of at least one of the outer and inner frames. 12. The mold transfer assembly of claim 7, wherein the support structure comprises at least one of an outer frame and an inner frame, and wherein a thermal barrier is applied to a surface of at least one of the outer and inner frames. 13. The mold transfer assembly of claim 1, wherein the transfer housing comprises a radiant barrier made of a material selected from the group consisting of aluminum oxide, aluminum nitride, silicon carbide, silicon nitride, quartz, titanium carbide, titanium nitride, a boride, carbides, a nitride, an oxide, iron, chromium, copper, carbon steel, maraging steel, stainless steel, microalloyed steel, low alloy steel, molybdenum, nickel, platinum, silver, gold, tantalum, tungsten, titanium, aluminum, cobalt, rhenium, osmium, palladium, iridium, rhodium, ruthenium, manganese, niobium, vanadium, zirconium, hafnium, any derivative thereof, any alloy based thereon, and any combination thereof. 14. The mold transfer assembly of claim 1, further comprising one or more thermal elements coupled to or supported by the transfer housing to selectively and actively heat the mold, the one or more thermal elements being selected from the group consisting of a heating element, a heat exchanger, a radiant heater, an electric heater, an infrared heater, an induction heater, one or more induction coils, a heating band, one or more heated coils, a heated cartridge, resistive heating elements, a refractory and conductive metal coil, strip, or bar, a microwave emitter, a tuned microwave receptive material, or any combination thereof. 15. The mold transfer assembly of claim 1, further comprising one or more thermal conduits coupled to or supported by the transfer housing to circulate a thermal fluid and thereby selectively and actively heat the mold, wherein the thermal fluid is selected from the group consisting of a gas, water, steam, an oil, a molten metal, a molten metal alloy, a fluidized bed, a molten salt, a fluidic exothermic reaction, or any combination thereof.
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이 특허에 인용된 특허 (11)
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Frasier, Donald J.; Schlienger, M. Eric; Brady, Guy Allen; Kush, Matthew T.; Vessely, Patrick A., Method and apparatus for production of a cast component.
Frasier, Donald J.; Schlienger, M. Eric; Brady, Guy Allen; Kush, Matthew T.; Vessely, Patrick A., Method and apparatus for production of a cast component.
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