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A method for fabricating a semiconductor structure includes the following steps. A substrate including a dielectric material is formed. A surface of the substrate is molecularly modified to convert the surface of the substrate to a nitrogen-enriched surface. A metal layer is deposited on the molecul

A method for fabricating a semiconductor structure includes the following steps. A substrate including a dielectric material is formed. A surface of the substrate is molecularly modified to convert the surface of the substrate to a nitrogen-enriched surface. A metal layer is deposited on the molecularly modified surface of the substrate interacting with the molecularly modified surface to form a nitridized metal layer.

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1. A method for fabricating a semiconductor structure, comprising: forming a substrate, wherein the substrate comprises a dielectric material;molecularly modifying at least a portion of a surface of the substrate to convert at least a portion of the surface of the substrate to a nitrogen-enriched su

1. A method for fabricating a semiconductor structure, comprising: forming a substrate, wherein the substrate comprises a dielectric material;molecularly modifying at least a portion of a surface of the substrate to convert at least a portion of the surface of the substrate to a nitrogen-enriched surface, wherein the modifying step further comprises assembling a set of molecular components on at least a portion of the surface of the substrate, and wherein each molecule of the set comprises a first functional group, a second functional group selected from the group consisting of a nitrile, and an azide, and a connector; anddepositing a metal layer on the molecularly modified surface of the substrate, wherein the deposited metal layer interacts with the modified surface to form a nitridized metal layer. 2. The method of claim 1, wherein the first functional group is configured to bind to the surface of the substrate. 3. The method of claim 1, wherein the second functional group is configured to promote adhesion of the metal layer to the surface of the substrate. 4. The method of claim 1, wherein the connector joins the first functional group and the second functional group. 5. The method of claim 1, wherein the set of molecular components comprises a self-assembling monolayer. 6. The method of claim 1, wherein the surface of the substrate comprises one or more hydroxyl (OH) groups, and wherein the first functional group is configured to react with the one or more OH groups. 7. The method of claim 1, wherein the first functional group is a functional group selected from the group consisting of: siloxane, (HO)3-x—SiHx—, and (HO)4-x—CHx—. 8. The method of claim 1, wherein the connector is comprised of a functional group selected from the group consisting of methylene, —(SiH2)n—, and —(SimCnHp)z—. 9. The method of claim 1, wherein the first functional group is a functional group selected from the group consisting of siloxane, (HO)3-x—SiHx—, and (HO)4-x—CHx— and the connector is comprised of a functional group selected from the group consisting of methylene, —(SiH2)n—, and —(SimCnHp)z—. 10. The method of claim 1, wherein the modifying step further comprises performing a silylation process on at least a portion of the surface of the substrate. 11. The method of claim 1, wherein the dielectric material is a low-k dielectric material. 12. The method of claim 1, wherein the modifying step further comprises depositing molecules on at least a portion of the surface of the substrate, wherein the molecules are selected to react to surface hydroxyl groups of the dielectric material and form a self-assembling monolayer that terminates with a nitridizing functional group. 13. The method of claim 1, wherein the deposited metal layer forms a barrier layer that is conductive and mitigates contamination of material into the substrate. 14. The method of claim 1, wherein the metal layer depositing step further comprises depositing a non-nitridized metal material on the modified surface of the substrate such that the non-nitridized metal material becomes nitridized upon adhesion to the substrate. 15. The method of claim 14, wherein the non-nitridized metal material comprises tantalum (Ta). 16. The method of claim 14, wherein the non-nitridized metal material comprises titanium (Ti). 17. The method of claim 1, further comprising depositing a metal interconnect layer on the nitridized metal layer. 18. A semiconductor structure, comprising: a substrate, wherein the substrate comprises a dielectric material and a surface, wherein at least a portion of the surface of the substrate comprises a nitrogen-enriched surface, wherein the nitrogen-enriched surface comprises a set of molecular components, and wherein each molecule of the set comprises a first functional group, a second functional group selected from the group consisting of a nitrile, and an azide, and a connector; anda metal layer deposited on the nitrogen-enriched surface, wherein the deposited metal layer interacts with the nitrogen-enriched surface to form a nitridized metal layer. 19. The semiconductor structure of claim 18, wherein the first functional group is a functional group selected from the group consisting of siloxane, (HO)3-x—SiHx—, and (HO)4-x—CHx— and the connector is comprised of a functional group selected from the group consisting of methylene, —(SiH2)n—, and —(SimCnHp)z—. 20. An integrated circuit, comprising: a substrate, wherein the substrate comprises a dielectric material and a surface, wherein at least a portion of the surface of the substrate comprises a nitrogen-enriched surface, wherein the nitrogen-enriched surface comprises a set of molecular components, and wherein each molecule of the set comprises a first functional group, a second functional group selected from the group consisting of a nitrile, and an azide, and a connector;a metal layer deposited on the nitrogen-enriched surface, wherein the deposited metal layer interacts with the nitrogen-enriched surface to form a nitridized metal layer; anda metal interconnect layer deposited on the nitridized metal layer.