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Tamper-proof electronic packages formed with stressed glass

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G06F-021/00
  • H05K-001/02
  • H05K-001/18
  • H05K-005/02
  • G06F-021/87
출원번호 US-0831534 (2017-12-05)
등록번호 US-10257924 (2019-04-09)
발명자 / 주소
  • Busby, James A.
  • Dragone, Silvio
  • Fisher, Michael J.
  • Gaynes, Michael A.
  • Long, David C.
  • Rodbell, Kenneth P.
  • Santiago-Fernandez, William
  • Weiss, Thomas
출원인 / 주소
  • INTERNATIONAL BUSINESS MACHINES CORPORATION
대리인 / 주소
    Poltavets, Esq., Tihon
인용정보 피인용 횟수 : 0  인용 특허 : 139

초록

Tamper-proof electronic packages and fabrication methods are provided which include a glass enclosure enclosing, at least in part, at least one electronic component within a secure volume, and a tamper-respondent detector. The glass enclosure includes stressed glass with a compressively-stressed sur

대표청구항

1. A tamper-proof electronic package comprising: a glass enclosure enclosing, at least in part, at least one electronic component within a secure volume, the glass enclosure being a multi-sided glass enclosure comprising stressed glass with a compressively-stressed surface layer, the multi-sided gla

이 특허에 인용된 특허 (139)

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