Electronics industry has been rapidly progressed, therefore new demands are being placed on the materials comprising electronics devices. Improvements in polyimide propeties have been sought by incorporating trifluoromethyl or other perfluoroalkyl groups. Fluorinated polyimides have lower dielectric...
Electronics industry has been rapidly progressed, therefore new demands are being placed on the materials comprising electronics devices. Improvements in polyimide propeties have been sought by incorporating trifluoromethyl or other perfluoroalkyl groups. Fluorinated polyimides have lower dielectric constants, lower water absorption and higher solubility compared to fluorine-free polyimides. In this study, fluorinated diamine and dianhydrides were synthesized in order to incorporate fulorine into the polyimides. 1,1-bis(4-anunophenyl)-1-phenyl-2,2,2-trifluoro ethane (3F-DAM) which was incorporated with trfluoroethylidene group was synthesized in order to improve the thermal property and solubility of polyetherimides(PEIs). 2,2-bis[4-(3,4-dicarboxyphenoxy)phenylI hexafluoropropane dianhydride(6F-BPDA) and 1,1-bis[4-(3,4-dicar boxyphenoxy)phenyl]-1-phenyl-2,2,2-trifluoroethane dianhydride (3F -BPDA) were synthesized by replacing of center group of 2,2bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride(6H-BPDA) with hexafluoroisopropylidene(6F) and trifluoroethylidene(3F). Optical and electric properties of polyetherimides(PEI) obtained from these dianhydrides and various diamines were investigated. The viscosity of PEN using 2,2-bis(4-aminophenyl)hexafluoro propane(4BDAP) was lower than those of 3F-DAM. The hexafluoroisopropylidene(6F) group of 4BDAP was directly attatched to the aminophenyl ring and the electro-withdrawing character of 6F group is strong enough to decrease the basicity and thereby the reactivity of diamme. The glass transition temperature (Tg) of PEIs increased with increasing the rigidity of diamines and dianhydrides. The decomposition temperature of PEIs Was higher than 540`C and PEIs have an excellent thermal stability comparable to conventional polvimides. The Tg of PEIs produced with 3F-DAM and 6FBPDA or 3F-BPDA were 257C and 258V, respectively. These materials could withstand to welding temperature of 260℃ in the multichip device preparation. The most of the PEIs had a excellent solubility, because the bulky 6F, 3F group reduced intermolecular interaction and flexible ether linkage of dianhydride and diamine increased the chain mobility. PEIs produced with 3F-DANI were dissolved in NMP within 5 minutes. The dielectric constants and reflective indices were found to decrease Nvith increasing fluorine contents of the PEIs in the following order: 6H-BPDA > 3F-BPDA > 6F-BPDA. The dielectric constant and refractive index of fluorine-free 6H-BPDA 'B APP were 3.199 and 1.6767, respectively. The dielectric constant and refractive index of 6F-BPDA/4BDAP which has the highest fluorine contents in the repeating unit were 2.752 and 1.5630, respectively. The degree of orientation could be reduced with high heating rate during thermal imidization of polyamic acid. The diffrence of dielectric constants between in-plane and out-of-plane decreased with decreasing molecular orientation. The most of the PEN show an excellent optical transparency because the alkyl, trifluoromethyl and phenyl groups not only eliminate electronic interactions that may cause colour, but also tend to break up extended conjugation along the chain which can result in colur. The water absorption of fluorine-free 6H-BPDA/BAPP was 1.56%, and 6F-BPDA/4BDAP which has the highest fluorine contents(26%) in the repeating unit showed 0.35% of water absorption. The water absorption of PEIs decreased with increasing fluorine contents becaues the incorperation of fluorine into the main chain incrased hydrophobicity of PEIs. The yield point and tensile strength of the PEIs gave less correlation with molecular structure and viscosity of PEIs because of the defect produced in the film preperation. But the yield point and tensile strength both around 800(Kgf/cmz) of the PEIs were similar to that of the conventional polyimides' and was enough to be used for interlayer dielectrics. The elongation at break of PEIs decreased with increasing the rigidity of monomer unit.
Electronics industry has been rapidly progressed, therefore new demands are being placed on the materials comprising electronics devices. Improvements in polyimide propeties have been sought by incorporating trifluoromethyl or other perfluoroalkyl groups. Fluorinated polyimides have lower dielectric constants, lower water absorption and higher solubility compared to fluorine-free polyimides. In this study, fluorinated diamine and dianhydrides were synthesized in order to incorporate fulorine into the polyimides. 1,1-bis(4-anunophenyl)-1-phenyl-2,2,2-trifluoro ethane (3F-DAM) which was incorporated with trfluoroethylidene group was synthesized in order to improve the thermal property and solubility of polyetherimides(PEIs). 2,2-bis[4-(3,4-dicarboxyphenoxy)phenylI hexafluoropropane dianhydride(6F-BPDA) and 1,1-bis[4-(3,4-dicar boxyphenoxy)phenyl]-1-phenyl-2,2,2-trifluoroethane dianhydride (3F -BPDA) were synthesized by replacing of center group of 2,2bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride(6H-BPDA) with hexafluoroisopropylidene(6F) and trifluoroethylidene(3F). Optical and electric properties of polyetherimides(PEI) obtained from these dianhydrides and various diamines were investigated. The viscosity of PEN using 2,2-bis(4-aminophenyl)hexafluoro propane(4BDAP) was lower than those of 3F-DAM. The hexafluoroisopropylidene(6F) group of 4BDAP was directly attatched to the aminophenyl ring and the electro-withdrawing character of 6F group is strong enough to decrease the basicity and thereby the reactivity of diamme. The glass transition temperature (Tg) of PEIs increased with increasing the rigidity of diamines and dianhydrides. The decomposition temperature of PEIs Was higher than 540`C and PEIs have an excellent thermal stability comparable to conventional polvimides. The Tg of PEIs produced with 3F-DAM and 6FBPDA or 3F-BPDA were 257C and 258V, respectively. These materials could withstand to welding temperature of 260℃ in the multichip device preparation. The most of the PEIs had a excellent solubility, because the bulky 6F, 3F group reduced intermolecular interaction and flexible ether linkage of dianhydride and diamine increased the chain mobility. PEIs produced with 3F-DANI were dissolved in NMP within 5 minutes. The dielectric constants and reflective indices were found to decrease Nvith increasing fluorine contents of the PEIs in the following order: 6H-BPDA > 3F-BPDA > 6F-BPDA. The dielectric constant and refractive index of fluorine-free 6H-BPDA 'B APP were 3.199 and 1.6767, respectively. The dielectric constant and refractive index of 6F-BPDA/4BDAP which has the highest fluorine contents in the repeating unit were 2.752 and 1.5630, respectively. The degree of orientation could be reduced with high heating rate during thermal imidization of polyamic acid. The diffrence of dielectric constants between in-plane and out-of-plane decreased with decreasing molecular orientation. The most of the PEN show an excellent optical transparency because the alkyl, trifluoromethyl and phenyl groups not only eliminate electronic interactions that may cause colour, but also tend to break up extended conjugation along the chain which can result in colur. The water absorption of fluorine-free 6H-BPDA/BAPP was 1.56%, and 6F-BPDA/4BDAP which has the highest fluorine contents(26%) in the repeating unit showed 0.35% of water absorption. The water absorption of PEIs decreased with increasing fluorine contents becaues the incorperation of fluorine into the main chain incrased hydrophobicity of PEIs. The yield point and tensile strength of the PEIs gave less correlation with molecular structure and viscosity of PEIs because of the defect produced in the film preperation. But the yield point and tensile strength both around 800(Kgf/cmz) of the PEIs were similar to that of the conventional polyimides' and was enough to be used for interlayer dielectrics. The elongation at break of PEIs decreased with increasing the rigidity of monomer unit.
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#플루오르화 BISPHENOL 단량체 POLLYETHERIMIDE
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