Effect of additions and flow rate in Electrodeposited Zinc Song, Jin-Ho Department of materials Science and Metallurgical Engineering The Graduate School of Industry Sunchon National University Supervisor : Prof. Kim, Byung Il Abstract In accordance with developing frontier industry and increasing i...
Effect of additions and flow rate in Electrodeposited Zinc Song, Jin-Ho Department of materials Science and Metallurgical Engineering The Graduate School of Industry Sunchon National University Supervisor : Prof. Kim, Byung Il Abstract In accordance with developing frontier industry and increasing in demand about products, a plating grater is demanded for strictly quality control. A plating layer for having a good quality must constantly maintain a mineral ion which exists in plating bath and density of organic addition. The example of a addition for improving quality of galvanization is to add epihalo hydrin, glycerol hydrin in an acid bath and to magnify a brilliance of plating layer and the coverage of plating electrical current and is developed plating bath which improves brilliance in accordance with adding aromatic, aldehydes, ketone, etc However, these are registered with effect influenced plating products with a patent, it is not known as research about movement of addition. The patent widely assigns organic compounds which are amine, thio, aroatic cargoxylic acids, alkynes, ketone system and typical species of organic addition with a patent. Each organism which is consist of organic compound is so wide and has a specific character according to molecular weigh and sort, so it is possible to manufacture the plating grater which has the surface and physical properties. Consequently, this research is to exam external appearance of surface with the current of plating to apply to chloride and sulfate bath and to select organic addition which is PEG(polyethyleneglycol), Thiourea, Gelatin, MEK(Methylethylketone) to use to be newly customized EG(Electrical Galvanization) simulator. Key word : EG simulator, PEG, Thiourea, Gelatin, MEK, Flow rate
Effect of additions and flow rate in Electrodeposited Zinc Song, Jin-Ho Department of materials Science and Metallurgical Engineering The Graduate School of Industry Sunchon National University Supervisor : Prof. Kim, Byung Il Abstract In accordance with developing frontier industry and increasing in demand about products, a plating grater is demanded for strictly quality control. A plating layer for having a good quality must constantly maintain a mineral ion which exists in plating bath and density of organic addition. The example of a addition for improving quality of galvanization is to add epihalo hydrin, glycerol hydrin in an acid bath and to magnify a brilliance of plating layer and the coverage of plating electrical current and is developed plating bath which improves brilliance in accordance with adding aromatic, aldehydes, ketone, etc However, these are registered with effect influenced plating products with a patent, it is not known as research about movement of addition. The patent widely assigns organic compounds which are amine, thio, aroatic cargoxylic acids, alkynes, ketone system and typical species of organic addition with a patent. Each organism which is consist of organic compound is so wide and has a specific character according to molecular weigh and sort, so it is possible to manufacture the plating grater which has the surface and physical properties. Consequently, this research is to exam external appearance of surface with the current of plating to apply to chloride and sulfate bath and to select organic addition which is PEG(polyethyleneglycol), Thiourea, Gelatin, MEK(Methylethylketone) to use to be newly customized EG(Electrical Galvanization) simulator. Key word : EG simulator, PEG, Thiourea, Gelatin, MEK, Flow rate
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