To overcome the problems of photolithography process, such as high cost, expensive facilities, and low efficiency, various pinting methods have been developed for the patterning process with the precision over a few micrometers. As a paste ink material in silk screen printing process, the copper nan...
To overcome the problems of photolithography process, such as high cost, expensive facilities, and low efficiency, various pinting methods have been developed for the patterning process with the precision over a few micrometers. As a paste ink material in silk screen printing process, the copper nanoparticles have been intensively studied in various applications, such as bus / address electrode patterns for plasma display (PDP), polymer thin-film transistor (TFT), radio frequency identification (RFID), and grid patterns for photovoltaic cells. In this study, we have prepared the copper nanoparticles for use of conductivity copper pattern. An amount of capping agent plays an important role in controlling the particles size distribution. We obtained relatively monodisperse and nanosized copper nanoparticles. The copper nanoparticles had an average diameter of 11(±3.3)nm with 20% oleic acid, which acted as a self-surfactant and made the nanoparticles possible to be well dispersed in an organic solvent such as xylene and viii terpineol. In this process capping agents such as oleic acid and neodecanoic acid, acted as stabilizer, coordinating their carboxyl end groups on copper particles surface by the steric effect arising from the long alkyl chain of fatty acid. It prevented the copper particles for nucleation growth and surface oxidation. With the copper nanoparticles pastes, screen printed films were fabricated on a glass substrate and sintered at various temperatures. Nano-sized copper pastes prepared in this study have high oxidation properties. In order to decrease there oxidation properties, formic acid reduction process was introduced.1 As a result, copper films with non-oxidized fine pattern could be prepared. And the sintering temperature was lowered to 250℃ by using the copper nanoparticles pastes. The copper films prepared in this study exhibited a specific resistance under 4.2x10-6Ωcm. Therefore, the pastes prepared in this study are expected to be suitable for silk screen printing and to be applied to circuit patterns for RFID, printed circuit board (PCB), and electrodes in PDP
To overcome the problems of photolithography process, such as high cost, expensive facilities, and low efficiency, various pinting methods have been developed for the patterning process with the precision over a few micrometers. As a paste ink material in silk screen printing process, the copper nanoparticles have been intensively studied in various applications, such as bus / address electrode patterns for plasma display (PDP), polymer thin-film transistor (TFT), radio frequency identification (RFID), and grid patterns for photovoltaic cells. In this study, we have prepared the copper nanoparticles for use of conductivity copper pattern. An amount of capping agent plays an important role in controlling the particles size distribution. We obtained relatively monodisperse and nanosized copper nanoparticles. The copper nanoparticles had an average diameter of 11(±3.3)nm with 20% oleic acid, which acted as a self-surfactant and made the nanoparticles possible to be well dispersed in an organic solvent such as xylene and viii terpineol. In this process capping agents such as oleic acid and neodecanoic acid, acted as stabilizer, coordinating their carboxyl end groups on copper particles surface by the steric effect arising from the long alkyl chain of fatty acid. It prevented the copper particles for nucleation growth and surface oxidation. With the copper nanoparticles pastes, screen printed films were fabricated on a glass substrate and sintered at various temperatures. Nano-sized copper pastes prepared in this study have high oxidation properties. In order to decrease there oxidation properties, formic acid reduction process was introduced.1 As a result, copper films with non-oxidized fine pattern could be prepared. And the sintering temperature was lowered to 250℃ by using the copper nanoparticles pastes. The copper films prepared in this study exhibited a specific resistance under 4.2x10-6Ωcm. Therefore, the pastes prepared in this study are expected to be suitable for silk screen printing and to be applied to circuit patterns for RFID, printed circuit board (PCB), and electrodes in PDP
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