초록

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Abstract ▼ AI-Helper

Hot melt adhesive which is solventless type has been widely used due to the possibility of automated adhesion process. The main purpose of this study is the development of polyamide based hot melt adhesive to improve the property of conventional ethylene-vinyl acetate hot melt adhesive, which has an...

Hot melt adhesive which is solventless type has been widely used due to the possibility of automated adhesion process. The main purpose of this study is the development of polyamide based hot melt adhesive to improve the property of conventional ethylene-vinyl acetate hot melt adhesive, which has an inherent problem against heat resistance. In this study, it was found that the terpolymers of nylon 6, nylon 66, and nylon 12(CM831, 843P types) instead of nylon homopolymer were suitable base resins for hot melt adhesive, since the disruption of regularity in the polymer chains reduced the crystallinity, resulting in lower melting point and melt viscosity. According to the results, the optimum adhesion property could be obtained by the using 75/25~50/50 weight radio of CM831/843P resin as a base resin. Terpene resin was used as tackifier to improve adhesion and wetting properties. The best result can be obtained with the 10 wt.% addition of terpene resin. The terpene resin acted as proper tackifier in this system which decreased the melt temperature and viscosity, but increased the mechanical strength of adhesive itself. Also, the rheological property of the adhesive changed from typical non-Newtonian behavior to Newtonian behavior as terpene resin was added.