이방성 전도 접착제 물성과 유기 기판 플립 칩의 신뢰성에 미치는 비전도성 충진재의 영향 Effect of Non-Conducting Filler Additions on Anisotropic Conductive Adhesives(ACAs) Properties and the Reliability of ACAs Flip Chip on Organic Substrates원문보기
비전도성 충진재를 포함한 개선된 이방성 전도 접착제의 열적/기계적 특성과 이를 이용한 유기 기판용 플립 칩의 신뢰성에 미치는 충진재 양의 영향을 고찰하였다. 비전도성 충진재 양이 다른 개선된 이방성 접착제의 특성을 살펴보기 위해 differential scanning calorimeter (DSC), thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), thermo-mechanical analyzer (TMA)을 사용하였다. 비전도성 충진재의 양이 증가함에 따라 열팽창계수는 감소하였고, 상온에서의 storage modulus는 증가하였다. 추가로, 충진재의 양이 증가하면 DSC에 의한 유리전이온도와 TMA에 의한 유리전이온도도 증가하였다. 그러나 TGA 거동은 거의 변화가 없었다. 이방성 전도 접착제를 사용한 유기 기판 플립 칩의 신뢰성 테스트를 위해 열주기 시험, 고온고습 시험, 고온건조 시험을 수행하였는데, 주로 열주기 시험에서 이방서 전도 접착제의 열팽창계수의 영향이 컸다. 비전도성 충진재를 포함해서 낮은 열팽창계수와 높은 storage modulus를 갖는 이방성 전도 접착제에 의해 부착된 플립 칩의 신뢰성이 비전도성 충진재를 포함하지 않은 이방성 전도 접착제에 의한 플립 칩의 신뢰성보다 더 좋게 나타났다.
비전도성 충진재를 포함한 개선된 이방성 전도 접착제의 열적/기계적 특성과 이를 이용한 유기 기판용 플립 칩의 신뢰성에 미치는 충진재 양의 영향을 고찰하였다. 비전도성 충진재 양이 다른 개선된 이방성 접착제의 특성을 살펴보기 위해 differential scanning calorimeter (DSC), thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), thermo-mechanical analyzer (TMA)을 사용하였다. 비전도성 충진재의 양이 증가함에 따라 열팽창계수는 감소하였고, 상온에서의 storage modulus는 증가하였다. 추가로, 충진재의 양이 증가하면 DSC에 의한 유리전이온도와 TMA에 의한 유리전이온도도 증가하였다. 그러나 TGA 거동은 거의 변화가 없었다. 이방성 전도 접착제를 사용한 유기 기판 플립 칩의 신뢰성 테스트를 위해 열주기 시험, 고온고습 시험, 고온건조 시험을 수행하였는데, 주로 열주기 시험에서 이방서 전도 접착제의 열팽창계수의 영향이 컸다. 비전도성 충진재를 포함해서 낮은 열팽창계수와 높은 storage modulus를 갖는 이방성 전도 접착제에 의해 부착된 플립 칩의 신뢰성이 비전도성 충진재를 포함하지 않은 이방성 전도 접착제에 의한 플립 칩의 신뢰성보다 더 좋게 나타났다.
We investigated the effect of filler content on the thermo-mechanical properties of modified ACA composite materials by incorporation of non-conducting fillers and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified...
We investigated the effect of filler content on the thermo-mechanical properties of modified ACA composite materials by incorporation of non-conducting fillers and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACA s composites with different content of non-conducting fillers, differential scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechnical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.
We investigated the effect of filler content on the thermo-mechanical properties of modified ACA composite materials by incorporation of non-conducting fillers and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACA s composites with different content of non-conducting fillers, differential scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechnical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.
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문제 정의
5) Our previ이as study showed that low CTE adhesive layer with high filler content had lower shear strain induced by CTE mismatch between the chip and the board under temperature cycling.61 The purpose of this study is to investigate the effect of added dielectric fillers on ACAs materials characteristics such as dynamic mechanical, thermo-mechanical, and rheological properties, and reliability of modified ACA flip chip on organic boards applications.
가설 설정
on the adhesive layer."1 This effect of humidity on the contact resistance of ACA joint was predominant in case of low content of fillers presumably because of higher CTE, lower modulus, and higher water absorption resulting from higher portion of epoxy resin.
~ 10GPa., 0) The content of filler remarkably affects the storage modulus of the cured materials at room temperature. The room temperature storage modulus of the cured ACA materials in this study increases up to 5.
제안 방법
on an organic substrate. First, the gold stud bumps on the chip and the I/O pads on the test substrates were aligned. And then the ACA was dispensed on the substrate to interconnect the chip.
The initial contact resistance was measured using a 4-point probe method and after each time interval, in-situ contact resistances were measured during the completion of reliability tests. For the reliability test conditions, 85P/85 %RH high humidity and temperature condition for 1000 hours, 85 ℃/dry high temperature/dry condition for 1000 hours, and -50℃ to 165 ℃ air to air thermal cycling for 700 cycles condition were adapted.
The differential scanning calorimeter (DSC) was performed to investigate curing properties of ACA composites. The cured ACA samples were prepared by placing the adhesive mixture in a convection oven at 150 ℃ for 30min and cutting with 0.6mm thick dimension for the thermo-mechanical characterization such as dynamic mechanical analyzer (DMA), thermo-gravimetric analyzer (TGA) and thermo-mechanical analyzer (TMA) test. The un- cured ACA solutions were also prepared to interconnect flip chip on organic substrates.
The mixtures were stirred and degassed under a vacuum for 3 hours to eliminate the air induced during stirring. The differential scanning calorimeter (DSC) was performed to investigate curing properties of ACA composites. The cured ACA samples were prepared by placing the adhesive mixture in a convection oven at 150 ℃ for 30min and cutting with 0.
The effect of various ACAs on the reliability of ACA flip chip on organic boards was measured using thermal cycling test.
The modified ACAs in this study consist of an insulating epoxy thermosetting adhesive, conductive fillers, and non-conductive fillers. The modified ACAs were adhesive pastes without solvent.
The storage modulus and loss modulus measurement of cured ACa composite samples were performed on DMA instrument (by TA Instruments, Mod이 2980) to investigate the effect of filler content on the modulus of cured ACAs. DMA test specimens were prepared by placing a liquid formulation of ACA composite into an aluminum pan (37.
To investigate the reliability of ACA flip chip assemblies, three ACA composites with different filler contents were formulated, and materials properties were tested. The effect of various ACAs on the reliability of ACA flip chip on organic boards was measured using thermal cycling test.
대상 데이터
ACAs. DMA test specimens were prepared by placing a liquid formulation of ACA composite into an aluminum pan (37.5mm diameter). And then the specimen was preheated in an 801 convection oven followed by heating up to 150 ℃ with 10 ℃/min heating rate and curing in the oven at 150℃ for 5min.
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