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NTIS 바로가기열처리공학회지 = Journal of the Korean society for heat treatment, v.17 no.5, 2004년, pp.293 - 298
박치완 (충북대학교 재료공학과) , 장건익 (충북대학교 재료공학과) , 김태형 ((주)나노테크) , 우용원 ((주)나노테크)
For the application of heat sink device, the green sheets of powder of W-XCu and Mo-XCu composites were fabricated by tape casting technique. The mixing ratio of powder and binder was 6:4. The green sheet was shrinked up to 10~20% after sintering and the maximum relative density was above 95%. Therm...
R. M. German, K. F. Hens and J. L. Johnson, Int. J. Powder Matall.,30(1994) 205
N.L.OH, D.G.Kim, M.J. Suk, Y.H. Kim, Y.D. Kim, I.H.Moon, 'The Evaluation of Thermal for W-Cu Composite Sintered from Mechanically Alloyed Powders', J. Powder Metall., Vol 7, NO 3, 2000
A.L.Eustice, S.J.Horowitz, J.J.Stewart, A.R.Travis, and H.T.Sawhill. 'Low Temperature Cofireable Ceramics: A Now Approach for Electronic Packaging,' in Proc. Electronic Components Conf., pp.37-47. 1986
W. S. Young, Multilayer Ceramic Technology, in Ceramic Materials for Electronics, edited by R.C.Buchman, Marcel-Dekker, New York, 403-424(1988)
F.J.Dance and J.L.Wallace, 'Clad Metal Circuit Board Substrates for Direct Mounting of Ceramic Chip Carriers,' Electron. Pack. Product., pp.226-237, Jan. 1982
K. V. Sebastian, Int. J. Powder Metall. & Powder Tech.,17(1981)297
I.-H. Moon and J. S. Lee, Powder Metall., 1(1979)5
B. Yang and R. M. German, Int. J. Powder Metall., 33(1997)55
오영제, 정형진, '세라믹스 테이프케스팅(Tape Casting) 성형기술', 요업기술, Vol 12, No 1, pp.3-11(1997)
P.S.Turner, J .Res. NBS., Vol 37, pp.239, 1946
J.F.Kerrisk, J. Appl. Phys., Vol 43, pp.112, 1972
J.C.Maxwell, A Treatise on Electricity and Magnetism, (3rd Ed.), Oxford U.P, Oxford, pp.63, 1982
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