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NTIS 바로가기大韓溶接學會誌 = Journal of the Korean Welding Society, v.22 no.6, 2004년, pp.36 - 42
신영의 (중앙대학교 기계공학부) , 김연성 (중앙대학교 기계공학부) , 김종민 (중앙대학교 기계공학부) , 최명기 (중앙대학교 기계공학부)
Experimental and numerical approaches on the thermal fatigue for the solder joint of flip chip package are discussed. However, it is one of the most difficult problems to choose the proper fatigue model. It was found that viscoplstic FE model with Darveaux method was very desirable and useful to pre...
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Rovert Darveaux : Effect of Simulation Methodology on Solder Joint Crack Growth Correlation, IEEE Electronic Components and Technology Conference, 2000. 1048-1058
Erdogan Madenci et al. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS. The University of Arizona. 2001. 4-5
Anand, L.: Constitutive Equations for the RateDependant Deformation of Metals at Elevated Temperature. ASME Journal of Materials Technol. (1982),104-1, 12-17
Alfred Yeo et al, : Flip Chip Solder Joint Fatigue Life Model Investigation, IEEE, Electronics Packaging Technology Conference. 2002, 107-114
Liu. y. et al, : Assembly Process Induced Stress Analysis for New FLMP Package by 3D FEA, IEEE. 52th Electronic Components and Technology Conference. 2001. 211-219
John H. L. Pang: Thermal Cycling Analysis of Flip Chip Solder Joint Reliability. IEEE Transactions on Components and Packaging Technologies. 24-4. 2001. 1048-1058
T. Anderson Revisit of Life-Prediction Model for Solder Joints, IEEE Electronic Components and Technology Conference, 2000, 1064-1069
J. H. Okura, S. Shetty : Guidelines to select underfills for flip chip on board assemblies, IEEE Electronic Components and Technology Conference,1999, 9-594
H. L. J. Pang et al : Temperature Cycling Fatigue Analysis of Fine Pitch Solder Joints, ASME Advances in Electronic Packaging, 2(1997), 1495-1500
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