최소 단어 이상 선택하여야 합니다.
최대 10 단어까지만 선택 가능합니다.
다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
NTIS 바로가기한국정밀공학회지 = Journal of the Korean Society for Precision Engineering, v.22 no.2 = no.167, 2005년, pp.38 - 45
박범영 (부산대학교 대학원 정밀기계공학과) , 김호윤 (동부아남반도체) , 김구연 (부산대학교 대학원 정밀기계공학과) , 김형재 (부산대학교 대학원 정밀기계공학과) , 정해도 (부산대학교 정밀정형 및 금형가공 연구소)
Chemical mechanical polishing(CMP) has been widely accepted for the planarization of multi-layer structures in semiconductor fabrication. But a variety of defects such as abrasive contamination, scratch, dishing, erosion and corrosion are occurred during CMP. Especially, dishing and erosion defects ...
Shin, H. L., Robert, O. M., 'Chemical Mechanical Polishing Silicon Processing,' Academic Press, pp. 98-100, 2000
Steigerwald, J. M., Zirpoli, R., Murarka, S. P., Price, D., Gutmann, R., 'Pattern Geometry Effects in the Chemical Mechanical Polishing of Inlaid Copper Structures,' J. Electrochem. Soc., Vol. 141, No. 10, pp. 2842-2848, 1994
Lum, R., Mishra, S., Lin, R., Redeker, F., Nanjangud, S., 'Oxide Erosion Characterization of a Tungsten CMP Process,' CMP-MIC Conf., pp. 207-214, 1999
Kondo, S., Sakuma, N., Homma, Y., Goto, Y., Ohashi, N., Yamaguchi, H., Owada, Nobuo., 'Abrasive-Free Polishing for Copper Damascene Interconnection,' J. of Electrochem. Soc., Vol. 147, No. 10, pp. 3907-3913, 2000
Koinkar, V., Golzarian, R., Luo, Q., Vanhanehem, M., Shen, J., Burke, P., 'Chemical Mechanical Planarization of Copper Interconnects using Fixed Abrasive Polishing Pad,' CMP-MIC Conf., pp. 58-65, 2000
Matsumoto, M., Suzuki, K., Sakamoto, T., Kamisawa, A., 'Evaluation of Cu CMP for Interconnects using a New Slurry-Free Process,' CMP-MIC Conf., pp. 176-183, 1999
Kaufman, F. B., Thompson, D. B., Broadie, R. E., Jaso, M. A., Guthrie, W. L., Pearsons, D. J., Small, M. B., 'Chemical Mechanical Polishing for fabricating Patterned W Metal Features as Chip Interconnects,' J. of Electrochem. Soc., Vol. 138, No. 11, pp. 3460-3464, 1991
Samsung Electronics Co., Ltd., 'Chemical Mechanical Polishng Slurry,' Korea Patent, No. 2001-0037315
Fayolle, M., Sicurani, E., Morand, Y., 'W CMP Process Integration - Electrical Results and End Point Detection,' Microelectric Engineering, 37/38, pp. 347-352, 1997
Kim, H. Y., Park, B. Y., Jeong, H. D., Dornfeld, D. A., Lee, S. I., 'Application of Fixed Abrasive Pad using Hydrophilic Polymer in STI CMP,' ASPE, pp. 661-666, 2002
Kim, H. Y., Kim, H. J., Jeong, H. D., 'Development of an Abrasive Embedded Pad for Dishing Reduction and Uniformity Enhancement,' J. of KPS, Vol. 37, No.6, pp. 945-951, 2000
※ AI-Helper는 부적절한 답변을 할 수 있습니다.