최소 단어 이상 선택하여야 합니다.
최대 10 단어까지만 선택 가능합니다.
다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
NTIS 바로가기한국마린엔지니어링학회지 = Journal of the Korean Society of Marine Engineering, v.32 no.6, 2008년, pp.854 - 861
손영석 (동의대학교 기계공학과) , 신지영 (동의대학교 기계공학과)
Heat transfer characteristics of protruding electronic components in a horizontal channel are studied numerically. The system consists of two horizontal channels formed by two covers and one printed circuit board which has three uniform protruding heat source blocks. A two-dimensional numerical mode...
* AI 자동 식별 결과로 적합하지 않은 문장이 있을 수 있으니, 이용에 유의하시기 바랍니다.
H. Xie, M. Aghazadeh, W. Lui, and K. Haley, 'Thermal Solutions to Pentium Processors in TCP in Notebooks and Sub-Notebooks', IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol. 19, No. 1, pp. 54-65, 1996
W. Nakayama, 'Recent Japanese Thermal Solutions for Portable Computers', Electronics Cooling Online, 1998
W. Aung, Cooling Techniques for Computers, Hemisphere Publishing Corporation, 1991
A. Bar-Cohen and W. M. Rohsenow, 'Thermally Optimum Spacing of Vertical Natural Convection Cooled Parallel Plates', Journal of Heat Transfer, Vol. 106, pp. 116-123, 1984
M. Afrid and A. Zebib, 'Natural Convection Air Cooling of Heated Components Mounted on a Vertical Wall', Numerical Heat Transfer, Part A, Vol.15, pp.243-259, 1989
J. Davalath and Y. Bayazitoglu, 'Forced Convection Cooling across Rectangular Blocks', Journal of Heat Transfer, Vol. 109, pp. 321-328, 1987
T. J. Young and K. Vafai, 'Experimental and Numerical Investigation of Forced Convective Characteristics of Arrays of Channel Mounted Obstacles', Journal of Heat Transfer, Vol.121, pp.34-42, 1999
T. C. Hung and C. S. Fu, 'Conjugate Heat Transfer Analysis for the Passive Enhancement of Electronic Cooling through Geometric Modification in a Mixed Convection Domain', Numerical Heat Transfer, Part A, Vol.35, pp.519-535, 1999
A. Dogan, M. Sivrioglu, and S. Baskaya, 'Investigation of Mixed Convection Heat Transfer in a Horizontal Channel with Discrete Heat Sources at the Top and at the Bottom', International Journal of Heat and Mass Transfer, Vol.49, pp.2652-2662, 2006
M. M. Mohamed, 'Air Cooling Characteristics of a Uniform Square Modules Array for Electronic Device Heat Sink', Applied Thermal Engineering, Vol.26, pp.486-493, 2006
H. Bhowmik, C. P. Tso, K. W. Tou, and F. L. Tan, 'Convection Heat Transfer from Discrete Heat Sources in a Liquid Cooled Rectangular Channel', Applied Thermal Engineering, Vol.25, pp.2532-2542, 2005
K. A. Park and A. E. Bergles, 'Boiling Heat Transfer Characteristics of Simulated Microelectronic Chips with Detachable Heat Sinks', Heat Transfer in Electronic Equipment, ASME-HTD, Vol. 57, pp. 95-102, 1986
A. G. Agwu Nnanna, 'Application of Refrigeration System in Electronics Cooling', Applied Thermal Engineering, Vol.26, pp.18-27, 2006
F. P. Incropera and D. P. DeWitt, Fundamentals of Heat and Mass Transfer, 6th ed., John Wiley & Sons Inc., New York, 2007
S. V. Patankar, Numerical Heat Transfer and Fluid Flow, Hemisphere Publishing Corporation, 1980
J. P. Van Doormaal and G. D. Raithby, 'Enhancements of the SIMPLE Method for Predicting Incompressible Fluid Flows', Numerical Heat Transfer, Vol. 7, pp. 147-163, 1984
*원문 PDF 파일 및 링크정보가 존재하지 않을 경우 KISTI DDS 시스템에서 제공하는 원문복사서비스를 사용할 수 있습니다.
Free Access. 출판사/학술단체 등이 허락한 무료 공개 사이트를 통해 자유로운 이용이 가능한 논문
※ AI-Helper는 부적절한 답변을 할 수 있습니다.