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참고문헌 (15)

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2. T.B. Massalski: Binary Alloy Phase Diagrams 2nd ed., ASM International (1992) 

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6. http://www.nemi.org/ 

7. http://www.lead-free.org/ 

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11. C.W. Hwang and K. Suganuma: Interface microstructures between Ni-P alloy plating and Sn-Ag-(Cu) lead-free solders, Journal of Materials Research, 18(11) (2003), 2540-2543 

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12. C.W. Hwang, K. Suganuma, M. Kiso and S. Hashimoto: Influence of Cu addition to interface microstructure between Sn-Ag solder and Au/Ni-6P plating, Journal of Electronic Materials, 33(10) (2004), 1200-1209 

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13. S.W. Kim, J.W. Yoon and S.B. Jung: Interfacial reactions and shear strengths between Sn-Ag-based Pb-free solder balls and Au/EN/Cu metallization, Journal of Electronic Materials, 33(10) (2004), 1182-1189 

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14. J.W. Yoon, W.C. Moon and S.B. Jung: Interfacial reaction of ENIG/Sn-Ag-Cu/ENIG sandwich solder joint during isothermal aging, Microelectronic Engineering. 83 (2006), 2329-2334 

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15. T.C. Chiu and K.L. Lin: Electromigration behavior of the Cu/Au/SnAgCu/Cu solder combination, Journal of Materials Research, 23(1) (2008), 264-273 

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