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NTIS 바로가기마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.17 no.3, 2010년, pp.1 - 9
안지혁 (성균관대학교 신소재공학과) , 김광석 (성균관대학교 신소재공학과) , 이영철 (성균관대학교 신소재공학과) , 김용일 (성균관대학교 마이크로 전자 및 반도체 패키징 기술개발 사업단) , 정승부 (성균관대학교 마이크로 전자 및 반도체 패키징 기술개발 사업단)
We reported the methodology for the shear test which is one of the evaluation procedure for mechanical reliability of flip-chip package. The shear speed and the tip height are found to be two significant experimental parameters in the shear test. We investigated how these two parameters have an infl...
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핵심어 | 질문 | 논문에서 추출한 답변 |
---|---|---|
2006년에 개정된 전단시험법에서 전단속도는 어떻게 구분하여 규정하고 있는가? | 그 이후 Table 2에서 알 수 있듯이 2006년에 평가법의 일부가 개정되어 전단속도와 전단높이에 대한 새로운 항목의 규정이 추가되었다. 2006년 이전에는 전단속도에 대한 규정 항목이 없었으나, 현재는 Table 2와 같이 ‘low speed shear test’와 ‘high speed shear test’로 구분하여 그 속도의 범위를 규정하고 있다. 그리고 전단높이의 경우에는 Table 2에서 알 수 있듯이 솔더볼 높이의 25 % 이하, 50 µm높이 이상에서 전단시험을 하도록 규정되어 있었으나, 이와 같이 실험 할 경우 크기 200 µm이하의 솔더볼의 전단시험은 어려웠다. | |
전자부품에서 강조되는 기계적인 특성평가는 무엇인가? | 특히 기계적인 특성 평가방법의 경우, 전자패키지의 구조상 IC칩과 기판간의 열팽창계수 차이로 인하여 계면에서 발생하는 전단응력이 발생한다. 따라서 일반적인 재료의 대표적인 기계적인 특성평가 방법인 인장강도(tensile strength)특성과는 다르게 전자부품에서는 전단강도(shear strength)가 강조되고 있고, 전자부품에서는 ‘ball shear test’법으로 정의되고 있다.8,12) | |
전단시험법에서 전단높이에 대한 규정이 2006년 이후 어떻게 개정되었는가? | 그리고 전단높이의 경우에는 Table 2에서 알 수 있듯이 솔더볼 높이의 25 % 이하, 50 µm높이 이상에서 전단시험을 하도록 규정되어 있었으나, 이와 같이 실험 할 경우 크기 200 µm이하의 솔더볼의 전단시험은 어려웠다. 따라서 2006년 이후에 전체 솔더볼 크기의 25%미만, 10% 권장으로 측정 방법의 항목이 개정 되었다. |
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J. Y. H. Chia, B. Cotterell, T. C. Chai, "The mechanics of the solder ball shear test and the effect of shear rate", Materials Science and Engineering: A, 417(1-2), 259 (2006).
J. W. Yoon, S. B. Jung, "Reliability studies of Sn-9Zn/Cu solder joints with aging treatment", J. Alloys compd., 407(1-2), 141 (2006).
P. C. Shih, K. L. Lin, "Interfacial microstructure and shear behavior of Sn.Ag-Cu solder balls joined with Sn.Zn.Bi paste", J. Alloys compd., 422(1-2), 153 (2006).
J. W. Yoon, S. B. Jung, "High temperature reliability and interfacial reaction of eutectic Sn-0.7Cu/Ni solder joints during isothermal aging", Microelectronics and Reliability, 46(5- 6), 905 (2006).
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J. W. Kim, D. G. Kim, S. B. Jung, "Evaluation of displacement rate effect in shear test of Sn-3Ag-0.5Cu solder bump for flip chip application", Microelectronics Reliability, 46(2-4), 535 (2006).
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