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NTIS 바로가기마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.17 no.3, 2010년, pp.17 - 26
이봉희 (충북대학교 기계공학과) , 김만기 (충북대학교 기계공학과) , 주진원 (충북대학교 기계공학과)
Pb-Sn solder is rapidly being replaced by lead-free solder for board-level interconnection in microelectronic package assemblies due to the environmental protection requirement. There is a general lack of mechanical reliability information available on the lead-free solder. In this study, thermo-mec...
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