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NTIS 바로가기한국정밀공학회지 = Journal of the Korean Society for Precision Engineering, v.27 no.7, 2010년, pp.7 - 12
하창완 (KAIST 기계공학과) , 윤원수 (한국산업기술대학교 기계공학과) , 박금생 ((주)여의시스템) , 김경수 (KAIST 기계공학과)
In this paper, chip-on-glass(COG) interconnection with anisotropic conductive film(ACF) using lateral thermosonic bonding technology is considered. In general, thermo-compression bonding which is used in practice for flip-chip bonding suffers from the low productivity due to the long bonding time. I...
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