최소 단어 이상 선택하여야 합니다.
최대 10 단어까지만 선택 가능합니다.
다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
NTIS 바로가기電子工學會論文誌. Journal of the Institute of Electronics Engineers of Korea. SD, 반도체, v.48 no.1 = no.403, 2011년, pp.1 - 6
We have developed the process of forming one body S-type cantilever probe in the recessed trench for fine-pitched MEMS probe card. The probe (cantilever beam and pyramid tip) was formed using Deep RIE etching and wet etching. The pyramid tip was formed by the wet etching using KOH and TMAH. The proc...
* AI 자동 식별 결과로 적합하지 않은 문장이 있을 수 있으니, 이용에 유의하시기 바랍니다.
Thomas Homorodi and Robert Martin, "Memory Probe: High Parallelism Memory Test Advances based on MicroSpring Contact Technology" in the 2001 Southwest Test Workshop, San Diego, CA, USA, June 2001.
Jae-Ha Lee and Byung-Ho Jo, "MEMS Technologies: A Comparison of Scrub Marks & Contact Resistance Between Cantilever Type and New MEMS Type Probe Cards", in the 2003 Southwest Test Workshop, Long Beach, CA, USA, June 2003.
Dong IlKim,"MEMS Technologies : Multi-die Testing using Silicon Micro-Cantilever Probe Card", in the 2003 Southwest Test Workshop, Long Beach, CA, USA, June 2003.
T. Itoh, S. Kawamura, T. Suga, and K. Kataoka, "Development of an electrostatically actuated MEMS switching probe card", in the proceedings of the 50th IEEE Holm Conference on Electrical Contacts and the 22nd International Conference on Electrical Contacts, Seattle, WA, USA, September 2004, pp226-230.
K. Kataoka, S. Kawamura, T. Itoh, T. Suga, K. Ishikawa, H. Honma, "Low contact-force and compliant MEMS probe card utilizing fritting contact" in the proceedings of the Fifteenth IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2002), Las Vegas, NV, January 2002, pp364-367.
Mark Rosamond and David Wood, "Substrate independent fabrication of a non-planar probe card", Microelectronic Engineering 84 (2007) pp1207-1210.
Bong-Hwan Kim and Jong-Bok Kim, "Design and Fabrication of a Highly Manufacturable MEMS Probe Card for High Speed Testing", Journal of Micromechanics and Microengineering, Vol. 18, No.7, July. 2008, 075031.
Bong-Hwan Kim, Jong-bok Kim, and Jong-Hyun Kim, "A Highly Manufacturable Large Area Array MEMS Probe Card using Electroplating and Flipchip Bonding", IEEE Transactions on Industrial Electronics, Vol. 56, No. 4, April 2009, pp1079-1085.
Bong-Hwan Kim, Sang-Jun Park, Kukjin Chun, Dong-Il (Dan) Cho, Woong-Ki Park, Tae-Un Jun, and Soo Yun, "A Fine Pitch MEMS Probe Unit for Flat Panel Display as Manufacturing MEMS Application", Sensors and Actuators A:Physical, Volume115, Issue1, 2004, Pages 46-52
김상원, 공대영, 조찬섭, 남재우, 김봉환, 이종현, "BGA IC 패키지용 MEMS Test Socket 제작", 2010 대한전자공학회 하계종합학술대회, 제33권, 1호, 제주, 6월 16일-18일, 830-832쪽, 2010년
Madou M J, Fundamentals of microfabrication: The science of Miniaturization, 2nd edition, CRC press
Nadim Maluf, An Introduction to Microelectromechanical Systems Engineering, Artech House
Gregory T. A. Kovacs, Micromachined Transducers Sourcebook, WCB/McGraw-Hill
K. Biswas, S. Kal, "Etch characteristics of KOH, TMAH and dual doped TMAH for bulk micromachining of silicon", Microelectronics Journal 37 (2006) 519-525
※ AI-Helper는 부적절한 답변을 할 수 있습니다.