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NTIS 바로가기청정기술 = Clean technology, v.17 no.2 = no.53, 2011년, pp.103 - 109
서정욱 (삼성전기주식회사 생산기술센터) , 이진욱 (삼성전기주식회사 중앙연구소) , 원용선 (국립부경대학교 화학공학과)
The process optimization was carried out to improve the throwing power (TP) and the thickness uniformity of the electroless copper (Cu) plating, which plays a seed layer for the subsequent electroplating. The DOE (design of experiment) was employed to screen key factors out of all available operatio...
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