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大韓機械學會論文集. Transactions of the Korean Society of Mechanical Engineers. A. A, v.36 no.1, 2012년, pp.37 - 42
최원석 (서울과학기술대학교 NID 융합기술 대학원 Nano IT 융합프로그램) , 김재운 (서울과학기술대학교 산업대학원 기계설계학과) , 김종형 (서울과학기술대학교 기계설계자동화공학부) , 김주한 (서울과학기술대학교 기계공학과)
AI-Helper
LIFT (laser-induced forward transfer) is an advanced laser processing method used for selectively transferring micron-sized objects. In our study, this process was applied in order to deposit solder balls in microsystem packaging processes for electronics. Locally melted solder paste could be transf...
Lee, J., Kim, W., Ahn, D. H. and Lee, Y. H., 2001, "Laser Soldering for Chip-on-Glass Mounting in Flat Panel Display Application," Journal of ELECTRONIC MATERIALS, Vol. 30, No. 9, pp. 1255-1261.
Kang, H. J., Seo, J., Lee, J. H., Kim, J. O., Sin, H. W. and Kim, D. Y., 2006, "Research on Laser Soldering of Micro Solder-balls," Korean Society for Precision Engineering, pp. 661-662.
Rho, J. H., Lee, T. M., Jo, J. D., Lee, S. H. and Kim, D. S., 2010, "A Study of Design and Manufacture of Metal Jet System for Ultra Fine Solder Ball," The Korean Society of Mechanical Engineering, pp. 339-340.
Lee, S. Y., Jang, J. H. and Park, J. H., 2010, " Self- Arrangement of Solder Balls by Using Droplet Microgripper and Solder Bump Creation Using the Same," The Korean Institute of Electrical Engineers, pp. 1299-1300.
Abtew, M. and Selvaduray, G. 2000, "Lead-free Solders in Microelectronics," Materials Science and Engineering, Vol. 27, pp. 95-141.
Wang, C. and Holmes, A. S. 2001, "Laser-Assisted Bumping for Flip Chip Assembly," IEEE Transactions on Electronics Packaging Manufacturing, Vol. 24, No. 2, pp. 109-114.
Yamada, H., Sano, T., Nakayama, T. and Miyamoto, I., 2002, "Optimization of Laser-Induced Forward Transfer Process of Metal Thin Films," Applied surface Science, pp. 411-415.
Tan, B., Venkatakrishnan, K. and Tok, K. G., 2003, "Selective Surface Texturing Using Femtosecond Pulsed Laser Induces Forward Transfer," Applied Surface Science, Vol. 207, pp. 365-371.
Esrom, H., Zhang, J. Y., Kogelschatz, U. and Pedraza, A. J., 1995, "New Approach of a Laser- Induced Forward Transfer for Deposition of Patterned Thin Metal Films," Applied Surface Science, Vol. 86, pp. 202-207.
Kim, H. D., Yun, D. Y. and Hwang, J. W., 2007, "Optimal Design of PCSB from Thermal Stress Analysis," Korean Society of Machine Tool Engineers, pp. 673-676.
David A. W. and Grosu, V., 2007, "The Effect of Melting-Induced Volumetric Expansion on Initiation of Laser-Induced Forward Transfer," Applied Surface Science, Vol. 253, pp. 4759-4763.
Yilbas, B. S., Shuja, S. Z. and Khan, S. M. A., 2010, "Laser Repetitive Pulse Heating of Tool Surface," Optics & Laser Technology, Vol. 43, pp. 754-761.
Lee, J. H., Cho, Y. W., Chea, S. W. and Kim, Y. S., 2000, "Analysis of Temperature Distribution in Solder Bumps during Laser Fluxless Solder Bumping," Korean Institute of Metals and Materials, Vol. 38, No. 11, pp. 1528-1534.
Yue, P., Feng, J. J., Liu, C. and Shen, J., 2004, "A Diffuse-Interface Method for Simulating Two-Phase Flows of Complex Fluids," Journal of Fluid Mechanics, Vol. 515, pp. 293-317.
Incopera, Dewitt, Bergman, Lavine, 2010, Fundamentals of Heat and Mass Transfer, WILEY, pp. 289-298.
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