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Simulation of Ultrasonic Stress During Impact Phase in Wire Bonding 원문보기

마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.20 no.4, 2013년, pp.7 - 11  

Mayer, Michael (Microjoining Laboratory, Centre of Advanced Materials Joining, University of Waterloo)

Abstract ▼ AI-Helper 아이콘AI-Helper

As thermosonic ball bonding is developed for more and more advanced applications in the electronic packaging industry, the control of process stresses induced on the integrated circuits becomes more important. If Cu bonding wire is used instead of Au wire, larger ultrasonic levels are common during ...

주제어

#Wire Bond   #Ultrasound   #Underpad Stress  

AI 본문요약
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제안 방법

  • This still allows to draw conclusions about recommended ranges of process parameters. Based on four concepts, this model describes the stepwise progress of ball formation by providing the deformed ball outline (shape) for each step. The model consists of two stages, the intrusion stage and the squeeze-out stage.
  • Based on four concepts, this model describes the stepwise progress of ball formation by providing the deformed ball outline (shape) for each step. The model consists of two stages, the intrusion stage and the squeeze-out stage.
  • 15-20) While the main aspects of ball bonding were covered in these papers, simulations of the ultrasonic parameter during impact of the ball on the pad are scarce. Thus, a numerical method combined with a geometrical model is reported in this paper, describing how the free air ball (FAB) shape transforms in that of the deformed ball, as illustrated in Fig. 1, while calculating the ultrasonic force acting on the chip. This work is an extension of the extended abstract and presentation given previously.
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참고문헌 (22)

  1. Rezvani, A., Mayer, M., Shah, A., Zhou, N., Hong, S.J., Moon, J. T., "Free-air ball formation and deformability with Pd coated Cu wire", Proceedings - Electronic Components and Technology Conference, art., 5898711, 1516 (2011). 

    crossref

  2. Shah, A., Rezvani, A., Mayer, M., Zhou, Y., Persic, J., Moon, J.T., "Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding", Microelectronics Reliability, 51(1), 67 (2011). 

    상세보기 crossref

  3. Qin, I., Shah, A., Huynh, C., Meyer, M., Mayer, M., Zhou, Y., "Effect of process parameters on pad damage during Au and Cu ball bonding processes", Proceedings of the Electronic Packaging Technology Conference, EPTC, art., 5416482, 573 (2009). 

    crossref

  4. Shah, A., Mayer, M., Zhou, Y., Persic, J., Moon, J.T., "Optimization of ultrasound and bond force to reduce pad stress in thermosonic Cu ball bonding, Proceedings of the Electronic Packaging Technology Conference", EPTC, art., 5416580, 10 (2009). 

    crossref

  5. Shah, A., Mayer, M., Zhou, Y.N., Hong, S.J., Moon, J.T., "Low-stress thermosonic copper ball bonding, IEEE Transactions on Electronics Packaging Manufacturing", 32(3), 176 (2009). 

    상세보기 crossref

  6. Shah, A., Mayer, M., Zhou, Y., Hong, S.J., Moon, J.T., "Reduction of underpad stress in thermosonic copper ball bonding", Proceedings - Electronic Components and Technology Conference, art.,,4550279, 2123 (2008). 

    crossref

  7. Huang, H., Pequegnat, A., Chang, B.H., Mayer, M., Du, D., Zhou, Y., "Influence of superimposed ultrasound on deformability of Cu", Journal of Applied Physics, 106(11), (2009). 

  8. Lum, I., Hang, C.J., Mayer, M., Zhou, Y., "In situ studies of the effect of ultrasound during deformation on residual hardness of a metal", Journal of Electronic Materials, 38(5), 647 (2009). 

    상세보기 crossref

  9. Lum, I., Huang, H., Chang, B.H., Mayer, M., Du, D., Zhou, Y., "Effects of superimposed ultrasound on deformation of gold, Journal of Applied Physics", 105(2), 024905, (2009). 

    상세보기 crossref

  10. Mayer, M., Paul, O., Baltes, H., "In-situ measurement of stress and temperature under bonding pads during wire bonding using integrated microsensors", Proc. 2nd Int. Conf. Emerging Microelectr. and Interconn. Technol. EMIT, 98, 129 (1998). 

  11. Doelle, M., Peters, C., Ruther, P., Paul, O., "Piezo-FET stresssensor arrays for wire-bonding characterization", Microelectromechanical Systems, 15(1), 120 (2006). 

    상세보기 crossref

  12. Mayer, M., J. T. Moon, and J. Persic. "Measuring stress next to Au ball bond during high temperature aging", Microelectronics Reliability, 49(7), 771 (2009). 

    상세보기 crossref

  13. Lemke, B., Baskaran, R., Paul, O., "Piezoresistive CMOS sensor for the localized measurement of five independent stress components", Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on, pp. 596-599. IEEE, (2010). 

  14. Chen, J., Degryse, D., Ratchev, P., De Wolf, I., "Mechanical issues of Cu-to-Cu wire bonding." Components and Packaging Technologies, IEEE Transactions on 27(3), 539 (2004). 

  15. Degryse, D., Vandevelde, B., Beyne, E., "Mechanical FEM simulation of bonding process on Cu LowK wafers", Components and Packaging Technologies, IEEE Transactions on 27(4), 643 (2004). 

    상세보기 crossref

  16. Liu, Y., Irving, S., Timwah Luk. "Thermosonic wire bonding process simulation and bond pad over active stress analysis", Electronics Packaging Manufacturing, IEEE Transactions on 31(1), 61 (2008). 

    상세보기 crossref

  17. Wright, A., Koffell, S., Pichler, P., Enichlmair, H., Minixhofer, R., Wachmann, E., "On the Thermo-Mechanical Modelling of a Ball Bonding Process with Ultrasonic Softening", Proc. IEEE EuroSimE conference, (2013). 

  18. Lin, H. Y., Upreti, K., Tippmann, A., Subbarayan, G., Jung, D. Y., Sammakia, B., "Simulations of Deformation and Stress During Copper Wirebond on ULK Chips", Proc. of ASME InterPACK2013 conference, (2013). 

  19. Huang, Y., Mayer, M., "Effects of ultrasonic capillary dynamics and pad material on the mechanics of thermosonic ball bonding", Proceedings - IEEE Ultrasonics Symposium, art., 5441817, (2009). 

    crossref

  20. Huang, Y., Shah, A., Mayer, M., Zhou, N., Persic, J., "Effect of ultrasonic capillary dynamics on the mechanics of thermosonic ball bonding", IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, 57(1), art., no. 5361546, 241 (2010). 

    상세보기 crossref

  21. Mayer, M., Huang, Y., "Numerical analysis of ultra-high frequency wire bonding", Proc. International Symposium on Microelectronics, IMAPS 2009, 388 (2009). 

  22. Mayer, M., "Ultrasonic Stresses in Copper Wire Bonding with Pre-Bleed Ultrasound", extended abstract and presentation, 1st International Conference for Nanojoining and Microjoining, Beijing, China, (2012). 

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