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NTIS 바로가기마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.20 no.4, 2013년, pp.7 - 11
Mayer, Michael (Microjoining Laboratory, Centre of Advanced Materials Joining, University of Waterloo)
As thermosonic ball bonding is developed for more and more advanced applications in the electronic packaging industry, the control of process stresses induced on the integrated circuits becomes more important. If Cu bonding wire is used instead of Au wire, larger ultrasonic levels are common during ...
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Shah, A., Rezvani, A., Mayer, M., Zhou, Y., Persic, J., Moon, J.T., "Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding", Microelectronics Reliability, 51(1), 67 (2011).
Shah, A., Mayer, M., Zhou, Y.N., Hong, S.J., Moon, J.T., "Low-stress thermosonic copper ball bonding, IEEE Transactions on Electronics Packaging Manufacturing", 32(3), 176 (2009).
Huang, H., Pequegnat, A., Chang, B.H., Mayer, M., Du, D., Zhou, Y., "Influence of superimposed ultrasound on deformability of Cu", Journal of Applied Physics, 106(11), (2009).
Lum, I., Hang, C.J., Mayer, M., Zhou, Y., "In situ studies of the effect of ultrasound during deformation on residual hardness of a metal", Journal of Electronic Materials, 38(5), 647 (2009).
Lum, I., Huang, H., Chang, B.H., Mayer, M., Du, D., Zhou, Y., "Effects of superimposed ultrasound on deformation of gold, Journal of Applied Physics", 105(2), 024905, (2009).
Mayer, M., Paul, O., Baltes, H., "In-situ measurement of stress and temperature under bonding pads during wire bonding using integrated microsensors", Proc. 2nd Int. Conf. Emerging Microelectr. and Interconn. Technol. EMIT, 98, 129 (1998).
Doelle, M., Peters, C., Ruther, P., Paul, O., "Piezo-FET stresssensor arrays for wire-bonding characterization", Microelectromechanical Systems, 15(1), 120 (2006).
Mayer, M., J. T. Moon, and J. Persic. "Measuring stress next to Au ball bond during high temperature aging", Microelectronics Reliability, 49(7), 771 (2009).
Lemke, B., Baskaran, R., Paul, O., "Piezoresistive CMOS sensor for the localized measurement of five independent stress components", Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on, pp. 596-599. IEEE, (2010).
Chen, J., Degryse, D., Ratchev, P., De Wolf, I., "Mechanical issues of Cu-to-Cu wire bonding." Components and Packaging Technologies, IEEE Transactions on 27(3), 539 (2004).
Degryse, D., Vandevelde, B., Beyne, E., "Mechanical FEM simulation of bonding process on Cu LowK wafers", Components and Packaging Technologies, IEEE Transactions on 27(4), 643 (2004).
Liu, Y., Irving, S., Timwah Luk. "Thermosonic wire bonding process simulation and bond pad over active stress analysis", Electronics Packaging Manufacturing, IEEE Transactions on 31(1), 61 (2008).
Wright, A., Koffell, S., Pichler, P., Enichlmair, H., Minixhofer, R., Wachmann, E., "On the Thermo-Mechanical Modelling of a Ball Bonding Process with Ultrasonic Softening", Proc. IEEE EuroSimE conference, (2013).
Lin, H. Y., Upreti, K., Tippmann, A., Subbarayan, G., Jung, D. Y., Sammakia, B., "Simulations of Deformation and Stress During Copper Wirebond on ULK Chips", Proc. of ASME InterPACK2013 conference, (2013).
Huang, Y., Shah, A., Mayer, M., Zhou, N., Persic, J., "Effect of ultrasonic capillary dynamics on the mechanics of thermosonic ball bonding", IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, 57(1), art., no. 5361546, 241 (2010).
Mayer, M., Huang, Y., "Numerical analysis of ultra-high frequency wire bonding", Proc. International Symposium on Microelectronics, IMAPS 2009, 388 (2009).
Mayer, M., "Ultrasonic Stresses in Copper Wire Bonding with Pre-Bleed Ultrasound", extended abstract and presentation, 1st International Conference for Nanojoining and Microjoining, Beijing, China, (2012).
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