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NTIS 바로가기마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.20 no.3, 2013년, pp.53 - 57
장재원 (한국생산기술연구원 용접접합기술센터) , 유아미 (한국생산기술연구원 용접접합기술센터) , 이종현 (서울과학기술대학교 신소재공학과) , 이창우 (한국생산기술연구원 용접접합기술센터) , 김준기 (한국생산기술연구원 용접접합기술센터)
Although the lowering of Ag content in Sn-3.0Ag-0.5Cu is known to improve the mechanical shock reliability of the solder joint, it is also known to be detrimental to the solderbility. In this study, the quaternary alloying effect of In and the minor alloying effects of Mn and Pd on the solderability...
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핵심어 | 질문 | 논문에서 추출한 답변 |
---|---|---|
SAC305 무연솔더에서 Ag는 어떠한 역할을 하는가? | SAC305 무연솔더에서 3.0 wt%의 Ag는 공정조성에 가까운 합금을 형성하고 솔더 젖음성을 향상시키는 역할을 한다.5-6) 이러한 Ag 함량의 감소는 접합부에서 Ag3Sn 상의 형성을 감소시켜 기계적 충격 신뢰성을 향상시키는 것으로 알려져 있지만 젖음성과 열싸이클링(thermal cycling) 신뢰성은 저하되는 것으로 보고되고 있다. | |
Sn-3.0Ag-0.5Cu 조성의 장점과 단점은 무엇인가? | 0Ag-0.5Cu 조성(SAC305)은 기존 유연솔더에 비해 34°C 정도 융점이 높지만 젖음성(wettability), 기계적 강도, 접합부 신뢰성 등이 양호하여 현재 무연 전자기기에서 가장 널리 사용되고 있다.1-3) | |
보드레벨 낙하시험에서 무엇에 발생하는가? | 낙하충격에 의해 보드가 급격히 휘어지고, 이에 따라 솔더 접합부에는 순간 인장응력이 가해진다. 이러한 낙하시험에서는 금속 간화합물(intermetallic compound, IMC) 인근의 솔더 영역에서 취성파괴가 주로 발생하는 것으로 보고되고 있다.19-20) |
Z. W. Zhong, P. Arulvanan, H. P. Maw, C. W. A. Lu, "Characterization of SnAgCu and SnPb Solder Joints on Low-Temperature Co-Fired Ceramic Substrate", Solder. Surf. Mount Technol., 19(4), 18 (2007).
T. Takemoto, "Recent Progress of Lead-Free in Electronic Packaging", J. Vac. Soc. Jap., 48, 372 (2005).
T. Takemoto, "Lead-Free Solder and Micro-Joining", Mater. Jap., 35(4), 320 (1996).
G. Iyer, E. Ouyang, W. Kittidacha, S. Tantideeravit and S. LK, "Pb-free Solder: SAC105 vs SAC305 Drop-Test Reliability Data Comparison", Proc. 32th International Electronics Manufacturing Technology Symposium, San Jose, 251, IEEE/ CPMT (2007).
I. Ohnuma, M. Miyashita, K. Anzai, X. J. Liu, H. Ohtani, K. Kainuma and K. Ishida, "Phase Equilibria and the Related Properties of Sn-Ag-Cu Based Pb-free Solder Alloys", J. Electron. Mater., 29(30), 1137 (2000).
J. H. Lee, A. M. Yu, J. H. Kim, M. S. Kim and N. Kang, "Reaction Properties and Interfacial Intermetallics for SnxAg-0.5Cu Solders as a Function of Ag Content", Met. Mater. Int., 14(5), 649 (2008).
K. W. Moon, W. J. Boettinger, U. R. Kattner, F. S. Biancaniello and C. A. Handwerker, "Experimental and Thermodynamic Assessment of Sn-Ag-Cu Solder Alloys", J. Electron. Mater., 29, 1122 (2000).
S. Terashima, Y. Kariya, T. Hosoi and M. Tanaka, "Effect of Silver Content on Thermal Fatigue Life of Sn-xAg-0.5Cu Flip-Chip Interconnects", J. Electron, Mater., 32(12), 1527 (2003).
M. Amagai, Y. Toyota and T. Tajima, "High Solder Joint Reliability with Lead Free Solders", Proc. 53rd Electronic Components and Technology Conference(ECTC), New Orleans, 317, IEEE CPMT (2003).
A. M. Yu, M. S. Kim, C. Y. Hyun and J. H. Lee, "Wettability Evaluation of Sn-0.3Ag-0.7Cu Solder Alloy with Different Flux Activity and Indium Addition", J. Microelectron. Packag. Soc., 15(4), 51 (2008).
S. Fenglian, L. Yang, L. Yang and W. Jiabing, "Improving the Solderability and Electromigration Behavior of Low-Ag SnAgCu Soldering", Proc. 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems(Euro- SimE), Linz, 1/5, IEEE (2011).
J. H. Lee, C. W. Lee and J. H. Kim, "Quaternary Pb-free Solder Composition Incorporating Sn-Ag-Cu-In", Korea Patent 100797161(2008).
N. Sobczak, A. Kudyba, R. Nowak, W. Radziwill and K. Pietrzak, "Factors Affecting Wettability and Bond Strength of Solder Joint Couples", Pure Appl. Chem., 79(10), 1755 (2007).
JIS Z 3198-4, "Test Methods for Lead-Free Solders - Part 4: Methods for Solderbility Test by a Wetting Balance Method and a Contact Angle Method", JIS Standards, The Japan Welding Engineering Society (2003).
P. M. Hall, "Forces, Moments, and Displacements during Thermal Chamber Cycling of Leadless Ceramic Chip Carriers Soldered to Printed Boards", IEEE Trans. Components, Hybrids, Manuf. Technol., 7(4), 314 (1984).
P. M. Hall, "Creep and Stress Relaxation in Solder Joints of Surface Mounted Chip Carriers", IEEE Trans. Components, Hybrids, Manuf. Technol., 12(4), 556 (1987).
S. Terashima, Y. Kariya, T. Hosoi, and M. Tanaka, "Effect of Silver Content on Thermal Fatigue Life of Sn-xAg-0.5Cu Flip-Chip Interconnects", J. Electron. Mater., 32(12), 1527 (2003).
JESD22-A104D, "Temperature Cycling", JEDEC Standard, JEDEC Solid State Technology Association (2005).
E. H. Wong, K. M. Lim, N. Lee and S. Seah, "Drop Impact Test-Mechanics & Physics of Failure", Proc. 4th Electronics Packaging Technology Conference(EPTC), Singapore, 327, IEEE CPMT (2002).
H. J. Albrecht, A. Juritza, K. Muller, W. H. Muller, Sterthaus, J. Villain and A. Vogliano, "Interface Reactions in Microelectronic Solder Joints and Associated Intermetallic Compounds: An Investigation of Their Mechanical Properties Using Nanoindentation", Proc. 5th Electronics Packaging Technology Conference(EPTC), Singapore, 726, IEEE CPMT (2003).
JESD22-B111, "Board Level Drop Test Method of Components for Handheld Electronic Products", JEDEC Standard, JEDEC Solid State Technology Association(2003).
M. Alajoki, L. Nguyen and J. Kivilahti, "Drop Test Reliability of Wafer Level Chip Scale Packages", Proc. 55th Electronic Components and Technology Conference(ECTC), Orlando, 637, IEEE CPMT (2005).
H. H. Kim, D. H. Kim, J. B. Kim, H. J. Kim, J. U. Ahn, I. S. Kang, J. K. Lee, H. S. Ahn and S. Kim, "The Effect of UBM and SnAgCu Solder on Drop Impact Reliability of Wafer Level Package", J. Microelectron. Packag. Soc., 17(3), 65 (2010).
A. Shed, "Accumulated Creep Strain and Energy Density Based Thermal Fatigue Life Prediction Models for SnAgCu Solder Joint", Proc. 54th Electronic Components and Technology Conference(ECTC), Las Vegas, 737, IEEE CPMT (2004).
J. S. Jeong, Y. S. Lee, K. H. Shin, S. K. Cheong, J. H. Kim and D. Y. Jang, "An Experimental Study on the Failure Characteristics of Sn-xAg-Cu Lead Free Solder", J. Manuf. Eng. Technol., 18(5), 449 (2009).
C. M. L. Wu, D. Q. Yu, C. M. T. Law and L. Wang, "Properties of Lead-Free Solder Alloys with Rare Earth Element Additions", Mater. Sci. Eng., 44(1), 1 (2004).
T. M. Kang, D. W. Lee, Y. K. Hwang, Q. H. Chung and B. K. Yoo, "A Study on the Correlation Between Board Level Drop Test Experiment and Simulation", J. Microelectron. Packag. Soc., 18(2), 35 (2011)
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