[논문]State-of-the-Art mmWave Antenna Packaging Methodologies

Hong, Wonbin

State-of-the-Art mmWave Antenna Packaging Methodologies 원문보기

電磁波技術 : 韓國電磁波學會誌 = The Proceedings of the Korean Institute of Electromagnetic Engineering and Science, v.24 no.2, 2013년, pp.15 - 22

Hong, Wonbin (Samsung Electronics)

Abstract ▼ AI-Helper

Low-Temperature-cofired ceramics (LTCC) antenna packages have been extensively researched and utilized in recent years due to its excellent electrical properties and ease of implementing dense package integration topologies. This paper introduces some of the key research and development activities using LTCC packaging solutions for 60 GHz antennas at Samsung Electronics [1]. The LTCC 60 GHz antenna element topology is presented and its measured results are illustrated. However, despite its excellent performance, the high cost issues incurred with LTCC at millimeter wave (mmWave) frequencies for antenna packages remains one of the key impediments to mass market commercialization of mmWave antennas. To address this matter, for the first time to the author's best knowledge this paper alleviates the high cost of mmWave antenna packaging by devising a novel, broadband antenna package that is wholly based on low-cost, high volume FR4 Printed Circuit Board (PCB). The electrical properties of the FR4 substrate are first characterized to examine its feasibility at 60 GHz. Afterwards a compact multi-layer antenna package which exhibits more than 9 GHz measured bandwidth ($S_{11}{\leq}-10$ dB) from 57~66 GHz is devised. The measured normalized far-field radiation patterns and radiation efficiency are also presented and discussed.

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문제 정의

Despite its extremely low cost and abundance, FR4 has been widely regarded to be problematic for commercial mmWave applications within the antenna/RF community. In this paper, the author presents some of the notable mmWave antenna packaging technologies that have been researched and developed at Samsung Electronics in the past few years. Firstly, a 60 GHz antenna packaging solution devised using LTCC is presented along with its simulated and measured results.

가설 설정

02 mm (h_a) LTCC substrate. The spacing between each antennas elements and array configuration are determined based on four criterions: 1. Maximized scan angle in the x and y direction of the horizontal radiation plane. 2.

제안 방법

Firstly, a 60 GHz antenna packaging solution devised using LTCC is presented along with its simulated and measured results. Building upon this research, a novel, state-of-the-art multilayer mmWave antenna package which is wholly devised and fabricated based on low-cost FR-4 is proposed and presented. The proposed antenna package is expected to be instrumental in resolving the cost-effectiveness issues regarding current 60 GHz radios for commercial applications.
To verify the performance of the antenna array such as radiation pattern, beam tilts, gain in a conventional measurement environment, the antenna array is subdivided into two separate 4×1 and 1×6 array layouts.

대상 데이터

The presented LTCC mmWave antenna array consists of 24 LTCC antenna elements with equal number of ports situated on a 20 mm (La) × 15 mm (Wa) ×v1.02 mm (ha) LTCC substrate.

이론/모형

9] with the substrates and metal layers overlapped for better understanding. The antenna package is simulated and its design parameters are op-timized using Ansoft HFSS. The finalized radii of the top and bottom circular patch antennas are r_top = 700 um and r_bot = 670 um respectively.

성능/효과

To mitigate the cost-limitations of LTCC, a new, state-of-the art mmWave antenna package solution involving full utilization of low-cost, mass producible FR-4 substrates is presented and proposed. Simulated and measurement results confirm the antenna package to feature more than 9 GHz of -10 dB band- width while exhibiting an average radiation efficiency of more than 84 %.
Nonetheless, the co- and cross-pols in both planes exhibit more than 10 dB differences. The average measured gain obtained every 0.5 GHz interval from 57～66 GHz is calculated o be 4.9 dBi, indicating an average radiation efficiency of 84.7 %.

참고문헌 (10)

W. Hong, A. Goudelev, K. Baek, V. Arkhipenkov, and J. Lee, "24-element antenna-in-package for stationary 60-GHz communication scenarios", IEEE Antennas Wireless Propagat. Lett., vol. 10, pp. 738-741, 2011.
Y. P. Zhang, M. Sun, D. Liu, and Y. Yu. "Dual grid array antennas in a thin-profile package for flip-chip interconnection to highly integrated 60-GHz radios", IEEE Trans. Antennas Propag., vol. 59, no. 4, pp. 1191-1199, 2011.

상세보기
A. Lamminen, J. Saily, and A. R. Vimpari, "60 -GHz patch antennas and arrays on LTCC with embedded- cavity substrates", IEEE Trans. Antennas Propagat., vol. 56, no. 9, pp. 2865-2874, 2008.
D. Liu, H. Chen, and B. Floyd, "An LTCC superstrate patch antenna for 60-GHz package applications", in Proc. IEEE Antennas and Propagation Society Int. Symp. (APSURSI), pp. 1-4, 2010.
Y. P. Zhang, M. Sun, K. M. Chua, L. L. Wai, and D. X. Liu, "Integration of slot antenna in LTCC package for 60 GHz radios", Electronics Letters, vol. 44, no. 5, pp. 330-331, 2008.

상세보기
D. J. Chung, A. L. Amadjikpe, and J. Papapolymerou, "Multilayer integration of low-cost 60-GHz front-end transceiver on organic LCP", IEEE Antennas Wireless Propagat. Lett., vol. 10, pp. 1329- 1332, 2011.
F. Aryanfar, C. W. Werner, "Exploring liquid cry stal polymer (LCP) substrates for mm-Wave antennas in portable devices", in Proc. IEEE Antenna and Propagation Society Int. Symp. (APSURSI), pp. 1-4, 2010.
M. Al Henawy, M. Schneide, "Planar antenna arrays at 60 GHz realized on a new thermoplastic polymer substrate", in Proc. EuCAP'10, pp. 1-5, 2010.
Vishay, http://www.vishay.com.
Y. Kobayashi, T. Shimizu, "Millimeter wave measurements of temperature dependence of complex permittivity of dielectric plates by a cavity resonance method", in Proc. IEEE MTT-S Int. Microwave Symp. Digest, vol. 4, pp. 1885-1888, 1994.

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State-of-the-Art mmWave Antenna Packaging Methodologies 원문보기

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문제 정의

가설 설정

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