참고문헌 (23)

1. Journal of the Korean Printing Society J H Shin 11 1 1 1993 Shin, J. H., Ahn, S. C., and Oh, S. S., “A study on the reproduction of fine lines according to angle change in screen printing,” Journal of the Korean Printing Society, Vol. 11, No. 1, pp. 1-16, 1993. 

   원문보기 상세보기

2. K J Min 120 2001 Proceeding of the Korean Printing Society Conference Min, K. J., Nam, S. Y., Kim, G. Y., Choi, B. O., and Ham, Y. B., “A study on method to form PDP barrier rid by screen printing,” Proceeding of the Korean Printing Society Conference, pp. 120-126, 2001. 

3. Micro Electronics Reliability G C Dubey 13 3 203 1974 10.1016/0026-2714(74)90320-5 Dubey, G. C., “Screens for screen printing of electronic circuits,” Micro Electronics Reliability, Vol. 13, No. 3, pp. 203-207, 1974. 

   상세보기

4. Micro Electronics Reliability G C Dubey 14 5-6 427 1975 10.1016/0026-2714(75)90151-1 Dubey, G. C., “The squeegee in printing of electronic circuits,” Micro Electronics Reliability, Vol. 14, No. 5-6, pp. 427-429, 1975. 

   상세보기

5. K Cao 2006 Int. Conf. Electronic Packaging Technology Cao, K., Cheng, K., and Wang, Z., “Optimization of screen printing process,” Int. Conf. Electronic Packaging Technology, 2006. 

6. D Buzby 2008 International Microelectronics Assembly and Packaging Society Buzby, D. and Dobie, A., “Fine line screen printing of thick film pastes on silicon solar cells,” International Microelectronics Assembly and Packaging Society, 2008. 

7. M Neidert 2008 Photovoltaic Specialists Conference Neidert, M., Zhang, W., Zhang, D., and Kipka, A., “Screen-printing simulation study on solar cell front side Ag paste,” Photovoltaic Specialists Conference, 2008. 

8. Acta Materialia T Y Zhang 47 14 3869 1999 10.1016/S1359-6454(99)00248-7 Zhang, T. Y., Chen, L. Q., and Fu, R., “Measurements of residual stresses in thin films deposited on silicon wafers by indentation fracture,” Acta Materialia, Vol. 47, No. 14, pp. 3869-3878, 1999. 

   상세보기

9. I D Vrinceanu 297 2002 Proc. of 8th International Symposium Advanced Packaging Materials Vrinceanu, I. D. and Danyluk, S., “Measurement of residual stress in single crystal silicon wafers,” Proc. of 8th International Symposium Advanced Packaging Materials, pp. 297-301, 2002. 

10. Journal of Crystal Growth J C McLaughlin 85 1-2 83 1987 10.1016/0022-0248(87)90207-7 McLaughlin, J. C. and Willoughby, A. F. W., “Fracture of silicon wafers,” Journal of Crystal Growth, Vol. 85, No. 1-2, pp. 83-90, 1987. 

    상세보기

11. Acta Materialia T Vodenitcharova 60 11 4448 2012 10.1016/j.actamat.2012.04.040 Vodenitcharova, T., Borrero-López, O., and Hoffman, M., “Mechanics prediction of the fracture pattern on scratching wafers of single crystal silicon,” Acta Materialia, Vol. 60, No. 11, pp. 4448-4460, 2012. 

    상세보기

12. KS M 6518:2006, “Physical test methods for vulcanized rubber.” 

13. KS M ISO 815-1:2010, “Rubber, vulcanized or thermoplastic-Determination of compression set - Part 1: At ambient or elevated temperatures.” 

14. Transactions of the Korean Society of Mechanical Engineers W D Kim 28 6 848 2004 10.3795/KSME-A.2004.28.6.848 Kim, W. D., Kim, W. S., Kim, D. J., Woo, C. S., and Lee, H. J., “Mechanical testing and nonlinear material properties for finite analysis of rubber components,” Transactions of the Korean Society of Mechanical Engineers, Vol. 28, No. 6, pp. 848-859, 2004. 

    원문보기 상세보기

15. ABAQUS 2010 ABAQUS Version 6.10-1 Documentation ABAQUS, “ABAQUS Version 6.10-1 Documentation,” 2010. 

16. S L Kumar 2004 SEM X International Congress & Exposition on Experimental & Applied Mechanics Kumar, S. L., Arai, Y., Tsuchida, E., and Yoshida, M., “Plane strain singular field around interface edge using moiré interferometry,” SEM X International Congress & Exposition on Experimental & Applied Mechanics, 2004. 

17. K H Kim 124 2011 Dooyangsa Kim, K. H. and Lee, J. S., “Introduction to solar cell production,” Dooyangsa, pp. 124-133, 2011. 

18. Int. J. for Hybrid Microelectronics J D Provance 6 1 195 1983 Provance, J. D. and Allison, K., “Particle size effects on viscosity of silver pastes - A manufacturer’s view,” Int. J. for Hybrid Microelectronics, Vol. 6, No. 1, pp. 195-214, 1983. 

19. D L Basham 131 2005 United Facilities Criteria Basham, D. L., Wright, J. W., Ferguson, K. I., and Moy, G. W., “Design: Piers and wharves,” United Facilities Criteria, pp. 131-133, 2005. 

20. SolarEnergy 70 2010 Solar and Energy Solar and Energy, “Solar cell metal paste technology and market forecast,” Solar and Energy, pp. 70-83, 2010. 

21. B G Shin 46 2010 Master thesis, Material Engineering, Seoul National University of Science and Technology Shin, B. G., “Fracture behavior of ultra thin single crystalline Si wafer for solar cell,” Master thesis, Material Engineering, Seoul National University of Science and Technology, pp. 46-54, 2010. 

22. Int. J. Precis. Eng. Manuf. H S Yoon 12 5 871 2011 10.1007/s12541-011-0116-6 Yoon, H. S., Wu, R., Lee, T. M., and Ahn, S. H., “Geometric optimization of micro drills using Taguchi methods and response surface methodology,” Int. J. Precis. Eng. Manuf., Vol. 12, No. 5, pp. 871-875, 2011. 

    원문보기 상세보기

23. Journal of Materials Processing Technology K C Park 51 1-4 64 1995 10.1016/0924-0136(94)01578-O Park, K. C. and Kim, Y. S., “The effect of material and process variables on the stamping formability of sheet materials,” Journal of Materials Processing Technology, Vol. 51, No. 1-4, pp. 64-78, 1995. 

    상세보기

저자의 다른 논문 :

김영석 (94)