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NTIS 바로가기대한산업공학회지 = Journal of the Korean Institute of Industrial Engineers, v.40 no.2, 2014년, pp.215 - 222
This paper provides a real-time loading strategy for batch processing machines in which a number of jobs are simultaneously processed as a batch. The batch processing machines can be seen in both manufacturing industries (e.g., semiconductor, automobile and metal working) and service industries (tra...
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핵심어 | 질문 | 논문에서 추출한 답변 |
---|---|---|
웨이퍼팹의 특징은? | 이중웨이퍼팹 공정은 반도체 생산을 위한 핵심 공정으로서 다양한 장비들로 연결된 많은 세부공정으로 이루어 져 있다. 웨이퍼팹은 reentrant 흐름, 즉 제품이 시스템 내에서 일련의 공정들을 여러 번 반복적으로 거치는 특징이 있다. [Figure 1]은 반도체웨이퍼팹 공정을 제품의 흐름 관점에서 간단하게 표현한 것이다. | |
반도체 제조공정은 어떤 단계로 구성되는가? | 반도체 제조공정은 웨이퍼(wafer) 위에 여러 회로층을 입히는 웨이퍼팹(wafer fab) 공정과 회로가 형성된 웨이퍼를 절단하여 IC 칩으로 형상화하는 조립/검사 공정 단계로 구성된다. 이중웨이퍼팹 공정은 반도체 생산을 위한 핵심 공정으로서 다양한 장비들로 연결된 많은 세부공정으로 이루어 져 있다. | |
배치생산공정의 특징은? | 일반적으로 배치생산공정은 생산능력에 제한이 있어 한 번에 수용할 수 있는 최대수용능력이 존재한다. 일단 작업이 시작되면 중단 없이 작업이 진행되며 작업 중간에는 작업물이 새롭게 추가되거나 공정에서 빠져나올 수 없고 모든 작업물이 동시에 작업을 마치게 된다. |
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