최소 단어 이상 선택하여야 합니다.
최대 10 단어까지만 선택 가능합니다.
다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
NTIS 바로가기한국표면공학회지 = Journal of the Korean institute of surface engineering, v.49 no.5, 2016년, pp.401 - 407
Nguyen, Van Phuong (Korea Institute of Materials Science) , Park, Min-Sik (KMW Inc.) , Yim, Chang Dong (Korea Institute of Materials Science) , You, Bong Sun (Korea Institute of Materials Science) , Moon, Sungmo (Korea Institute of Materials Science)
In this work, effect of zincate treatment of AZ91 Mg alloy on the following electrodeposition of copper was examined in a non-cyanide bath containing pyrophosphate ions in view of surface morphology and adhesion of the electrodeposited copper layer. Without zincate treatment, the electrodeposited co...
* AI 자동 식별 결과로 적합하지 않은 문장이 있을 수 있으니, 이용에 유의하시기 바랍니다.
J. E. Gray, B. Luan, Protective coatings on magnesium and its alloys - a critical review, J. Alloy Compd., 336 (2002) 88-113.
N. V. Phuong, K. H. Lee, D. Chang, M. Kim, S. Lee, S. Moon, Zinc phosphate conversion coatings on magnesium alloys - a review, Met. Mater. Int., 19 (2013) 273-281.
X. B. Chen, H. Y. Yang, T. B. Abbott, M. A. Easton, N. Birbilis, Corrosion-resistance electrochemical platings on magnesium alloys: A state-of-the-art review, Corrosion, 68 (2011) 518-535.
G. L. Song, Corrosion prevention of magnesium alloys, Woodhead Publishing Limited. (2013).
F. Czerwinski, Magnesium alloys - Corrosion and surface treatments, InTech, Croatia, (2011) 153-184.
T. S. N. Sankara Narayanan, I. S. Park, M. H. Lee, Strategies to improve the corrosion resistance of microarc oxidation (MAO) coated magnesium alloys for degradable implants: Prospects and challenges, Prog. Mater. Sci., 60 (2014) 1-71.
N. V. Phuong, S. Moon, Deposition and characterization of E-paint on magnesium alloys, Prog. Org. Coat., 89 (2015) 91-99.
A. Atrens, G. -L. Song, M. Liu, Z. Shi, F. Cao, M. S. Dargusch, Review of recent developments in the field of magnesium corrosion, Adv. Eng. Mater., 17 (2015) 400-453.
L. P. Wu, J. J. Zhao, Y. P. Xie, Z. D. Yang, Progress of electroplating and electroless plating on magnesium alloy, Trans. Nonferrous Met. Soc. China, 20 (2010) 630-637.
X. P. Lei, G. Yu, Y. P. Zhu, Z. P. Zhang, X. M. He, B. N. Hu, Y. Chen, Successful cyanide free plating protocols on magnesium alloys, T. I. Met. Finish., 88 (2010) 75-80.
Modern electroplating 5th edition, Mordechay Schlesinger (Editor), Milan Paunovic (Editor), A John Wiley & Sons, Inc., Publication (2010) 33-78.
C. A. Huang, T. H.Wang, T. Weirich, V. Neubert, A pretreatment with galvanostatic etching for copper electrodeposition on pure magnesium and magnesium alloys in an alkaline copper-sulfate bath, Electrochim. Acta, 53 (2008) 7235-7241.
P. Zhu, L.Y. Wang, G.R.Qian, T.H. Cao, Copper coating electrodeposited directly onto AZ31 magnesium alloy, Anti-Corros. Method. M., 60 (2013) 127-133.
J. Tang, K. Azumi, Effect of copper pretreatment on the zincate process and subsequent copper electrodeposition of AZ31 magnesium alloy, J. Electrochem. Soc., 158 (2011) D535-D540.
P. Zhu, L. Y. Wang, Y. Chen, M. Zhou, J. Zhou, Electrodeposition of copper coating on AZ31 magnesium alloy, Surf. Eng., 28 (2012) 796-799.
J. C. Ballesteros, E. Chainet, P. Ozil, Y. Meas, G. Trejo, Electrodeposition of copper from non-cyanide alkaline solution containing tartrate, Int. J. Electrochem. Sci., 6 (2011) 2632-2651.
J. Tang, K. Azumi, Influence of zincate pretreatment on adhesion strength of a copper electroplating layer on AZ91 D magnesium alloy, Surf. Coat. Tech., 205 (2011) 3050-3057.
C. A. Huang, Y. H. Yeh, C. K. Lin, C. Y. Hsieh, Copper electrodeposition on a magnesium alloy (AZ80) with a U-Shaped surface, Materials, 7 (2014) 7366-7378.
O. Radovici, Cecilia Vass, I. Solacolu, Some aspects of copper electrodeposition from pyrophosphate electrolytes, Electrodepos. Surface Treat., 2 (1974) 263-273.
J. H. Lee, Y. H. Kim, U. C. Jung, W. S. Chung, Electroplating on magnesium alloy in KF-added pyrophosphate copper bath, Kor. J. Met. Mater., 48 (2010) 218-224.
J. Kato, W. Urushihara, T. Nakayama, Magnesium based alloys article and a method thereof, US Patent No: 6,068,938.
ASTM standard D3359-02, ASTM International; 2004, 06.01.
Tohru Watanabe, Nano-plating: Microstructure control theory of plated film and data base of plated film microstructure, Elsevier (2004).
M. Hayase, Electronics Packaging 3, The Electrochemical Society (2009).
※ AI-Helper는 부적절한 답변을 할 수 있습니다.