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Active Infrared Thermography for Visualizing Subsurface Micro Voids in an Epoxy Molding Compound 원문보기

비파괴검사학회지 = Journal of the Korean Society for Nondestructive Testing, v.37 no.2, 2017년, pp.106 - 114  

Yang, Jinyeol (Test and Package Center, Samsung Electronics) ,  Hwang, Soonkyu (Department of Civil and Environmental Engineering, Korea Advanced Institute of Science and Technology) ,  Choi, Jaemook (Department of Civil and Environmental Engineering, Korea Advanced Institute of Science and Technology) ,  Sohn, Hoon (Department of Civil and Environmental Engineering, Korea Advanced Institute of Science and Technology)

Abstract AI-Helper 아이콘AI-Helper

This paper presents an automated subsurface micro void detection technique based on pulsed infrared thermography for inspecting epoxy molding compounds (EMC) used in electronic device packaging. Subsurface micro voids are first detected and visualized by extracting a lock-in amplitude image from raw...

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제안 방법

  • In this study, the active infrared thermography system with a baseline-free defect detection algorithm is developed to automatically and instantaneously detect and visualize subsurface (below 150 µm ~ 300 µm from the inspection surface) micro (150 µm ~ 300 µm in diameter) voids in epoxy molding compounds (EMCs) used in electronic chip packaging.

대상 데이터

  • 1 shows an overall schematic of the active infrared thermography system composed of excitation, sensing, and control units. The excitation unit consists of an arbitrary wave generator (AWG) and a quartz halogen lamp. AWG generates a modulated voltage signal according to a control signal sent by the control unit.
  • Note that the quartz halogen lamp which has the wavelength range of near infrared is useful for penetrating much deeper into a specimen because shorter wavelengths are likely to lead to more efficient thermal wave generation in the thickness direction [12]. The sensing unit is comprised of an infrared camera with a close-up lens. The infrared camera with an uncooled micro bolometer detector is used to capture 2D raw thermal images of the radiated heats from the EMC surface.
  • 4 (a) and (b). Total 36 EMC specimens are tested and labeled as EMC 1 to EMC 36. EMC 1 to EMC 18 have subsurface micro voids, and EMC 19 to EMC 36 are intact.

이론/모형

  • The extreme value statistics is a branch of statistics that models the statistical properties of extreme values in either the upper or lower tails of sampled data [16]. Among available extreme value distributions, a Gumbel distribution is selected in this study to characterize the upper tail distribution of the processed lock-in amplitude values based on goodness-of-fit analysis. Once the best-fit Gumbel distribution is estimated, the threshold value corresponding to a one-sided 99% confidence interval is determined.
  • The infrared camera is 50 mm apart from the test specimen, and acquires raw thermal images with a sampling rate of 50 Hz. Once the thermal responses are measured, the data is transmitted to the control computer and processed by the proposed baseline-free subsurface micro void visualization algorithm described in the following section.
  • This temperature variation over the surface is reflected in the measured raw thermal images. The raw thermal images are processed by the proposed baseline-free subsurface micro void visualization algorithm to extract and isolate void-induced perturbation. Such baseline-free diagnostic is able to provide instantaneous diagnosis and minimize false alarms caused by irregular surface conditions of the test specimen and arbitrary noise components of the raw thermal images, making it suitable for online inspection.
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참고문헌 (17)

  1. H. Xiao, "Introduction to Semiconductor Manufacturing Technology," Washington: SPIE press in United States, (2012) 

  2. M. K. Abdullah, M. Z. Abdullah, M. A. Mujeebu and S. K. Kamaruddin, "A study on the effect of epoxy molding compound (EMC) rheology during encapsulation of stacked-CHIP scale packages (S-CSP)," Journal of Reinforced Plastics and Composites, Vol. 28, pp. 2527-2538 (2009) 

  3. A. Haleh, "Hygroscopic swelling and sorption characteristics of epoxy molding compounds used in electronic packaging," IEEE Transactions on Components and Packaging Technologies, Vol. 26, pp. 206-214 (2003) 

  4. C. Y. Khor, M. A. Abdullah, Z. M. Ariff and W. C. Leong, "Effect of stacking chips and inlet positions on void formation in the encapsulation of 3D stacked flip-chip package," International Communications in Heat and Mass Transfer, Vol. 39, pp. 670-680 (2012) 

  5. T. Tian, K. Chen, A. MacDowell, D. Parkinson, T. Lai and K. N. Tu, "Quantitative X-ray microtomography study of 3-D void growth induced by electromigration in eutectic SnPb flip-chip solder joints," Scripta Materialia, Vol. 65, pp. 646-649 (2011) 

  6. M. Clark, S. Sharples and M. Somekh, "Non-contact acoustic microscopy," Measurement Science and Technology, Vol. 11, pp. 1792-1801 (2000) 

  7. C. Meola and M. Carlomagno, "Recent advances in the use of infrared thermography," Measurement Science and Technology, Vol. 15, R27-R58 (2004) 

  8. G. Busse, D. We and W. Karpen, "Thermal wave imaging with phase sensitive modulated thermography," Journal of Applied Physics, Vol. 71, No. 8, pp. 3962-3965 (1992) 

  9. W. Bai and B. S. Wong, "Evaluation of defects in composite plates under convective environments using lock-in thermography," Measurement Science and Technology, Vol. 12, pp. 142-150 (2001) 

  10. M. Choi, K. Kang, J. Park, W. Kim and K. Kim, "Quantitative determination of a subsurface defect of reference specimen by lock-in infrared thermography," NDT&E International, Vol. 41, pp. 119-124 (2008) 

  11. S. Dudzik, "Approximation of thermal background applied to defect detection using the methods of active thermography," Metrology and Measurement Systems, Vol. 17, pp. 621-636 (2010) 

  12. M. Balu, T. Baldacchini, J. Carter, T. B. Krasieva, R. Zadoyan and B. J. Tromberg, "Effect of excitation wavelength on penetration depth in nonlinear optical microscopy of turbid media," Journal of Biomedical Optics, Vol. 14, 010508 (2009) 

  13. G. Traxler, M. Scheerer and C. Steiger, "Square pulse thermography system design considerations for detection of voids inside of the material with different properties and finite differences," Proceedings of SPIE, Vol. 5679, pp. 118-128 (2005) 

  14. HL. John IV, HL. John V, "A heat transfer textbook," 4th ed. Cambridge: Phlogiston Press in United States, (2008) 

  15. J. Liu, W. Yang and J. Dai, "Research on thermal wave processing of lock-in thermography based on analyzing image sequences for NDT," Infrared Physics & Technology, Vol. 53, pp. 348-357 (2010) 

  16. A. Rinaldi and D. Krajcinovic, "Statistical damage mechanics and extreme value theory," International Journal of Damage Mechanics, Vol. 16, pp. 57-76 (2015) 

  17. R. H. Chan, C. W. Ho, Nikolova M, "Salt-and-pepper noise removal by median-type noise detectors and detail-preserving regularization," IEEE Transaction on Image Processing, pp. 14 1479-1485 (2005) 

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