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NTIS 바로가기비파괴검사학회지 = Journal of the Korean Society for Nondestructive Testing, v.37 no.2, 2017년, pp.106 - 114
Yang, Jinyeol (Test and Package Center, Samsung Electronics) , Hwang, Soonkyu (Department of Civil and Environmental Engineering, Korea Advanced Institute of Science and Technology) , Choi, Jaemook (Department of Civil and Environmental Engineering, Korea Advanced Institute of Science and Technology) , Sohn, Hoon (Department of Civil and Environmental Engineering, Korea Advanced Institute of Science and Technology)
This paper presents an automated subsurface micro void detection technique based on pulsed infrared thermography for inspecting epoxy molding compounds (EMC) used in electronic device packaging. Subsurface micro voids are first detected and visualized by extracting a lock-in amplitude image from raw...
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