최소 단어 이상 선택하여야 합니다.
최대 10 단어까지만 선택 가능합니다.
다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
NTIS 바로가기접착 및 계면 = Journal of adhesion and interface, v.19 no.2, 2018년, pp.84 - 94
정종구 (히가시야마 필름)
Electrically debonding adhesives[EDA], one of the controlled delamination materials[CDM] is reviewed. CDM can be defined as the ability to separate adhesive bonded assemblies without causing damage to the substrates. Its application includes electronics, medical surgery, dentistry, building and gene...
B. A. Hutchinson, Y. Liu & Y. Lu, The Journal of Adhesion, 93, 10, (2016).
S. Porada et al., Progress in Materials Science, 58, 8, (2013).
M. D. Gilbert, US Patent 2008/0196828A1, (2008).
J. Welsh, Structural Dynamics, and Materials Conference, 7-10, (2003).
Y. Lu, J. Broughton, P. Winfield, International Journal of Adhesion and Adhesives, 50, (2014).
H. Shiote, C. Sato, M. Ohe, J Adhes Soc Japan, 45, 10 (2009).
J. S. Berg, et al., US Patent US9371669B2, (2016).
R. McCurdy, Ph D Thesis:, Oxford Brookes University, (2011).
D. Haydon, Assem Autom, 22, 4, (2002).
D. E. Packham, Handbook of Adhesion Second Edition. (2005).
S. O. Dorst, US Patent US Pat. No. 2,765,267., (1956).
EMEC consultants, US Patent No. 5,507,926, (1996).
B. WH, Jackson DR., Transp Res Rec, (2001).
Leijonmarck, S., et al., International Journal of Adhesion and Adhesives, 32, 39, (2012).
S. Leijonmarck, Ph D thesis:, Kungliga Tekniska Hogskolan, Stockholm, (2013).
WO2010146144A3, JP2012530173A, (2007).
WO2005028583A1, (2003).
W. J. van Ooij, A. Sabata, D. Loison, T. Jossic, and T. C. Charbonnier, J. Adhes. Sci. Technol., 3, 1, (1989).
Leijonmarck, S., et al., Journal of the Electrochemical Society, 158, 109 (2011).
http://www.eiclabs.com/index.htm 111 Downey St., Norwood, MA 02062 Tel. (781)769-9450; Fax (781)551-0283.
M. D. Gilbert, US Patent: 6620308, (2006).
H. Shiote, Y. Sekiguchi, M. Ohe, and C. Sato, The Journal of Adhesion, 93, 10, (2017).
M. D. Gilbert, US Patent: 20070269659, (2007).
P. Norberg, T. Remonen, X. Wang, M. Sandberg, WO2008150227 A1, (2007).
Henkel Ag, WO2017133864A1, EP3199344A1, (2016).
The Yokohama Rubber Co., Ltd., EP1914285A1, (2005).
H. K. Gatty, S. Schroder, F. Niklaus, N. Roxhed and G. Stemme, J. Solid State Sci. Technol., 3, 5, (2014).
H. Stockman (Air Materiel Command, Cambridge Field Station, Cambridge 39, Mass.).
O. K. Ban, A. C. Spielberg, US Patent: US7430398-B2, (2005).
J. Gao, Z. Pang, Q. Chen, L. R. Zheng, IEEE RFID, (2010).
Kajimoto, Noboru, スマ?トに剝離可能な新規齒科用セメントの開發, (2015).
梶本昇, 宇山惠美, 關根一光, 浜田賢一, 日本齒科理工學會近畿中四國地方會夏期セミナ?, 大阪, (2015).
※ AI-Helper는 부적절한 답변을 할 수 있습니다.