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Abstract ▼ AI-Helper

The paper reports the characteristics of conduction heat transfer to the backside part according to the heating temperature of a composite wall in a lightweight partition used for indoor space compartments. Stud partitions, SGP partitions, sandwich panels, urethane foam panels, and glass wool panels...

The paper reports the characteristics of conduction heat transfer to the backside part according to the heating temperature of a composite wall in a lightweight partition used for indoor space compartments. Stud partitions, SGP partitions, sandwich panels, urethane foam panels, and glass wool panels. which are generally used as light-weight partition walls, were selected as experiment samples, and the characteristics of conduction heat transfer to the backside part as the top surface were analyzed by applying heating temperatures of $200^{\circ}C$, $300^{\circ}C$, $400^{\circ}C$, and $500^{\circ}C$ to the bottom surface for 1800 s. According to the experimental results, the maximum backside temperatures at the maximum heating temperature of $500^{\circ}C$ was $51.6^{\circ}C$, $63.6^{\circ}C$, $317.2^{\circ}C$, $124.9^{\circ}C$, and $42.2^{\circ}C$ for the stud partition, SGP partition, sandwich panel, urethane foam panel, and glass wool panel, respectively. The maximum conduction heat- transfer rates at $500^{\circ}C$ were 17.16 W, 18.39 W, 136.65 W, 14.34 W, and 5.57 W for the stud partition, SGP partition, sandwich panel, urethane foam, and glass wool panel, respectively.

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