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NTIS 바로가기한국전자통신학회 논문지 = The Journal of the Korea Institute of Electronic Communication Sciences, v.14 no.5, 2019년, pp.887 - 892
정양희 (전남대학교 전기 및 반도체공학과) , 최병균 (전남대학교 전기 및 반도체공학과) , 강성준 (전남대학교 전기 및 반도체공학과)
In this study, after 20nm-thick
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