참고문헌 (17)

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11. Shi, S., Li, Z., Tsai, P., Dong, L., Wang, D., Shi, Y., Du, S., Cai, P., Gao, M., Zheng, M., Wang, H., "Research on Commercial Foldable AMOLED and Relevant Technologies", SID Symposium Digest of Technical Papers, vol. 51, pp. 826-829, (2020). 

12. Kim, J.-H., Lee, T.-I., Kim, T.-S., Paik, K.-W., "The effect of anisotropic conductive films adhesion on the bending reliability of chip-in-flex packages for wearable electronics applications", IEEE Trans. Comp., Pack & Manuf. Techn, 7(10), pp. 1583-1591, (2017). 

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13. Cuddalorepatta, G.K., Sim, G.-D., Li, H., Pantuso, D., Vlassak, J.J., "Residual stress-driven test technique for freestanding ultrathin films: Elastic behavior and residual strain", J. Mat. Res., 34(20), pp. 3474-3482, (2019). 

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14. Khan, M.U.A., Raad, R., Tubbal, F., Theoharis, P.I., Liu, S., Foroughi, J., "Bending analysis of polymer-based flexible antennas for wearable, general IoT applications: A review", Polymers, 13, 357, (2021). 

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15. Saleh, R., Barth, M., Eberhardt, W., Zimmermann, A., "Bending setups for reliability investigation of flexible electronics", Micromachines, 12, 78, (2021). 

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16. ASTM D522 / D522M-17, Standard Test Methods for Mandrel Bend Test of Attached Organic Coatings, ASTM International, West Conshohocken, PA, 2017, www.astm.org 

17. Jeong, J.-H., Kim, J.-H., Oh, C.-S., "Quantitative evaluation of bending reliability for a flexible near-field communication tag", Microelectronics Rel., 75, pp. 121-126, (2017). 

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