[논문]Smart Factory Big Data를 활용한 공정 이상 탐지 프로세스 적용 사례 연구

남현우

doi:10.5351/kjas.2021.34.1.099

Smart Factory Big Data를 활용한 공정 이상 탐지 프로세스 적용 사례 연구
A case study on the application of process abnormal detection process using big data in smart factory 원문보기

응용통계연구 = The Korean journal of applied statistics, v.34 no.1, 2021년, pp.99 - 114

남현우 (가천대학교 응용통계학과)

초록
AI-Helper

반도체 제조 산업에서는 Big Data에 기초한 Smart Factory 도입과 적용이 가시화되면서 생산 공정의 각 단계에서 수집 가능한 다양한 센서(sensor) 데이터를 활용하여 공정 이상 탐지 및 최종 수율 예측 등에 다양한 분석 방법을 시도하고 있다. 현재 반도체 공정은 원료인 잉곳(ingot)에서 패키징(packaging) 작업 이전의 웨이퍼(wafer) 생산까지 500 600개 이상의 세부 공정과 이와 연계된 수천 개의 계측 공정으로 구성된다. 개별 계측 공정 내의 실제 계측 비율은 대상 제품 대비 0.1%에서 최대 5%를 넘지 못하고 계측 시점별로 일정하게 유지할 수 없다. 이러한 이유로 공정 각 단계의 정상 상태를 간접적으로 판단할 수 있는 장비 센서(sensor) 데이터를 활용하여 관리 여부를 판단하고자 하는 노력이 계속되고 있다. 본 연구에서는 장비 센서 데이터 기반의 공정 이상 탐지 프로세스를 정의하고 현재 적용 되고 있는 기술 통계량 기반 진단 방법의 단점을 보완하기 위해 FDA(Functional Data Analysis)방법을 활용하였다. 실제 현장 사례 데이터에 머신러닝을 이용하여 이상 탐지 정확도 비교를 통해 효과성을 검증하였다.

Abstract ▼ AI-Helper

With the Fourth Industrial Revolution based on new technology, the semiconductor manufacturing industry researches various analysis methods such as detecting process abnormalities and predicting yield based on equipment sensor data generated in the manufacturing process. The semiconductor manufacturing process consists of hundreds of processes and thousands of measurement processes associated with them, each of which has properties that cannot be defined by chemical or physical equations. In the individual measurement process, the actual measurement ratio does not exceed 0.1% to 5% of the target product, and it cannot be kept constant for each measurement point. For this reason, efforts are being made to determine whether to manage by using equipment sensor data that can indirectly determine the normal state of each step of the process. In this study, the Functional Data Analysis (FDA) was proposed to define a process abnormality detection process based on equipment sensor data and compensate for the disadvantages of the currently applied statistics-based diagnosis method. Anomaly detection accuracy was compared using machine learning on actual field case data, and its effectiveness was verified.

주제어

표/그림 (8)

그림 Figure 1: History of process analytics in semiconductor manufacturing.
표 Table 1: Definitions of Advanced Process Control(APC) and APC extended capabilities
그림 Figure 2: Process monitoring windows defined based on the trace for each sensor.
그림 Figure 3: Comparison of anomaly detection method.
그림 Figure 4: Anomaly detection procedure.
그림 Figure 5: Example of functional PCA results.
그림 Figure 6: Comparison between PC score and descriptive statistics.
표 Table 2: Anomaly detection model performance comparison results

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