참고문헌 (13)

1. S. Tohoda, D. Fujishima, A. Yano, A. Ogane, K. Matsuyama, Y. Nakamura, N. Tokuoka, H. Kanno, T. Kinoshita, H. Sakata, M. Taguchi, and E. Maruyama, "Future directions for higher-efficiency HIT solar cells using a Thin Silicon Wafer," Journal of Non-Crystalline Solids, vol. 358, no. 17. Elsevier BV, pp. 2219-2222 (2012).？ 

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2. M. Taguchi, A. Yano, S. Tohoda, K. Matsuyama, Y. Nakamura, T. Nishiwaki, K. Fujita, and E. Maruyama, "24.7% Record Efficiency HIT Solar Cell on Thin Silicon Wafer," IEEE Journal of Photovoltaics, vol. 4, no. 1. Institute of Electrical and Electronics Engineers (IEEE), pp. 96-99 (2014).？ 

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3. LONGI Solar, "At 26.81%, LONGi sets a new world record efficiency for silicon solar cells," https://www.longi.com/en/news/propelling-the-transformation/ (2022).？ 

4. S. De Wolf and M. Kondo, "Nature of doped a-Si:H/c-Si interface recombination," Journal of Applied Physics, vol. 105, no. 10. AIP Publishing, p. 103707 (2009).？ 

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5. S. Braun, G. Micard, and G. Hahn, "Solar Cell Improvement by using a Multi Busbar Design as Front Electrode," Energy Procedia, vol. 27. Elsevier BV, pp. 227-233 (2012).？ 

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6. J. Walter, L. C. Rendler, C. Ebert, A. Kraft, and U. Eitner, "Solder joint stability study of wire-based interconnection compared to ribbon interconnection," Energy Procedia, vol.？124. Elsevier BV, pp. 515-525 (2017).？ 

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7. S. Braun, G. Hahn, R. Nissler, C. Ponisch, and D. Habermann, "Multi-busbar Solar Cells and Modules: High Efficiencies and Low Silver Consumption," Energy Procedia, vol. 38. Elsevier BV, pp. 334-339 (2013).？ 

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8. A. De Rose, D. Erath, T. Geipel, A. Kraft, and U. Eitner, "Low-Temperature Soldering for the Interconnection of Silicon Heterojunction Solar Cells," 33rd European Photovoltaic Solar Energy Conference and Exhibition; 710-714 (2017).？ 

9. S. Pingel, D. Erath, T. Wenzel, S. Nold, D. Eberlein, A. De Rose, S. Tepner, J. Schube, G. Ivanov, E. Terukova, A. Moldovan, A. Lorenz, and F. Clement, "Low-temperature Ag-Paste Screening for Silicon Heterojunction Solar Cells and Modules," 37th European Photovoltaic Solar Energy Conference and Exhibition; 508-511 (2020).？ 

10. A. De Rose, T. Geipel, D. Eberlein, A. Kraft, and M. Nowottnick, "Interconnection of Silicon Heterojunction Solar Cells by Infrared Soldering - Solder Joint Analysis and Temperature Study," 36th European Photovoltaic Solar Energy Conference and Exhibition; 229-234 (2019).？ 

11. Y. Zemen, H.-S. Teusch, G. Kropke, S. Pingel, and S. Held, "The Impact of Busbar Surface Topology and Solar Cells Soldering Process," 27th European Photovoltaic Solar Energy Conference and Exhibition; 2030-2034 (2012).？ 

12. Moyer, J., Zhang, W., Kurtz, E., Tavares, R., Buzby, D., and Kleinbach, S., "The Role of Silver Contact Paste on Reliable Connectivity Systems," 25th European Photovoltaic Solar Energy Conference and Exhibition / 5th World Conference on Photovoltaic Energy Conversion, 2624-2630 (2010).？ 

13. Schmitt, P., Eberlein, D., Voos, P., Tranitz, M., and Wirth, H. "Metallographic Preparation of Solar Cell Samples for Quality Assurance and Material Evaluation," Energy Procedia. Elsevier BV. 402-408 (2011).