황동석의 중온 가압침출 중 염소이온과 계면활성제 첨가가 구리침출에 미치는 영향 Effects of Chloride and Surfactant Addition on the Copper Leaching During Medium-temperature Pressure Leaching of Chalcopyrite원문보기
황동석의 가압침출공정을 90℃~150℃의 저온 및 중온 범위에서 운영하면 황동석 중 황성분이 단체황으로 전환되며 구리의 침출을 억제한다. 본 연구에서는 150℃의 중온 가압침출공정 중 염소이온과 계면활성제를 첨가하여 구리침출율을 개선하고자 하였다. 티타늄 재질의 2L 반응기를 탑재한 가압침출기를 이용해 5g/L과 50g/L 황산용액에서 D90 입도가 10㎛와 45㎛인 황동석 정광분말 100g을 이용해 180분 동안 가압침출실험을 진행하였다. 50g/L 황산용액 및 염소이온과 계면활성제가 없는 조건에서 D90 입도가 45㎛인 시료를 사용한 경우, 180분 침출 후 구리의 침출율은 48%로 나타났다. 염산, 염화구리, 염화나트륨 등 12g/L의 염소이온을 첨가하여 침출한 결과, 염산과 염화구리 첨가시 침출율이 각각 96%와 97%로 분석되었다. SLS(Sodium lignosulfonate)와 CLS(calcium lignosulfonate)의 계면활성제를 첨가하여 가압침출실험을 진행한 결과, 99% 이상의 침출율을 나타내었다. 결과적으로 50g/L 황산용액에서 염소이온과 계면활성제를 첨가한 경우 구리침출율은 상승하였다.
황동석의 가압침출공정을 90℃~150℃의 저온 및 중온 범위에서 운영하면 황동석 중 황성분이 단체황으로 전환되며 구리의 침출을 억제한다. 본 연구에서는 150℃의 중온 가압침출공정 중 염소이온과 계면활성제를 첨가하여 구리침출율을 개선하고자 하였다. 티타늄 재질의 2L 반응기를 탑재한 가압침출기를 이용해 5g/L과 50g/L 황산용액에서 D90 입도가 10㎛와 45㎛인 황동석 정광분말 100g을 이용해 180분 동안 가압침출실험을 진행하였다. 50g/L 황산용액 및 염소이온과 계면활성제가 없는 조건에서 D90 입도가 45㎛인 시료를 사용한 경우, 180분 침출 후 구리의 침출율은 48%로 나타났다. 염산, 염화구리, 염화나트륨 등 12g/L의 염소이온을 첨가하여 침출한 결과, 염산과 염화구리 첨가시 침출율이 각각 96%와 97%로 분석되었다. SLS(Sodium lignosulfonate)와 CLS(calcium lignosulfonate)의 계면활성제를 첨가하여 가압침출실험을 진행한 결과, 99% 이상의 침출율을 나타내었다. 결과적으로 50g/L 황산용액에서 염소이온과 계면활성제를 첨가한 경우 구리침출율은 상승하였다.
When the pressure leaching process of chalcopyrite is operated in the low and medium temperature range of 90℃~150℃, the sulfur component in chalcopyrite is converted to elemental sulfur, which suppresses the leaching of copper. In the present study, the copper leaching rate was improve...
When the pressure leaching process of chalcopyrite is operated in the low and medium temperature range of 90℃~150℃, the sulfur component in chalcopyrite is converted to elemental sulfur, which suppresses the leaching of copper. In the present study, the copper leaching rate was improved by adding chloride ions and surfactants during the medium-temperature pressure leaching process at 150℃. Using the autoclave equipped with a 2L reactor made of titanium, a pressure leach tests were conducted for 180 min using 100g of chalcopyrite concentrate with D90 particle sizes of 10㎛ and 45㎛ in 5g/L and 50g/L sulfuric acid solutions. At 50g/L sulfuric acid solution without chloride ion and surfactant, when a sample with a D90 particle size of 45㎛ was used, the copper leaching efficiency after 180 min was 48%. As a result of leaching by adding 12g/L of chloride ions such as HCl, CuCl2, and NaCl, the leaching efficiencies increased to 96% and 97%, respectively, by adding HCl and CuCl2. As a result of a pressure leaching tests by adding surfactants of SLS (Sodium lignosulfonate) and CLS (calcium lignosulfonate), the leaching efficiency was over 99%. Consequentially, copper leaching efficiency increased when chloride ions and surfactants were added in 50g/L sulfuric acid solution.
When the pressure leaching process of chalcopyrite is operated in the low and medium temperature range of 90℃~150℃, the sulfur component in chalcopyrite is converted to elemental sulfur, which suppresses the leaching of copper. In the present study, the copper leaching rate was improved by adding chloride ions and surfactants during the medium-temperature pressure leaching process at 150℃. Using the autoclave equipped with a 2L reactor made of titanium, a pressure leach tests were conducted for 180 min using 100g of chalcopyrite concentrate with D90 particle sizes of 10㎛ and 45㎛ in 5g/L and 50g/L sulfuric acid solutions. At 50g/L sulfuric acid solution without chloride ion and surfactant, when a sample with a D90 particle size of 45㎛ was used, the copper leaching efficiency after 180 min was 48%. As a result of leaching by adding 12g/L of chloride ions such as HCl, CuCl2, and NaCl, the leaching efficiencies increased to 96% and 97%, respectively, by adding HCl and CuCl2. As a result of a pressure leaching tests by adding surfactants of SLS (Sodium lignosulfonate) and CLS (calcium lignosulfonate), the leaching efficiency was over 99%. Consequentially, copper leaching efficiency increased when chloride ions and surfactants were added in 50g/L sulfuric acid solution.
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